JPS60123874U - Hollow pin for printed circuit board - Google Patents
Hollow pin for printed circuit boardInfo
- Publication number
- JPS60123874U JPS60123874U JP1983184735U JP18473583U JPS60123874U JP S60123874 U JPS60123874 U JP S60123874U JP 1983184735 U JP1983184735 U JP 1983184735U JP 18473583 U JP18473583 U JP 18473583U JP S60123874 U JPS60123874 U JP S60123874U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- hollow
- hollow pin
- circuit board
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図と第２図はプリント基板の斜視図で、コネクタを
取り外した時と取り付けた時を夫々示す。第３図は第１
図Ａ−Ａ線に沿う断面図で、本 ・案の一実施例を示す
。第４図と第５図および第６図は第１図Ａ−Ａ線に沿う
断面図で、従来例のフラックス付着時と半田付着時を夫
々示す。
１０はプリント基板、１１は絶縁性基板、１４は導電性
パタン、１２は中空ピン、１５と１６は両端開口、２０
はフラックス、２１は半田、２２は耐熱性物質、１９は
ジネクタ、２３はピンホール状の小孔を示す。FIGS. 1 and 2 are perspective views of the printed circuit board, showing the connectors removed and attached, respectively. Figure 3 is the first
This is a cross-sectional view taken along line A-A, showing an embodiment of this proposal. FIGS. 4, 5, and 6 are cross-sectional views taken along the line A--A in FIG. 1, showing the conventional example when flux is attached and when solder is attached, respectively. 10 is a printed circuit board, 11 is an insulating substrate, 14 is a conductive pattern, 12 is a hollow pin, 15 and 16 are open at both ends, 20
21 is a flux, 21 is a solder, 22 is a heat-resistant material, 19 is a genector, and 23 is a pinhole-like small hole.
Claims (1)
縁性基板に取付は孔を穿設したプリント基板に使用され
、両端に開口する中空孔を有し、一端が前記取付は孔に
挿通され前記導電性パタンに半田付けされる中空ピンに
おいて、前記中空孔内に耐熱性物質を充填し、この物質
に前記中空ピンの内部と外部空間とを連通ずるピンホー
ル状の小孔を設けたことを特徴とするプリント基板用中
空ピン。A conductive pattern is arranged on one side of an insulating substrate, and the insulating substrate has a hollow hole for mounting. In the hollow pin that is inserted into the hollow pin and soldered to the conductive pattern, the hollow hole is filled with a heat-resistant material, and a pinhole-shaped small hole is formed in the material to communicate the inside of the hollow pin with the external space. Hollow pins for printed circuit boards, characterized by the fact that they are provided with hollow pins for printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983184735U JPS60123874U (en) | 1983-11-30 | 1983-11-30 | Hollow pin for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983184735U JPS60123874U (en) | 1983-11-30 | 1983-11-30 | Hollow pin for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60123874U true JPS60123874U (en) | 1985-08-21 |
| JPH0125490Y2 JPH0125490Y2 (en) | 1989-07-31 |
Family
ID=30742220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983184735U Granted JPS60123874U (en) | 1983-11-30 | 1983-11-30 | Hollow pin for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60123874U (en) |
-
1983
- 1983-11-30 JP JP1983184735U patent/JPS60123874U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0125490Y2 (en) | 1989-07-31 |
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