JPS60121799A - Method of taping electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component for holding a plurality of electronic components having lead wires on a tape while being distributed in the length direction of the tape. The present invention relates to a taping method.

Description of Prior Art As a method of taping a plurality of electronic components having lead wires, the following methods are generally available. That is, first, prepare a tape-shaped mount, and learn how to distribute the lead wires of multiple electronic components in the length direction on this. Then, in order to fix it, apply adhesive tape to the mount. The lead wire was placed between the adhesive tape and the mount. However, such methods still have problems to be solved, or further improvements are desired.

First, the adhesive tape used to fix the glue wires of electronic components onto the backing paper is expensive. In addition, since adhesive tape is used for taping, the teaking process becomes complicated. For these reasons, there is a desire for a method that does not require the use of adhesive tapes, if possible. Additionally, when using adhesive tape, it is difficult to securely fix relatively thin lead wires of electronic components unless it has strong adhesive strength.
There is also the problem that the reliability of automatic insertion is reduced.

OBJECTS OF THE INVENTION Therefore, an object of the present invention is to provide a method for taping electronic components that can solve the problems of the prior art as described above.

SUMMARY OF THE INVENTION In this invention, a tape made of thermoplastic resin is used in place of a conventional mount. Then, the lead wire of the electronic component is heated to a temperature higher than the melting point of the thermoplastic resin, and while a part of the thermoplastic resin is melted by contact with the heated lead wire, the lead wire is attached to a tape using, for example, a roller. Pushing the lead wire into a state where at least a portion of the lead wire is embedded in the tape, and while maintaining this state, curing the thermoplastic resin around the lead wire,
This is a taping method for electronic components in which lead wires are held by tape.

Effects of the Invention According to this invention, since expensive adhesive tape is not used,
Costs can be advantageously reduced, and in the taping process, only the tape and the electronic component need to be handled, so positioning is easy and the taping process can be simplified. In addition, the heated lead wire is pushed into the tape, melting a portion of the thermoplastic resin, and simultaneously embedding the lead wire in the tape, so that the thermoplastic resin that makes up the tape and the surface of the lead wire are It has excellent adhesion and electronic components can be strongly fixed to the tape. Furthermore, if the tape made of thermoplastic resin is collected, it can be reused as a thermoplastic resin material, which is advantageous from the viewpoint of resource saving.

DESCRIPTION OF EMBODIMENTS FIG. 1 shows a part of a taping part obtained by carrying out the method of the present invention, and FIG.
It is an enlarged sectional view along -1. As shown in these drawings, the daping parts include an electronic component 1 and a tape 2.
It consists only of More specifically, the lead wires 3a and 3b of the electronic component 1 are held in a state where they are partially embedded in the tape 2. A feed hole 4 is formed in the tape 2 with an appropriate bit if necessary. In order to obtain such a taped part of SEIZO, the following steps are carried out.

FIGS. 3 to 6 are illustrative views showing an embodiment of the present invention in the order of steps.

First, as shown in FIG. 3, a tape 2 made of thermoplastic synthetic resin is prepared. It is desirable that this tape 2 has flexibility to the extent that it can be wound into a roll, for example. Then, electronic component 1 including leads 131.3b is prepared.

Next, each lead wire 3a, 3b of the electronic component 1 is heated to a temperature higher than the melting point of the thermoplastic synthetic resin of the tape 2, and placed on the tape 2 as shown in FIG.

Next, as shown in FIGS. 5 and 6, the roller 5 is shifted over the tape 2 and acts to force the lead 1138 and then the beam portion M3b into the tape 2. That is, at this time, each of the heated lead wires 3a and 3b enters into the tape 2 while melting a part of the thermoplastic synthetic resin by contacting the tape 2, and becomes embedded in the tape 2. . In FIG. 5, lead ll3a
is embedded, and FIG. 6 shows a state in which the lead wire 3b is embedded.

(15. The roller 5 is a heated lead wire 3a.

Preferably, the surrounding surface is formed of a material that absorbs as little heat as possible from 3b, such as rubber.

When the process shown in FIG. 6 is completed, this state is maintained, whereby the thermoplastic synthetic resin around the leads 1i3a and 3b is cured. As a result, the lead wires 3a and 3b are held on the tape 2 in a manner similar to @Hiragi.

” J3 is in the double process, and REIT 13a and 3b are 1
- For how much to embed in lead wire 3a
, 3b can be fixed. It may be better to embed the lead wires 3a and 3b in the tape 2 across the cross-sectional direction of the child, but the lead wires 3a and 3bO
) Even if about half of the cross section is embedded in the wire 12, the lead wires 3a and 3b may not be formed.
The lead wires 3a and 3b can be fixed to the tape 2 by the adhesive force between the metal wire and the resin forming the tape 2.

While the invention has been described in connection with the illustrated embodiment, it is not intended to be limited to such embodiment.

For example, in the process of pushing the heated lead wire into the tape, the roller 5 is used, but the invention is not limited to this.
Also, instead of pushing the lead wire into Qi 1, you may instead press the tape against the lead wire.

Also, the lead 13a of the illustrated electronic component 1.

Although the lead wire 3b has a circular cross-section, the present invention can be applied to lead wires having other cross-sectional shapes.

[Brief explanation of the drawing]

FIG. 1 is a partial plan view showing an example of a taped part that has been removed by carrying out the method of the present invention. FIG. 2 is an enlarged sectional view taken along the line "T" in FIG. 1. 3 to 6 are front views showing an embodiment of the present invention in the order of steps. In the figure, 1 is an electronic component, 2 is a tape, and 3a. 3b is a lead wire, and 5 is a roller. Patent applicant Murata Manufacturing Co., Ltd. Agent Patent attorney Kube Fukami (and 2 others) Figure 1 Figure 2 Figure 83 Figure 4 Figure 5 Figure 6 Jα 3b

Claims (1)

[Scope of Claims] A method for taping electronic components, in which a plurality of electronic components having lead wires are held on a tape while being distributed in the length direction of the tape, the method comprising thermoplastic resin. A lead wire of an electronic component is heated to a temperature higher than the melting point of the thermoplastic resin, and while a part of the thermoplastic resin is melted by contact with the heated lead wire, the lead wire is attached to the tape. A small portion of the lead wire is embedded in the tape, and while maintaining the embedded state, the thermoplastic resin around the lead wire is cured and the lead wire is embedded in the tape. A method of taping electronic components to hold them in place.