JPS60121455U - Lead wire with solder - Google Patents

Lead wire with solder

Info

Publication number
JPS60121455U
JPS60121455U JP634384U JP634384U JPS60121455U JP S60121455 U JPS60121455 U JP S60121455U JP 634384 U JP634384 U JP 634384U JP 634384 U JP634384 U JP 634384U JP S60121455 U JPS60121455 U JP S60121455U
Authority
JP
Japan
Prior art keywords
solder
lead wire
utility
model registration
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP634384U
Other languages
Japanese (ja)
Inventor
井上　元九
東吉 清水
Original Assignee
株式会社明清産業
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社明清産業 filed Critical 株式会社明清産業
Priority to JP634384U priority Critical patent/JPS60121455U/en
Publication of JPS60121455U publication Critical patent/JPS60121455U/en
Pending legal-status Critical Current

Links

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図はそれぞれ本考案の実施例・に係る
半田付きリード線を示す部分切開正面図である。 １・・・・・・リード線、２・・・・・・玉状の半田、
３・・・・・・フラックス。1 and 2 are partially cutaway front views showing soldered lead wires according to embodiments of the present invention, respectively. 1... Lead wire, 2... Ball-shaped solder,
3...Flux.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）、リード線の端部または中間部に、溶吊虫時の表
面張力により玉状になった半田が融着されていることを
特徴とする半田付きリード線。(1) A lead wire with solder, characterized in that a solder ball-shaped solder is fused to the end or middle portion of the lead wire due to the surface tension of the lead wire. （２）実用新案登録請求の範囲第１項記載の半田付きリ
ード線であって、玉状の半田は表面にフラックスが塗布
されていることを特徴とするもの。(2) A lead wire with solder according to claim 1 of the utility model registration, characterized in that the solder beads have a surface coated with flux.
JP634384U 1984-01-23 1984-01-23 Lead wire with solder Pending JPS60121455U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP634384U JPS60121455U (en) 1984-01-23 1984-01-23 Lead wire with solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP634384U JPS60121455U (en) 1984-01-23 1984-01-23 Lead wire with solder

Publications (1)

Publication Number Publication Date
JPS60121455U true JPS60121455U (en) 1985-08-16

Family

ID=30483697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP634384U Pending JPS60121455U (en) 1984-01-23 1984-01-23 Lead wire with solder

Country Status (1)

Country Link
JP (1) JPS60121455U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5447331A (en) * 1977-09-22 1979-04-13 Kayashima Seisakushiyo Yuugen Method of fixing false frame of riser concrete in case of construction of fabric foundation and instrument used for said method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5447331A (en) * 1977-09-22 1979-04-13 Kayashima Seisakushiyo Yuugen Method of fixing false frame of riser concrete in case of construction of fabric foundation and instrument used for said method

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