JPS60120355A - Method and apparatus for forming high resolution phototransparent image using photosensitive resin - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Technical Field) The present invention relates to an optical image processing method and apparatus for producing a high-resolution image from a photosensitive resin onto a substrate such as a printed wiring board. This invention relates to a technique for producing improved low energy, high resolution photopolymer images using resin runners and photoimageable tools.

BACKGROUND OF THE INVENTION Images are fabricated on substrates using photosensitive resins, such as ultraviolet (OV) curable photosensitive resins of pasty consistency. These photopolymer resins, known as negative-acting, are 100% compositions of reactive resins that convert from a soluble wet film of pasty consistency to an insoluble dry coating by several seconds of exposure to an intense UV light source. characterized by something. Furthermore, the photosensitive resins used in the methods of the present disclosure are characterized as being imageable or selectively curable by light passing through a light imaging tool master with a light image pattern. This results in 78 images - 6O
-120355(6) A master produces an insoluble film pattern that is vertically and firmly adhered to the substrate at the portion where the photosensitive resin is exposed to UV light. These photosensitive resins are used, for example, in printed wiring boards (PW
B) Commercially available as metskiresists and etch resists for manufacturing and imaging. These resins are conventionally applied by screen printing through an imaged screen stencil to form an image on a substrate such as a wet photopolymer, and this image is then cured by exposure to a powerful UV light source to make it permanent. converted into an image.

Positive-working dry film photopolymer resins are insoluble until converted to a soluble state by radiation through the transparent portions of the phototool image pattern.

Prior art screen printed photopolymer images are
It is characterized by high energy consumption, heated substrates, blurred borders, loss of fidelity, blurred images and the need for parallel illumination.

The images that can be achieved using the method and apparatus of the present disclosure which solves the above problems and the same photopolymer as the prior art (page 21) are sharp and clear even with negative photopolymer. Border, 0.002 inch (0.05 wa)
It is characterized by excellent fidelity and unsmearing at film thicknesses up to. For example, screen printed PWB resist IQ turns are practically as low as 0.010.
inch (0,254 m ) conductor and spacing, while the same photopolymer is 0.0 mm in accordance with the present disclosure.
0025 iachi (0,006 tram) (D 7
Illum thickness is 0.003 inches (0,076 wrm
) line width and spacing can be formed and imaged. Screen printed halftone images are limited to a practical upper limit of 105 lines with a dot size of 80 percent. The same photopolymer imaged as described herein can produce 150 line halftone images with dot sizes from 5 to 95...ξ-cents.

An example of the prior art for manufacturing photopolymer printed boards used in phototransparent imaging is US Pat. No. 4,070,110, which makes photopolymer relief printed boards in a semi-automated manner. Thus, a sandwich arrangement (page 22) is prepared by laminating the cover film and backing the sheet with an intermediate photosensitive resin applied in liquid form and then partially exposed and cured. After the sand inch is fully formed, it is flattened under pressure while being exposed to light through a phototransparent material. A complex mechanical arrangement for similar laminating and finishing methods is described in U.S. Pat. No. 4,087,
182 is also shown. These are U.S. Patent 4.05
2.603, as opposed to optical imaging methods such as those described in 2.603. Also, U.S. Patent No. 3,837
．． 887 provides a sandwich type printed board for liquid photosensitive resin. All of these required complex and expensive machinery and could not provide the simple, single step lamination and exposure scanning possible with the present invention.

All prior art also uses a relatively thick release film L- in contact with both the liquid photopolymer to be irradiated and the dry photopolymer surface, and thus this layer contains the phototransparency (or other material) to be regenerated. ) is inserted between the image and the photosensitive resin surface to substantially (page 23) reduce the amount of light emitted.

Another problem not presented or solved in the prior art is the use of reusable light-transparent imaged surfaces in contact with the photopolymer surface to prevent contamination and abrasion of the photopolymer surface. It is. For example, relatively thick polypropylene release films are inserted in the prior art. Phototools that come into contact with the photopolymer layer have a very short reusable life due to scratching, abrasion, and accumulation of hardened photopolymer and the like.

In my U.S. Pat. No. 4,260,675, a liquid photopolymer is used in the manufacture of a printed circuit board solder mask in which the accumulated relief resistant turn physically displaces the liquid photopolymer. The photopolymer is then exposed to radiation through the intervening air to cure the photopolymer, leaving uncured photopolymer at the locations where the solder is to adhere to the circuit board conductors.

Glass phototool assemblies experience temperature increases with repeated use. This is a solder mask photosensitive resin with a thickness on the order of 0.005 inches.
0355(7), and an energy density of 6 joules per square centimeter is required to cure the paste laminate. Photoresist is largely air-suppressed, even if a vacuum of inches of mercury is used.

Temperatures typically rise to 200 degrees Fahrenheit.

Another application of photo-R-turning of liquid photosensitive resins is by W. R1GRACE, Inc.
It is implemented in the RACBj system. The photolithographic pattern is formed on the PWB by non-contact exposure using a collimated light source. A non-contact separation distance on the order of 0.00 inches avoids the problems caused by contacting the phototool with the liquid resist, but at the cost of resolution as even collimated light sources exhibit light undercuts.

This also increases curing time by allowing air and oxygen to contact the photopolymer surface and increasing energy consumption and temperature rise.

Avoiding the effects of oxygen suppression on photocurable resins (No. 25)
Known techniques include coating the photosensitive resin surface with nitrogen or a neutral gas. UNION CARB's L Engineering ND Fi div 1θion manufactures UVIJ actors in which the air in the exposure volume is replaced with nitrogen, which significantly increases lighting power while maintaining cure speed and cured film thickness. This results in a decreased ability to be described in the literature.

However, the use of nitrogen is expensive and losses must be constantly replenished.

Another known air exclusion method is to laminate the entire photopolymer coated substrate with a clear plastic film. This method is not easily applicable to solder mask imaging on printed wiring boards for several reasons. 1st
Due to the rough surface topography caused by the raised printed wiring conductors, air entrapment and liquid photopolymer will not be able to extrude from the upper surface of the conductor to narrow areas of non-uniform photopolymer thickness. It becomes difficult to laminate the entire thin plastic sheet that forms the .

Additionally, liquid-soft photopolymer resins may thin or penetrate into eyelets on circuit features or cause spots on contact with non-wet surfaces that can be peeled away from the resin (page 26). In many cases, it could not be used because it was partly sticky and formed a bulge.

The general purpose of the present invention is to simplify and improve upon prior art apparatus and methods for the manufacture of high resolution print elements using photopolymer resins.

Another object of the present invention is to solve numerous problems of the prior art, including those briefly discussed above.

At the prior art level of photosensitive resin printing technology, softening,
Heating and cooling photosensitive resins between various steps such as adhesion and development requires considerable time and expense.

These problems can be addressed by reducing the exposure time to reduce the heat and energy required to exclude air from the photopolymer surface during exposure, and by further simplifying the method to include fewer steps, film layers, etc. , solved by the present invention. A powerful parallel radiation source was required for exposure of photopolymer resins.

Selection of photosensitive resin film in various light treatment processes (No. 27)
Page) Selective adhesion and non-adhesion have been difficult problems. for example,
Heating is necessary for the dry film to properly adhere to the substrate without any bubbles or the like.

The present invention can solve this adhesion problem by spreading a liquid photosensitive resin of pasty consistency onto the substrate surface. Also, when dry film hardeners are used, they are difficult to remove during the development stage. When a photocycle is used to cure the liquid resin, the unexposed liquid can be easily washed out from the brush and the eye holes, and the development process is simplified.

Also, the solvent is less prone to undercutting the exposed resin which reduces sharpness. Thinner liquid photopolymer films lower resin cost and provide better resolution.

Another objective is to use less expensive equipment, equipment and photopolymer materials that significantly reduce the total thickness cost of imaging through the use of less expensive photopolymer materials and by increasing human productivity. .

The present disclosure is based on the patent application published by ShoG
O-120355(8) Methods for improving wet photopolymer coated strips are also taught.

One purpose is to connect a photopolymer-coated phototool with a substrate so as to exclude air from the photopolymer.

Another purpose is to speed up the normal exposure cycle of dry film photoresists, which consists of a vacuum drop during exposure.

Another object is to provide a method for coating non-wetting surfaces in such a way that the photopolymer used does not develop spots or voids.

The present invention therefore has as a general object a simplification and improvement of prior art apparatus and methods for producing high resolution print elements using liquid photopolymer resins, and for producing high resolution images. The objective is clearly to provide specialized optical transsection body imaging tools and techniques that are particularly suited.

DISCLOSURE OF THE INVENTION A negative-working photopolymer is applied as a wet l- and exposed to light passing through a specially shaped (page 29) optical transparency in direct contact with the photopolymer surface. By doing so, it is converted into a polymerized and hardened image state. Significant improvements in image resolution over known imaging processes are thus achieved.

Excluding air from the liquid photopolymer during the exposure process by sandwiching the resin between two layers (one of which has a light-transparent image) reduces exposure time, reduces energy, and speeds up production. increases, temperature decreases, and resolution improves.

With the prepared equipment, one section of the PWB, photopolymer and phototool is scanned and articulated into a sandwich-like arrangement with a gas (bubbles) free photopolymer surface. In the meantime, the already articulated parts are illuminated and exposed, so that articulation and exposure are achieved in a single scan.

The method includes the steps of preparing a phototool (or photomask) that depicts the image to be reproduced and has a clear area of non-adhesive material on the surface facing the substrate, coaching the phototool with a thin layer of photosensitive resin ink, non-adhesive Partial coating of photopolymer to prevent day-wetting on the phototool area (page 30), placement of the phototool on top of and not in contact with the substrate to be imaged, elasticity across the top of the phototool The method consists of connecting the phototool with the substrate using a flexible blade downward to exclude all air, and selectively exposing the photosensitive resin through the phototool with a tubular mercury lamp passing through the phototool just behind the resilient blade. Thus, with one pass, 1 per 2 seconds
Images are produced at a scanning speed of (0,3M).

Following exposure, the substrate is scraped from the phototool and then subjected to a solvent spray that removes the uncured photopolymer and firmly fixes the desired image to the substrate.

The above method and disclosed apparatus can produce images of excellent resolution using many available photopolymer resins, commonly described as UV curable photopolymer resins. These photosensitive resins are currently applied in screen printing, and are cured by UV irradiation for image printed wiring boards, printed meter display boards, name tags, and screen printed four-color images. Images produced when these photopolymer resins are processed in accordance with the present disclosure (page 31) faithfully reproduce phototool detail and are as small as 3 inches (0,0
76fl ) width and separation. Furthermore, it is possible to faithfully reproduce an image consisting of 150 lines and 5% to 95% halftone doratono-resistance.

By bringing a light-transparent image into direct contact with a liquid photopolymer surface, the method and apparatus of the present invention can be applied from 0.25 inches (0,006 wx ) of henchmen to 2 inches (0,05
Film thicknesses between m) and above can be used to provide images with improved resolution. However, if such types of transparent images are to be reused, resolution may be lost due to noise accumulation in the form of scratches or unremoved or partially cured photopolymer. Thus,
Phototools made of transparent image reproducing light can improve resolution,
It is specially treated in this invention to provide a longer life and synergistic relationship with the liquid photopolymer layer.

In particular, the present invention relates to the formation of images on photosensitive resin release surface contact films such as polypropylene, published in Japanese Patent Publication No.
20355(9) for repeated peeling and reuse of imaged phototools from non-light and cured drainable resin surfaces without reducing resolution capability due to scratches, image damage, or build-up of cured photopolymer. I can do it. To make the phototool with the imaged surface scratch resistant, it is impregnated into the polypropylene release film as a yellow colorant that reduces heat compared to the normal photoimaged pattern. Thin aluminium photopattern images also reduce heat generation in the phototool.

A liquid is brought into thermal contact with the hardening surface and the phototool as a coolant for heat dissipation. In one embodiment, the liquid also acts as an air and air bubble exclusion layer on the surface of the photopolymer layer.

Thus, photoresist coatings are produced on substrates by dipping the coated PWB and phototool in a liquid phase that does not affect the solubility of the photosensitive resin, preferably an aqueous solution, and exposing the photoresist while in the liquid phase. applied to PWB with high speed and high precision.

(Page 33) Conventional glass plate phototransparencies are prepared with opaque areas corresponding to PWB areas that should not receive photocured resist.

A UV curing device simply consists of a shuttle conveyor carrying a tray containing water, and the photopolymer coating, such as PWB, is conveyed under the water and past a UV lamp. PWB
is uniformly coated with a known photosensitive resin composition. Coating is accomplished by screen printing using a blank screen or a screen without a stencil to place the photopolymer over the entire surface of the PWB, including the terminals. Place the coated PWB in a tray of water and immediately displace all air from the photopolymer surface.

No significant chemical reaction occurs between the water and the liquid photopolymer.

A glass plate optical transparency is then placed in alignment with and in contact with the top of the plate and moved past a tubular mercury lamp at a speed on the order of 15 feet per minute to cure the illuminated area. Remove the assembly, separate the phototool from the PWB, and then subject the PWB to a solvent spray tower to wash out the unexposed photosensitive resin (page 34).

The disclosed method is also useful for curing photosensitive resins, particularly on temperature sensitive fragile substrates such as polyester films, which are coated and then cured by exposure to UV light.

The disclosed method is suitable for photoimaging plating and etch resists and solder masks on printed wiring boards.

A preferred embodiment laminates two thin layers of photopolymer onto the irregular surface of a printed wiring board having circuit features and through holes. Thus, a first layer of liquid negative-working resin is placed on the board surface, a second layer of liquid photosensitive resin is placed on the screen on top of the first layer, and a layer of liquid photosensitive resin is placed on the screen on top of the first layer, and then partially laminated before total lamination. harden. Particular advantages are sometimes achieved when the 21M is a positive working dry film photopolymer.

An improved method for tenting through-holes in a printed wiring board using a liquid photosensitive 1M oil layer includes laminating onto the wiring board to overlay the holes (page 35). provided by placing a liquid layer on. The liquid photopolymer can also be partially polymerized prior to lamination, such as by irradiation in air.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Computer grade PWBs have conductor lines and spacing on the order of 0.010 inch wide (0.025 cm) with sharply defined edges and are free of scratches and bulges. Typically manufactured in flannel form. Additionally, the imaged resist forming the conductor must maintain a constant thickness compatible with the plating or etching chemicals, temperatures and soak times.

Too thin a resist results in breakage and metal plating in undesired locations.

The UV-curable photopolymer used in PWB manufacturing is applied by screen printing onto a copper surface and cured by a 200-watt mercury knife moving at a speed of 12 feet per minute. has been done. Since the substrate receives approximately 200 watts/second of energy per square inch area, the surface temperature is quite high.
5 (10) rise. Surface temperatures in excess of 300 degrees Fahrenheit are typically seen. The energy requirement of 200 watts per square inch (6.45 cm@2) mentioned above is for a photopolymer resin with its surface exposed to air. However, most photopolymer resins tested reduce exposure energy to only 50 watts per square inch (6.45 square centimeters) when air is completely excluded by the articulation method described in this invention. affected by air to the extent that it can be

The phototool as used in the present invention is a transparent sheet with an irradiated opaque area corresponding to the image to be reproduced, and the phototool is exposed to a UV lamp and exposed to light in order to control the surface area of the photosensitive resin to be cured. between the plastic surface and the plastic surface. The J+3 candies of light images, photomasks, and phototools can be used interchangeably.

Although prior art images coated PWBs without contacting the phototool, they require expensive collimated light sources, i.e., other light sources may undercut the light and reduce line width and line fidelity (page 37). This method is not cost effective as it results in losses.

In order to achieve sharp line imaging even when using a non-collimated light source, it is necessary that the image-bearing surface of the phototool be adjacent to the surface of the photosensitive resin layer, as developed herein.

FIG. 1 shows a cross section of a phototool 4 connected to a PWB substrate 1 and a surface 3 of a photosensitive resin layer.

The PWB 1 is preliminarily coated with a photosensitive resin layer 3. The phototool 4 has an opaque region 7 aligned with the drill hole 47 in the PWB 1 and is located above the PWB 1 and its conductor layer 52 without contact.

Assembly 6, moving in the direction of arrow 46, has an interdurometer rubber blade which passes over the upper surface of phototool 4. Phototool 4 Up direction 8
The force F1 brings the phototool into contact with the photosensitive resin, and the force FQ moving in nine directions causes the blade 10 to pass over the phototool and bidirectionally connect the phototool with the photosensitive resin. This technique eliminates air bubbles that may be trapped during the coating cycle from the photopolymer, and also saves energy and reduces processing time by eliminating air contacting the photopolymer surface (page 38) 3.

This articulation technique has some highly desirable tF#e that is not easily obtained otherwise. First, the photopolymer surface may be mottled or have an orange beer effect when coated.

These surface irregularities are smoothed out and the articulating surface conforms to the smooth plastic surface topology of substrates such as Phototool 4 as well as pw:s 1. In the case of PWB, the substrate has a surface of Copper 1@52 which may be compatible with the contour of the phototool 4, for example. The exposed photopolymer is shown in FIG. 1 at cross-hatched areas of the photopolymer in which a surface coating device 10, preferably a rubber blade, is in surface-to-surface contact for pre-scanning across the surface of the phototool 4. 2.

Phototool 4 connected to photosensitive resin 3 (in the cross-hatched area)
0 surface area, strong holding force is achieved by phototool and PW.
It is maintained between the B surface and the B surface. Therefore, atmospheric pressure 11 (first
Figure) allows a phototool to be intimately coupled with a photopolymer surface indefinitely without an external vacuum source. (Page 39) The opaque part 7 of the photo tool (preferably the surface is not irregular) is in close contact with the photosensitive resin surface 3, and the photosensitive resin can be exposed with a non-parallel light source 14 etc. The image can be reproduced in various resolutions on a PWB photosensitive resin and used as a mesh resist layer.

FIG. 2 shows a preferred method of curing photosensitive resin 3. FIG.

For this purpose, the UV lamp 14 and the condensing reflector 13 are mounted on an assembly 21 of the same movable passage as the blade 10. After the blade connects the phototool with the photopolymer, the light beam 12 exposes and polymerizes the photopolymer layer 2 directly below the phototool transparency. Ray 12 is blade 10
The transparent portion in front of the lens cannot be exposed to light.

FIG. 2 shows a liquid coolant supply system. The reservoir 15 supplies a coolant 17 to the sponge 16 and then to the phototool 4 in the form of a film shown as droplets in thermal contact with the phototool 4 and the photopolymer 3 .

When the assembly 21 is lowered so as to come into contact with the phototool 4, the rotary shutter 19 automatically
O-120355(11) Closed. The light shroud contacts the phototool 4 and slides upwards over the condensing reflector 13, driving a rotating shutter 19 which opens to expose the continuous photopolymer. The arrow 53 moves from rest to operating state, and then the photosensitive resin 1i
3 shows the reciprocating movement of the passage assembly back to the position away from 3.

FIG. 2 shows three distinct divisions or states of photopolymer. The photosensitive resin 2 under the lamp 14 is polymerized as shown by the cross-hatched lines, while the photosensitive resin 2 on the sponge 161 is under vacuum but not yet exposed as shown by the hatched lines. The photosensitive resin 3 has not yet come into contact with the phototool 4, and is therefore in a state of atmospheric pressure where it is in contact with air, as shown at the point. This gradual exposure method is an advance in the art of manufacturing printed circuit boards using photopolymer resins, since the present method requires several seconds to lower the entire phototool before exposure.

A preferred liquid photopolymer is manufactured by Mg.T Chemical Compa, Rahway, New Chassis.
This is a UV curable photosensitive resin manufactured by NY Te, product number 1075 (page 41). This is a negative-working resin that hardens in the exposed areas and remains liquid in the unexposed areas marked with an opaque image.

The unexposed liquid photopolymer is washed out with a 50 qb solution of inpropyl alcohol and trichloroethane.

These photoresists also have a thickness of one to two tenths of an inch (0.
,025wm ~ 0.05mm) thickness, each light has a density of 2
00 watts and a conveyor speed of 12 feet per minute. In the disclosed apparatus, the phototool is positioned between the light and the PWB, and the phototool is subjected to temperatures ranging up to 300 degrees Fahrenheit. Phototool temperature uses different light sources and exposure time is 40
It can be increased to the order of seconds and reduced to below 1009 F. One embodiment uses a polyester sheet as the phototool sheet 4 with a high temperature silicone rubber release layer on top of the opaque portion 7 . This prevents the phototool from adhering to the cured image and does not damage the surface of the image that came into direct contact with the liquid photopolymer layer during exposure (page 42), which would prevent it from being reused many times. Since the silicon layer is very thin, it does not severely limit the resolution that can be obtained.

The substrate cooling technology consists of
Forced ventilation with cold nitrogen at 0.5°F. This cooling technology is expensive;
It's a waste of energy.

If you squirt water onto a printed circuit board to prevent overheating, you run the risk of the water hitting the hot lamp surface, causing catastrophic damage.

The present disclosure teaches a method of introducing a liquid coolant into thermal contact with a heated phototool surface and a photopolymer layer.

This is done at the end of the articulated blade 10 in FIG.

Apply a 50 part water-alcohol solution across the width of the phototool with a sponge.

Although a number of liquids can be used, it is necessary to completely wet the phototool and prevent beading of the coolant. Although the coolant evaporates and absorbs heat from the phototool, it does not significantly reduce the transmission of UV light energy. The alcohol-water solution maintains the phototool temperature at or below 200 degrees Fahrenheit.

(Page 43) As shown in FIG. 2, the reservoir 15 contains a cooling solution, which is supplied to the phototool 4 by means of a sponge 16. When using two consecutive lights, the coolant film, shown as droplets 18, partially evaporates in the first light 14 and remains at reduced t to provide phototool cooling as it passes under the second UV light. bring.

In the embodiment of FIG. 7, the entire PWB 33 and top coated photopolymer layer 32 are placed under a coolant liquid 43 that does not alter the solubility of the photopolymer, such as water.

The coated printed wiring board 33 is thus placed in a tray 42 containing an aqueous solution, approximately 1 cm deep. By placing the circuit board section in water, all air is immediately expelled from the surface of the photopolymer layer 32, as well as from small bumps in the photopolymer coating, through-holes, and notches. Place the glass plate phototool 3o in the water, align it with the top of the PWB, and
lower onto the surface. In this position, the emulsion 31 of Phototool I is in close contact with the wet photosensitive resin 32 on the circuit board JP-A-120355 (12) figure, while elsewhere on the glass surface it is in close contact with the wet photosensitive resin 32 covering the base laminate. Approximately 0.004 inch (0.01 crn) from the photosensitive resin
I can stay away. The base laminate covers the metal conductor back and circuit holes 35. The photosensitive resin layer 32 uniformly covers the upper surface of the base laminate 33 and the metal conductor board. The phototool addition having the opaque emulsion portion 31 is
An emulsion 31 manufactured by Phototool Co., Ltd. is placed on the PWB so as to be in contact with the photosensitive resin layer 32. Water 43 is applied to the photosensitive resin surface and the phototool (9) so as to displace all the air.
) fills the volume between the bottom edge of the

With a tubular mercury lamp and condensing reflector device 41, UV light passes through the water layers at the top and bottom of the phototool and onto the photopolymer 32. The tray 42 moves relatively in the direction of the gloss to convey the entire photosensitive resin 32.

After exposure, the phototool and PWB 33 are removed from the tray and separated. All of the cured photoresin and unexposed photoresist remain on the PWB 33 and none adhere to the phototool.

(Page 46) Solder mask coating is completed by spraying a solvent onto the PWB 33 to wash out the uncured photopolymer.

A suitable solvent is a mixture of 85 parts by volume trichloroethane and 15 parts by volume isopropyl alcohol. A suitable atomizer for developing uncured photopolymer is DIIFONT's [AJ P
It is ROCII488OR.

To date, the method has prepared the solder mask layer by separating the cured photopolymer from layer 32 on the surface of pWB 33. Initial imaging involves photopatterning of a resist, either a peg resist or an etch resist, to form a substrate conductor pattern on the pace laminate. The disclosed method is equally advantageous for initial imaging. The equipment and method are the same as detailed above for the soldering process, except for the photopolymer. M & TCHBM Engineering CAL Engineering IC located in Rahway, New Chassis
TYPFi Cuff 110J, manufactured by , is a preferred photoresist for use as both a plating and etch resist for initial imaging.

(Page 46) The composition of aqueous solution 43 can vary depending on the particular photoresist used and the desired result. As previously mentioned, it is important that all of the photoresist remains on the printed wiring board and that the optical transparency is free of either hardened or liquid photoresist. r3H
In r,,vJ type solder mask photosensitive resins, adding a liquid detergent to the aqueous solution prevents offset, and the optically transparent body does not have photoresist. The mixing ratio is on the order of one ounce of cleaning agent per gallon of water.

The photospeed of the photoresist is improved beyond that obtained by simply displacing oxygen from the surface of the photosensitive resin. Additionally, it has been observed that adding a small amount of acetic acid to an aqueous solution increases photospeed over that achieved with water alone.

The lightless device of FIG. 4 has a UV light 41 and includes a conveyor belt 36 for moving an article such as a PWB 33 with an uppermost photopolymer surface placed in a fixing device 42 under light. r conveyor pel) 36. Clearly, the invention teaches that no container 42 with water therein is required to place the photopolymer under a liquid solution during exposure according to the method taught by the present invention (p. 47); It's simplified.

When using a transport type UV-curing device 37 as an exposure source, 2
There are two advantages. First, manufacturing speeds can be further increased since many different types of images can be exposed in succession without changing the UV curing equipment. This allows PW
B is brazed with a photopolymer in a tray 42, and in use provides a great deal of manufacturing capability to connect the phototool and expose with a single high speed curing device.

A second feature of using UV curing equipment is that extremely long substrates can be articulated and exposed, and oversized chambers are not required.

To make the phototool, a clear polyester sheet and a thin sheet of aluminum foil are laminated together using clear silicone shim adhesive #1 to securely bond them together. Foil reduces its meanness by 0.0001 inch (0.0001 inch)
,0025m).
120355(13), pre-etched with caustic soda.

The foil is then coated with an image etch resist, exposed, washed out, and then etched again to produce a phototool image in the etched foil.

Etched aluminum foil is preferred over other waxy emulsion systems because the wide black emulsion areas absorb a large amount of heat that distorts the phototool, while the aluminum surface reflects the heat and reduces the total amount absorbed.

For use in the present invention, a phototool with bonded foils is stretched into the phototool frame of FIG. 3, coated, and inserted into the apparatus of FIG. 4. Accurate alignment between the phototool/four-turn and the substrate being imaged during fabrication is achieved by aligning the fabrication substrate with a method such as the use of alignment pins and board mounting plates.
This is achieved by placing it on top. The main illustration is then placed in the frame on top of the board in precise alignment. Align and fix the mounting plate to the phototool frame as shown in Figure 3 using hinges. A resilient blade 10 is drawn (page 49) across the polyester sheet 4 preimaged from the illustration master and the photopolymer assisted polyester sheet to transfer the illustration in the form of the foil surface 7 thereto.

Phototool 4 of flexible polyester sheet is Dow C
The foil surface was tested using Orning's Product No. 734 RTV silicone rubber adhesive. This serves two important functions. First, the resilient rubber can interact with small dirty particles on the PWB surface. During the articulation cycle, irregularities on the PWB surface cause separation between the phototool and the PWB surface, and this separation causes the image to blur over an even larger area than the irregularities on the PWB itself. The silicone rubber, which is resilient, conforms to irregularities and reduces ruined areas. Second, the silicone rubber adhesive forms a non-stick surface on the phototool to which the cured photopolymer will not adhere.

So far in this disclosure, we have described the use of flexible phototools. Phototools do not need to be flexible in all cases. For example, when imaging flexible printed circuits, the phototool can be a glass plate and the flexible substrate is articulated with the phototool by drawing a blade across the flexible substrate. Thus, the arrangement of FIG. 3 simply swaps the substrate and phototool. It is then necessary to cause light scanning to occur on the opposite side.

Figure 3 shows an aligned phototool and PWB for use when precise alignment is required, when a portable UV curing device is used as the exposure source, or when a pre-aligned fixture is required. A fixation device for non-contact application is shown.

At fixture 42, the PWBI is mounted onto substrate n and aligned by pins. The phototool 4 is mounted on a frame U that maintains the phototool in alignment with the perforated PWB 1. The hinges allow the PWB to be raised and lowered for placement and removal. The space protrusion maintains contact between the phototool 4 and the upper surface of the PWB 1.

In FIG. 3, the mounting board 22 has a gold-brown strip 48 fixed to its lower side.
Its purpose is to transport the exposure assembly in the 49 direction (page 51) through the sensors that contribute to the operation of the lowering mechanism at the control center 51 for position determination of the connecting blade 10. It is the generation of an electrical signal.

Similar electrical signals at 52 alternately raise the articulating blades. Thus, the contact between the phototool and the blade 10 at the leading edge of the image section is automated. A signal at sensor 52 also automatically raises the blade at the end of the image section pull stroke.

The following chart shows the manufacturing process of the present invention when hole tenting is not required.

a. Manufacture the phototool and attach it to the 6 fixtures.

b. Cover the perforated PWB or phototool with a paste-like photosensitive resin.

a. Align and install the PWB on the fixture.

d. PWB the phototool to form a sandwich
Concatenate with.

θ, exposing the PWB to UV light through a phototool.

f. Separate the phototool from the PWB, leaving the cured photosensitive resin on the PWB.

g. Wash out the unexposed pasty photosensitive resin on the PWB and harden if desired.

JP-A-120355(14) h. Wipe the phototool to remove any photosensitive resin that adheres to the phototool and start the cycle again.

During the PWB process, the plating bath requirements (temperature, immersion time,
the desired thickness as determined by the plating current density and chemical composition) and the plating thickness to be deposited, typically from 0.5 to 2 inches (0.013 to 0.051
screen print and cover. The photopolymer thickness is primarily controlled by the screen fabric thickness and the percentage of weave coarseness. For example, 1
A 56 mesh polyester fabric coats the PWB to a thickness of approximately 1 mil, and a 230 mesh fabric deposits a 0.3 mil (0,076 mm) thick coating. The phototool is kept out of contact, but properly positioned over the nine PWBs, covered by the fixation device, as shown in FIG. Non-contact distance is 0.06 for a 12 x 18 inch (0.3 x O, 46 m) PWB
It is on the order of 0 inch (0.15 cIn). Covering P
Connect the tool with the coating FW'B by pressing the blade against one end of the WB and pulling it across the length of the PWB, at a rate of 2 per inch (2,54 crn) of blade length. Pound (0,9 Yu)
Use the downward force of

Washing out the unexposed photosensitive resin in step f is accomplished using a solution spray tower of, for example, trichloroethane, lasting from 10 seconds to the sidewall.

The step of wiping the underside of the phototool is required to remove unexposed photoresist remaining on the phototool after removing the exposed PWB. If you leave it on the photo tool,
The subsequent image may be corrupted by the presence of trapped air. Typically, it is necessary to wipe the phototool after every second or third exposure cycle, depending on the photopolymer coating thickness on the PWB. Wipe 1
．． This is accomplished using a rubber roller to remove the e-turns and more evenly distribute the remaining photopolymer.

The main difference in the hole tenting method is the process, when selected holes are to be tented with a photoimage resist, in which the phototool rather than the PWB (page 54) is coated.

Another difference is that the process of coating the phototool removes any remaining photopolymer/turn resistance.
There is no need to wipe the phototool during tenting.

As previously described, the phototool has a thin layer of clear silicon shim on the underside. Screen printing (or other means) onto photopolymer coach infrasilicone rubber
When applied, photopolymer resins develop "spots" or cracks that increase in area over time. This is caused by the wet photopolymer's lack of silicone rubber acquisition ability, and the surface tension of the photopolymer causes it to form beads similar to the beading of water on a waxed surface.

To prevent the formation of spots or cracks, the apparatus of the present disclosure blinds or flashes the photopolymer through a phototool as the coating is applied. This flashing step is strong enough to slightly polymerize the photopolymer on the top of the clear section of the phototool (page 55), but not strong enough to harden the exterior surface.

There is no need to flash the photosensitive resin above the opaque part of the phototool.

Although this flashing step appears to be critical in terms of lamp intensity and exposure time, this is not actually the case. The photopolymer shown in this invention disclosure and all photopolymer tested are air inhibiting, which means that the photopolymer can absorb air with less UV energy than is required in the presence of air. Means to cure in the absence of it. Thus, when a phototool is coated with photopolymer by screen printing, only the thin lines of photopolymer are immediately deaerated under squeezing, as the screen fabric is not in contact, and the lines under squeezing are cleansed. Only contact the phototool. The previously laminated photopolymer, when exposed to light, maintains a wet surface that adheres well to the substrate to be printed.

This flash technique is an important aspect of hole tenting in PWB resist painting. In other words, if there is no flash, the photosensitive resin will be thin at the edge of the hole, so it will be washed out.
0355 (15) and tend to break down during immersion in the plating solution, the flash ensures a thicker film on the tented tag than would be obtained without flash irradiation.

This flash step produces a polymerized image that is hardened on the sides of the phototool but wet on the outside, so that the next step in interfacing the phototool with the substrate is considered to be an image transfer technique.

A UV curing device can be used for image production according to the present disclosure with the addition of an articulated blade assembly and a phototool coolant supply device as shown in FIG.
A conveyor bell (as shown) 36 conveys a phototool assembly 42 below the blade 10.

The blade 10 is pulled downwardly in the vacuum cylinder 40 while the leading end of the gold maple strip on the bottom of the phototool assembly 42 begins to bridge the electrical contacts attached to the bottom of the conveyor bell (36). The conveyor belt on most UV curing equipment is made of fiberglass mesh wrapped in heat-resistant plastic, with filaments of electrical contact passing through the mesh to control elongation (page 57). is possible. This action allows precise control of the blade and prevents the blade from striking the leading or pulling edge of the phototool. blade 10
Also installed therein is a reservoir 15 which contains a phototool coolant which is supplied to a sponge not shown in FIG.

The advantages of the method brought about by the present invention are numerous, and the characteristics of the material result in lower raw material cost, shorter time, lower energy cost, lower temperature and lower sensitivity of the light source resulting in higher resolution of the light. Synergistically related to imaging methods.

For example, wet resin type []V curing reregistration is mainly used in screen printing technology for printing photocurable images (Me).The main feature of these resists is that they can be exposed to light through a phototransparent material to produce high-resolution images. Found in invention.

Photoimaging provides a faster manufacturing method since air in contact with the pasty resin surface has been found to inhibit photocuring. Thus, by covering the surface with a light image transparency, the energy density for photocuring is reduced by 50% from the energy density required for the air-exposed surface.
/R-cents.

This effect is most important because of the thermal shadow on the optical transparency. The effect on copper-clad printed wiring boards is also important.

The energy reduction then also makes the final product more reliable and prevents distortions that affect resolution. For example, when exposed to a tubular mercury lamp for photoimaging, a photocured PWB will rise to a temperature of 75 to 25σF. The lower the energy, the shorter the exposure time.

More significant time is saved in development, and compared to hard photosensitive resins, soft unexposed pasty resins can be washed out in 10 seconds during the development process. Hard resins require a minute or more and resolution is also affected.

The hardness-to-softness ratio of exposed vs. unexposed resin is much higher for the original resin than for the dry film resin.

This is due in part to the 0.001 (5th
The line width of the dry film is 0.005 inches (0,013 cm) compared to the line width of 0.005 inches (0,0025 c1n).

The advantages of using non-collimated light with a pasty resin in direct contact with the optical transparency have been explained above.

Resolution increases with thinner layers, as does development time, heat, etc. Dry film resin is 0.0007
5 to 0.0015 inch (0,0019 to 0.0038
Paste photopolymer resins are available in a few selections between 0.0002 and 0.002 inches (1M)
It can be screen printed to any thickness between 0.0005 and 0.005 cm).

Other processing steps required in dry film photoimaging include:
It can be completely removed, saving significant time and energy.

Thus, the dry film requires heat and pressure to cure at 200''F. It must then be held for 15 minutes before stabilizing exposure.

Furthermore, since exposure heats the film, it must be cooled and maintained at ambient temperature for about 15 minutes before development.

Otherwise, clear development cannot be achieved. With pasty resins, coating, exposure and development proceed within 1 minute without any waiting time.

Special phototools used for the production of high-resolution optical images using photopolymers are manufactured by directly bonding the photoimageable surface of an imaged transparency with the surface of a liquid photopolymer. This creates special conditions and requirements that were not necessary until now, especially when it is desired to use the phototool repeatedly in Tendo production.

Therefore, the surface in contact with the liquid photopolymer must be moist to prevent beading or air bubbles, which prevents adhesion to the cured photopolymer image that hardens on the imaged interface of the phototool. The requirements are not consistent with the removal of all cured material from the phototool and the absence of interference of residual liquid photopolymer on the phototool surface after peeling from the developed image. Therefore, the present invention provides a very thin plastic film of the group consisting of polyethylene and polypropylene.
Page 1) Dyeing in the shim provides a phototool with an imaged surface that meets the above requirements.

This process takes advantage of the porosity of the film and exposes the image pattern through the stencil obstructions on the film surface to a solution of dye and solvent that evaporates and penetrates the film pores by absorption to permanently dye the film. . The stencil can then be removed so that the phototool is not damaged by surface scratches or abrasions.

The dye was supplied by Atl & Co., Nutley, New Chassis.
[At1
It can be a product sold in solution in butyl cellosolve solvent as asol j Golaen Yellow.

Stencils are photoformed onto a thin film of liquid photopolymer on the contacting surface of the film imaged by the transparency through a thin film layer such as polypropylene that laminates the entire surface with the transparent image and a thin pressure-sensitive adhesive. It can be held in place by layers. The dye/Q-turns are spread throughout the film and are virtually identical to those IQ-turns on the transparency (page 62), so there is no undercutting during exposure and the dye passes through the film thickness. It has a scratch resistant trap finish so it spreads. Thus, non-collimated light can be used for exposure without loss of resolution.

This layer, as in the case of the aluminum image described above, does not get hot in the way that dark silver halide surfaces do, but it is opaque to UV curing radiation. Polyolefin films, particularly polypropylene films, are preferred release coatings rather than the aforementioned silicone coatings because of their clear porosity and desirable adhesive properties.

The use of this breakaway film as an intervening layer without an image greatly impairs resolution and requires use only with expensive collimated light.

Another method of achieving the dyeing pattern is the preferred “1
075J photosensitive resin, butyl cellosolve and dye are combined into a single liquid. This compound is f?
Spray the surface of the IJ propylene film and selectively expose through the optical transparency and through the propylene film (page 63). The photosensitive resin irradiated with light hardens while fixing the dye particles. The photosensitive resin that is not irradiated with light remains in a liquid state, and the dye particles are absorbed into the pores of the polypropylene while the solvent evaporates. Another porous film that can be used in the disclosed method is polyethylene.

However, polyethylene does not have the clarity or high temperature useful range of polypropylene.

This latter advantageous phototool product and method is better understood with reference to FIGS. 5 and 6 of the drawings. As can be seen, the optical transparency film 4 with the opaque aluminum image 7 on the imaged surface 69 is laminated entirely with a thin polypropylene film sheet layer 70, with sections 71 extending over the entire thickness of the film layer 70. Spread and stain as described above.

In FIG. 6, surface 72 has been wetted with a liquid photopolymer layer 73 and infiltrated into said layer as described above in air-free surface contact. Furthermore, the surface 72 is
Above photosensitive resin film layer 73
355 (17) parts exposed to light, cured and hardened photocured resin section 2
Do not adhere to. Thus, the phototool consisting of layers 4 and 70 allows the liquid uncured portion of layer 73 to be removed in a solvent to provide the highest resolution, photoimaging products such as printed wiring board Q-turns or solder masks. It can be washed out and peeled off to reveal a light image on the substrate l. The release phototool is then preferably wiped to remove any unexposed liquid photopolymer layer 73 that sticks to the release phototool. This is not necessary if the liquid photopolymer 1# is placed on the soft phototool l-surface 72, such as by silkscreening in a very thin layer of known thickness.

In particular, very good resolution is obtained without the use of parallel rays due to the sections 71 impregnated in the film layer 70 of polypropylene (or the like) which obstruct non-collimated rays 75 like rays 74. I want to be noticed.

Parallel light rays 74 are necessary to maintain high resolution if release film layer 70 is interposed without a dyed light image according to the features of the present invention.

(Page 65) As shown in FIG. 8, a printed wiring board 111 having a metal conductor 113 and a through hole hollowed out with metal rests on the surface 112. The screen holder 110 holds the screen 118, and the blade 115 holds the forces 116 and 11.
7 so that the screen 118 can be scanned by the substrate 1
The photosensitive resin layer 114 is laminated onto the first 19119 of photosensitive resin disposed directly on the surface of the substrate 111 , held tightly taut on top of and parallel to the substrate 111 . The photopolymer layer 114 on the screen can be either a dry film positive working photopolymer held adhesively on the screen 118 or a liquid film negative partially cured on the screen before transfer by air flash using a UV light source. It can be either a mold action photopolymer. After lamination, the printed wiring board resin layer is exposed to a UV light source through an optical imaging tool.

If a positive acting dry film top layer is used, layer 114
All of the liquid photosensitive resin layer 1 that is not covered by the cured part of
19, the uncured photopolymer layer 114 is washed out during trichloroethane spraying.

(Page 66) The film is also typically covered with a polyethylene barrier sheet or the like, with the laminate on the outside of the layer helping to exclude air from the inner layer surfaces.

The thickness of the outer layer 114 is approximately 0.0025 cr);
When partially cured, the liquid photopolymer does not shrink or thin the conductors 113 on the printed wiring board. After final curing by passing through a suitable phototool in alignment with the traces and turns, the solder mask coating remains on the substrate with the uncured photopolymer over the desired circuit conductors and the uncured photopolymer. The resin is removed by a solvent.

This embodiment, which features two layers of photopolymer coating, uses a smaller amount of photopolymer and a less expensive photopolymer, achieves a thicker, more uniform layer over uneven surfaces, and allows for smoother through- It has the advantage of preventing spots or residual unremoved resin on the holes, achieving high resolution. Essentially, the present invention provides a high
page) yields resolution results. Through-holes in the substrate are similarly clear, but this cannot be achieved with dry film and small exposures. Better adhesion to the conductor also occurs, wrapping around wrinkles and uneven surfaces are eliminated.

As previously discussed, the advantage of tenting the holes in a printed wiring board is to move the photopolymer from screen 118 to substrate 11.
1 by transferring it onto.

If a liquid photopolymer layer 114 is used, it can be flashed in air for partial polymerization to improve tenting properties.

[Brief explanation of drawings]

FIG. 1 is a partially cross-sectional side schematic diagram illustrating the articulation of a coated substrate and a light image through the use of a resilient blade provided by the present invention, and FIG. 2 is a more similar schematic diagram illustrating the articulation during the exposure process. , the coolant supply and the tube light are
Figure 3 is mounted together to protect the optical image from excessive heat and expose all the photopolymer in one scan; Figure 3 is for mounting the optical image and substrate in alignment before articulation. Japanese Patent Application Publication No. 120355 (18). FIG. 4 is a perspective partial view of a simple apparatus for running and exposing a photosensitive resin containing a sandwich-like array according to the invention; FIG. FIG. 6 is a side schematic view of a high resolution phototool embodiment of the present invention showing an imaged surface in releasable contact with a liquid photopolymer of the present invention; FIG. FIG. 7 is a partial cross-sectional view of an underwater exposure embodiment of the present invention, and FIG. 8 is a partial cross-sectional elevational view of a preferred embodiment for a printed wiring board laminated with two layers of photosensitive resin. 1...PWB board, 2...photosensitive resin layer, 3...
Photosensitive resin layer, 4... Photo tool, 7... Opaque part, 1O... Blade, 12... Light ray, 13... Concentrating reflector, 14... Non-parallel light source, 15...・Storage vessel,
16... Sponge, 17... Coolant, 18... Coolant droplets, 19... Rotating shutter, 47... Drill hole, 52... Conductor layer

Claims (1)

[Claims] 1) Before curing, which causes a change in the solubility of the photosensitive resin,
In a method of irradiating the surface of a solvent-soluble negative-working liquid photosensitive resin layer, the photosensitive resin surface is exposed to light by means of contact with a removable transparent non-gaseous material that does not change the solubility of the photosensitive resin during irradiation. Gas and air are removed from the irradiated photosensitive resin surface during irradiation in order to reduce the irradiation dose required for curing the photosensitive resin, and from the non-gaseous body in order to regenerate high resolution images in the photosensitive resin layer. A method characterized in that the photosensitive resin is cured through a transparent phototool sheet adjacent to the photosensitive resin and having a light image pattern on the light-receiving surface. 2) A method according to claim 1, characterized in that the photosensitive resin layer is irradiated through the image pattern and the non-gaseous body using a non-collimated irradiation source. 3) The transparent sheet is prepared with a release surface that does not stick to the photopolymer after curing and allows the phototool to be reused many times. Method described. 4) Before curing, which causes a change in the solubility of the photosensitive resin,
In a method of irradiating the surface of a solvent-soluble negative-working liquid photosensitive resin layer, the photosensitive resin surface is exposed to light by means of contact with a removable transparent non-gaseous material that does not change the solubility of the photosensitive resin during irradiation. In order to reduce the irradiation dose required for curing the photosensitive resin, gas and air are excluded from the irradiated photosensitive resin surface during irradiation, and the non-gas A method comprising: curing a photosensitive resin through a transparent phototool sheet having a photoimage pattern formed by dyeing the body of the transparent sheet adjacent to the photosensitive resin; 5) Before curing, which causes a change in the solubility of the photosensitive resin,
Solvent-soluble negative-working liquid photosensitive resin layer (3rd grade) In the surface irradiation method, a removable transparent non-gaseous material that does not change the solubility of the photosensitive resin and the photosensitive resin surface during irradiation is used. An elastic scanning tool that is pulled across the photopolymer layer to exclude gas and air while bringing the photopolymer layer into contact with the phototool sort to reduce the radiation dose required for curing the photopolymer by contact means. The photosensitive resin layer surface is laminated with the phototool sheet and the photosensitive resin layer is laminated with the photosensitive resin layer. In order to eliminate gas and air from the photosensitive resin surface during irradiation and reproduce a high-resolution image on the photosensitive resin layer, the non-gaseous material is adjacent to the photosensitive resin and forms a single image pattern of light on the light receiving surface. A method characterized in that a photosensitive resin is cured through a transparent phototool sheet comprising: 6) pre-curing pressure that causes a change in the solubility of the photosensitive resin;
In a method of irradiating the surface of a solvent-soluble negative-working liquid photosensitive resin layer, the photosensitive resin surface is exposed to light by means of contact with a removable transparent non-gaseous material that does not change the solubility of the photosensitive resin during irradiation. During irradiation, gas and air are removed from the irradiated photosensitive resin surface in order to reduce the amount of irradiation required for curing the photosensitive resin 11, and from the non-gaseous material in order to reproduce a high-resolution image on the photosensitive resin 11. Scanning that cures the photosensitive resin through a transparent phototool sheet adjacent to the photosensitive resin and having a light image pattern on the light-receiving surface, with an irradiation source in contact with the photosensitive resin layer and shining through the imaged surface. Scan the phototool at the same time as the material passes,
A method characterized by gradually curing the photosensitive resin during that time. 7) Before curing, which causes a change in the solubility of the photosensitive resin,
In a method of irradiating the surface of a solvent-soluble negative-working liquid photosensitive resin 1, the photosensitive resin surface is exposed to light by means of contact with a removable transparent non-gaseous material that does not change the solubility of the photosensitive resin during irradiation. In order to reduce the amount of radiation required for curing the photosensitive resin, gas and air are removed from the surface of the photosensitive resin being irradiated during irradiation, and the photosensitive resin layer is then cured by placing the liquid in thermal contact with the photosensitive resin layer. Heat dissipates inside,
5) In order to reproduce a high-resolution image on the photosensitive resin layer, the photosensitive resin is passed through a transparent phototool sheet made of the non-gaseous material and having a light image pattern on the light receiving surface adjacent to the photosensitive resin. A method characterized by curing. 8) The photosensitive resin II is placed under the liquid so as to be in contact with the surface of the photosensitive resin, and the liquid is replaced with the phototool sheet to eliminate gas and air as well as radiate heat. The method described in Scope 1. 9) Liquid photosensitive resin@ is placed on a photoimage patterned sheet and partially polymerized by irradiation exposure up to the phototool and then placed on said one surface for curing consisting of a printed wiring board with through holes. 2. A method according to claim 1, characterized in that the Maeda self-hole is tented by laminating and thereby without being noticeably thinned. 10) In a method of irradiating the surface of a solvent-soluble negative-working liquid photosensitive resin layer before curing that causes a change in the solubility of the photosensitive resin, the surface of the photosensitive resin (6th opening) is exposed to light during the irradiation. During irradiation of gas and air from the surface of the photosensitive resin that is irradiated to change the solubility of the photosensitive resin and reduce the amount of radiation required for curing the photosensitive resin by means of contact with a transparent non-gaseous material that can remove moths. The photosensitive resin is passed through a transparent phototool sheet made of the non-gaseous material and having a light image pattern on the light-receiving surface adjacent to the photosensitive resin in order to eliminate the photosensitive resin and reproduce a high-resolution image on the photosensitive resin layer. further comprising a sandwich-like photopolymer layer between two sheets, the first sheet being transparent and having a photoimage pattern on its interior surface adjacent to the photopolymer layer; A method characterized by forming. 11) the other sheet is a printed wiring board having a conductor surface II placed in contact with the photosensitive resin 11;
2. A method according to claim 1, characterized in that a portion of the hardened wall photosensitive resin layer extends up to t covering the conductor surface layer. 12) Liquid photosensitive resin # is placed on the transfer surface, and the light-receiving surface is a printed wiring board with through holes (No. 7).
2. The method according to claim 1, wherein the holes are covered by laminating the liquid layer from the transfer surface to the printed wiring board. 13) Set the photosensitive resin layer thickness to 0.006 crrL (0,
0.002 R inches), thereby providing a total resolution of as much as 0.01 crL (0.004 inches) within the cured photosensitive resin layer. the method of. 14) Arranging a photosensitive resin layer on a substrate sheet, and laminating a flexible thin sheet consisting of both the non-gaseous material and the image pattern onto the photosensitive resin layer to form a sandwich between the *i sheets. A method according to claim 1, characterized in that: 15) A curable liquid negative photosensitive resin II is placed on a flexible thin sheet consisting of both the non-gaseous material and the curable pattern, and the photosensitive resin layer is partially polymerized, thereby Before the curing process, add enough of the thin sheet to better adhere the photosensitive resin to the thin sheet.
The method according to claim 1, characterized in that the surface of the photosensitive resin is exposed to light through -. 16) Arrange a substrate surface consisting of a printed wiring board on top of a conductor 1iit that has through holes and is in contact with the liquid negative photosensitive resin layer, and impede irradiation so that the liquid photosensitive resin can be easily removed. 2. A method as claimed in claim 1, characterized in that the photosensitive resin is cured by passing the radiation through the holes in different images. 17) The method according to claim 1, characterized in that a photosensitive resin of a known thickness is printed through a mesh screen on one of the two surfaces between which the photosensitive resin is arranged in a sandwich manner. 18) In the method of irradiating a solvent-soluble negative-working liquid photopolymer before curing, which causes a change in the solubility of the photopolymer, the solubility of the photopolymer on the photopolymer surface and during irradiation is In order to reduce the radiation dose required for curing the photosensitive resin by means of contact with a removable transparent non-gaseous material that does not change the irradiation, gas and air are removed from the irradiated photosensitive resin surface during the irradiation (Ninth Negative). Then, in order to reproduce a high-resolution image on the photosensitive resin layer, the photosensitive resin is cured through a transparent phototool sheet made of the non-gaseous material and having a light image pattern on the light receiving surface adjacent to the photosensitive resin. A method characterized in that a photosensitive resin layer is arranged between two sheets to form a sandwich-like film pack. 19) A method according to claim 1, characterized in that a thin transparent silicone rubber film is used as a release surface to cover the surface of the phototool sheet bearing the image. 20) The method according to claim 1, characterized in that air is excluded by a second photosensitive resin layer laminated on the photosensitive resin. 21) The method of claim 1, further comprising providing a release surface of a polypropylene film surface onto which the optical image pattern is copied. 22) To selectively dye with a permanent dye that spreads inside the polypropylene film, the dye and solvent mixture is applied all the way through the imaging stencil to the release surface of the polypropylene film, thereby slightly scratching the surface. 22. The method of claim 21, wherein the phototool sheet and image pattern are constructed so that they can be used repeatedly without being replaced when worn. 23) A method according to claim 22, characterized in that a yellow dye dissolved in a butyl cellosolve solvent is applied to form the image pattern. 24) A method according to claim 1, characterized in that: 1) a transparent phototool sheet is applied to the surface of the photosensitive resin layer to exclude gas and air; 25) In an irradiation device for the surface of a liquid photosensitive resin layer for changing the solubility of the photosensitive resin by irradiation and curing at least a portion thereof, the solubility of the photosensitive resin in contact with the surface of the photosensitive resin layer to be irradiated. a removable transparent non-gaseous material that does not alter the photopolymer layer, and a phototool sheet having a photoimage pattern on one surface adjacent to the irradiated photopolymer surface to provide high resolution image reproduction in the photopolymer layer. 11) A device characterized by a transparent body. 26) In an irradiation device for the surface of a liquid photosensitive resin layer for changing the solubility of the photosensitive resin by irradiation and curing at least a portion thereof, the solubility of the photosensitive resin in contact with the surface of the photosensitive resin 1 to be irradiated is a removable non-transparent gaseous body that does not change the phototool sheet with a photoimage pattern on one surface adjacent to the photosensitive resin surface to be irradiated for providing high resolution image reproduction to the photosensitive resin r@ An apparatus characterized by a transparent body and a non-collimated radiation source arranged to expose the photosensitive resin layer through the light image turns. 27) Claim 5 characterized by a thin release surface covering the photoimage pattern that does not stick to the photoresin surface after curing, thereby allowing multiple uses of the phototool sheet. the method of. 28) In an irradiation device for the surface of a liquid photosensitive resin layer for changing the solubility of the photosensitive resin by irradiation and curing at least a portion of the photosensitive resin layer, the photosensitive resin layer receives irradiation. a removable transparent non-gaseous material that does not alter the solubility of the photopolymer adjacent to the surface, and one surface adjacent to the irradiated photopolymer surface to provide high resolution image reproduction to the photopolymer layer; a phototool sheet transparency having a light image pattern on one surface of the phototool sheet transparency, wherein the light image pattern on one surface of the phototool sheet transparency comprises a light image pattern impregnated into the transparent sheet. . 29) While the phototool sheet is in contact with the photopolymer surface, the photopolymer sheet is placed adjacent to the photopolymer layer surface using an elastic scanner that is pulled across the photopolymer layer to exclude any gas and air. 6. Apparatus according to claim 5, characterized by incorporation means for passing laterally across the non-image surface of said phototool sheet spaced apart. 30) Sea) 1 pass sideways, table with image while passing (1st
3) Apparatus according to claim 5, characterized by a movable irradiation source having electrifying means for gradually curing the photosensitive resin layer in contact with the surface. 31) The apparatus according to claim 5, characterized by means for placing a liquid in thermal contact with the photosensitive resin layer to dissipate heat during curing. 32) The method according to claim 5, characterized by means for arranging a photosensitive resin layer under a liquid that can be replaced by the phototool sheet in order to both exclude gas and air and dissipate heat during curing. Device. 33) The apparatus according to claim 32, characterized by a liquid cleaning solution that contributes to promoting the separation of the hardened edges of the imaged surface in contact with the photosensitive resin layer and to increasing the number of uses of the phototool sheet. 34) The apparatus of claim 5, characterized in that the phototool sheet, the photopolymer layer and one sandwich-forming sheet are included. 35) A conductor surface layer disposed in contact with the surface of the photosensitive resin (14th negative) layer for adhering the photosensitive resin layer to the conductor surface in a pattern corresponding to the photoimage pattern after curing by irradiation through the phototool. The apparatus according to claim 1, characterized in that said another sheet is made of a printed wiring board having a. 36) A device according to claim 5 characterized by a negative-working photopolymer layer which is solvent soluble before curing in the presence of radiation passed through the non-gaseous body! . 37) A patent featuring a photosensitive resin layer laminated onto a phototool sheet and partially cured to better adhere the layer to the thin sheet before the photosensitive resin layer is fully cured through the phototool pattern. Apparatus according to claim 1. 38) The device according to claim 37, characterized in that the photosensitive resin layer is coated on the conductor surface of a printed wiring board in which holes are pre-drilled. 39) Device according to claim 5, characterized by a sandwich-like film pack having a photosensitive resin layer arranged between two sheets. 40) The device of claim 39, characterized by a thin transparent silicone rubber release surface disposed between the photoimage pattern and the surface of the photopolymer layer. 41) The apparatus of claim 5, further comprising a light image pattern comprising a thin aluminium laminate on the transparent sheet. 42) The apparatus of claim 5 characterized by a light image pattern carried by a sheet of polypropylene film. 43) The apparatus of claim 42, characterized by an optical image pattern consisting of a dyed pattern in a polypropylene film sheet. 44) Claim 5 characterized by means for moving the photosensitive resin layer and the light image pattern past the radiation source.
Xiangjun's own equipment. 45) two sheets, the first of which is transparent with a light image on its inner surface adjacent to the photosensitive resin layer;
A photosensitive resin film pack assembly featuring a photosensitive resin layer sandwiched between layers. 46) The film according to claim 45, wherein the second sheet is a printed wiring board having a conductive surface in contact with the surface of the photosensitive resin layer.
0355(5) Pack assembly. 47) two sheets, the first of which is transparent with a light image on its inner surface adjacent to the photosensitive resin layer;
A photosensitive resin film pack characterized by a negative-working photosensitive resin layer sandwiched between the photosensitive resin layers and which is solvent soluble prior to curing in the presence of radiation passed through said transparent sheet. assembly. 48) Limit the thickness of the photosensitive resin layer to 0.006 cm or less, and 0.01 crr in the cured photosensitive resin layer.
48. A film pack according to claim 47, characterized in that it produces a sharp resolution of L. 49) Before the photosensitive resin layer is completely cured by irradiation passing through the surface with the optical image, after lamination onto the first sheet, the photosensitive resin layer is partially cured in order to better adhere the photosensitive resin layer to the first sheet. 48. The film pack according to claim 47, wherein the film pack is cured to 50) The second sheet has a pre-perforated printed arrangement (17th
46. The film pack according to claim 45, which is a wire plate. 51) The film 19 according to claim 45, characterized by a thin transparent silicone rubber film release surface between the optical image pattern and the surface of the photosensitive resin layer. 52) A film pack according to claim 45, characterized in that said light image pattern constitutes a thin aluminum laminate of said transparent sheet. 53) Claim 45, characterized in that the light image pattern is carried on a polypropylene film sheet.
Film pack described in section. 54) A film pack according to claim 45, characterized in that said optical image pattern consists of a dyeing pattern in a polypropylene film sheet. 55) A method comprising laminating a first layer of liquid negative-working photopolymer onto the irregular surface of a printed wiring board, followed by laminating thereon a second layer of photopolymer. 56) The method according to claim 55, characterized in that in the laminating step of the second layer of photosensitive resin, the second layer is a positive working dry film photosensitive resin layer (No. 18). 57) Transferring the @2 layer from a screen placed parallel to the printed wiring board in the laminate by scanning across the screen using a flexible instrument.
6. The method of claim 5, characterized in: (Page 19)