JPS60119734A - Resin sealing method for electronic parts - Google Patents
Resin sealing method for electronic partsInfo
- Publication number
- JPS60119734A JPS60119734A JP22740983A JP22740983A JPS60119734A JP S60119734 A JPS60119734 A JP S60119734A JP 22740983 A JP22740983 A JP 22740983A JP 22740983 A JP22740983 A JP 22740983A JP S60119734 A JPS60119734 A JP S60119734A
- Authority
- JP
- Japan
- Prior art keywords
- injection molding
- viscosity
- epoxy resin
- resin
- sealing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 229920005989 resin Polymers 0.000 title claims description 17
- 239000011347 resin Substances 0.000 title claims description 17
- 238000007789 sealing Methods 0.000 title claims description 14
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 238000002347 injection Methods 0.000 claims abstract description 6
- 239000007924 injection Substances 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract 2
- 238000000465 moulding Methods 0.000 abstract description 11
- 238000001721 transfer moulding Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 241000218645 Cedrus Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、電子部品を、とくに、熱硬化性樹脂であるエ
ポキシ樹１１旨ゲ用いて射出成形法によって樹脂封止せ
んとする電子部品の樹脂封止方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for resin-sealing electronic parts, particularly in which electronic parts are resin-sealed by injection molding using epoxy resin, which is a thermosetting resin. be.
電子部品、例えば工０． ）ランジスタ、ダイオード、
コイル、コンデンサー、抵抗器などの、電気絶縁性、機
械的な保護、外部ふん囲気などによる特性変化を防止す
るだめに、電子部品を樹脂封止することが広く行われて
いる。Electronic parts, such as engineering 0. ) transistors, diodes,
Electronic components such as coils, capacitors, and resistors are often encapsulated in resin to provide electrical insulation, mechanical protection, and to prevent changes in characteristics due to external ambient air.
これに使用する樹脂としては、エポキシ、シリコンなど
の熱硬化性樹脂が一般的であり、また封止方法としては
、トランスファー成形法、注型成形法訃よび各種の浸漬
法が適用されている。The resin used for this is generally a thermosetting resin such as epoxy or silicone, and the sealing methods include transfer molding, cast molding, and various immersion methods.
トランスファー成形法は、画周波予熱の工程か付随し、
この工程は、高度の熟練を必要とし、工程に要する時間
も一定化することは困難であるので、その結果、本方法
では連続した自動化成形が非常に困難である。The transfer molding method involves a step of image frequency preheating,
This process requires a high level of skill, and it is difficult to make the time required for the process constant. As a result, continuous automated molding is extremely difficult with this method.
注型成形法は、外枠の加工工程と、外枠に樹脂を注入す
る工程とが必要であるのでコスト高となり、また封止成
形操作Δ上の繁雑さがこれに伴う。The cast molding method requires a process of processing the outer frame and a process of injecting resin into the outer frame, resulting in high cost, and is accompanied by the complexity of the sealing molding operation Δ.
各種浸漬法は、封止成形品の外形寸法が１個、１個異な
って寸法精度がＢｉ ／ｌいという問題がある。Various immersion methods have a problem in that the outer dimensions of the encapsulated molded products differ by one piece and the dimensional accuracy is low by Bi /l.
本発明はこれら従来方法のもつ欠点を全て解消し、連続
的自動化をなし、成形工程を短縮化し、樹脂封止成形品
の寸法精度の向上を計らんとするものであって、常温に
おいて粘稠状であって低粘度のエポキシ樹脂を使用し、
かつスクリュ式射出成形機をもって、低圧で射出成形を
行って電子部品の樹脂封止をなさん−とするものである
。The present invention aims to eliminate all the drawbacks of these conventional methods, achieve continuous automation, shorten the molding process, and improve the dimensional accuracy of resin-sealed molded products. Using a low viscosity epoxy resin,
Moreover, by using a screw type injection molding machine, injection molding is performed at low pressure to seal electronic parts with resin.
これをさらに詳細に説明する。This will be explained in more detail.
本発明方法においては、粘稠状であって低粘度のエポキ
シ樹脂をスクリュ式射出成形機で低圧をもって射出成形
をするが、エポキシ樹脂の粘度は、射出成形時の金型内
で１０〜ｌＯホイズの（８度をもつ。In the method of the present invention, a viscous, low-viscosity epoxy resin is injection-molded at low pressure using a screw injection molding machine. (has an 8th degree)
この粘度は、電子部品、例えばＩＣのボンディングワイ
ヤーを破損したり、変形させることなく、射出成形する
上で必要なものである。粘度が１０ボイズ以上にｇ
なると射出圧力が大きくなねＣ数百７ｍ２）、前記工Ｃ
のボンディングワイヤーなどの破損、あるいは変形が生
じる。This viscosity is necessary for injection molding without damaging or deforming bonding wires of electronic components, such as ICs. When the viscosity exceeds 10 g, the injection pressure becomes large (C several hundred 7 m2), and the above-mentioned process C
Damage or deformation of the bonding wire, etc. may occur.
またエポキシ樹脂は、その中に４０〜８０重量係の重量
質充填剤を配合させた常温において粘稠状のものでこれ
は熱膨張係舷を３×工０／、以下に押さえ、０ｍ ０
熱変形温度を２５００以上となし、熱伝導率を２Ｘ／Ｑ
”０シ／Ｂ０ｃ”ｍ／″”” 以上Ｋ ｔ ｂ ７’ｃ
１６ テｈ ；ｆａｒ 。Epoxy resin is viscous at room temperature and contains a heavy filler weighing 40 to 80% by weight; Deformation temperature is 2500 or higher, thermal conductivity is 2X/Q
"0shi/B0c"m/''"" or moreK t b 7'c
16 teh;far.
これらは電子部品の特性を維持し、熱的および機械的要
因で発生する損傷を最小限に押えるものである。These maintain the properties of electronic components and minimize damage caused by thermal and mechanical factors.
またこのエポキシ樹脂を用いて射出成形する条件は、シ
リンダ温度を２０（室温）〜１２００．金型温度を１０
０〜１８０°Ｃ１射出圧力ｊｌ−２０〜２００．Ｆ ２
トスル。The conditions for injection molding using this epoxy resin include cylinder temperature of 20 (room temperature) to 1200. Mold temperature 10
0~180°C1 injection pressure jl-20~200. F2
Tossle.
０ｍ これらの条件は電子部品の種類によって異なる。0m These conditions differ depending on the type of electronic component.
工Ｃ封止の場合は、エポキシ樹脂の性状によって、シリ
ンダ温度は−２０（室温）〜９０ ’Ｉ ａ、金型温度
は１５０〜う。In the case of C sealing, the cylinder temperature ranges from -20 (room temperature) to 90'Ia and the mold temperature ranges from 150 to 150'Ia, depending on the properties of the epoxy resin.
コンデンサーの場合は、シリンダ温度は２００（室温）
、金型温度は１４０〜ｌ’７Ｑ Ｏ，射出圧力は５０−
２００２２ｍ
である。For condensers, the cylinder temperature is 200 (room temperature)
, mold temperature is 140~l'7QO, injection pressure is 50-
It is 20022m.
さらに射出成形機のスクリュへの供給口は、エポキシ樹
脂の性状に合わせて、必要に応じ押し込み装置を設置す
るなどして円滑な計量を計る。Furthermore, depending on the properties of the epoxy resin, a pushing device may be installed at the supply port to the screw of the injection molding machine to ensure smooth metering.
実施結果から、粘稠状エポキシ樹脂では、圧縮比１以上
の連続した螺旋を有するスフ１）ユを用いて言＋量、お
よび射出操作が可能であった。The results showed that with viscous epoxy resin, it was possible to increase the amount of resin and to perform injection operations using a suture having a continuous spiral with a compression ratio of 1 or more.
本発明方法によれば、樹脂封止された電子部品の、、ａ
特性は、従来のトランスファー成１杉法、注型１戊形
法、および各１’４１Ｔ浸漬法により慎・１脂封止され
た場合と同等である。According to the method of the present invention, a of a resin-sealed electronic component is
The characteristics are the same as those obtained by Shin-1 resin sealing using the conventional transfer Sei-sugi method, cast-molding method, and 1'41T dipping method.
そして、トランスファー成形法のように連続自動化成形
ができないという問題が、射出成う杉化干ることにより
解決できるし、まだ注型成形法では、夕を枠成３ｕ工程
と注型工程の二工程が必要であるカニ、これを射）１“
５成形化干ることにより、詞脂封止工程を・一工程です
ることがでキ、トータルコストからみればこの射出成形
による樹脂封止の方が安価となる。In addition, the problem of not being able to perform continuous automated molding as in the transfer molding method can be solved by injection molding and cedar molding. If you need a crab, shoot this) 1"
5. By molding and drying, the resin sealing process can be done in one step, and in terms of total cost, resin sealing by injection molding is cheaper.
また、これまで人手に頓っていた封」Ｌ成形４桑作をｉ
１店人化することができるという利点ももっている。In addition, we have also added the sealing L molding 4 Kuwa products, which had previously been handled manually.
It also has the advantage of being able to become a single store employee.
さらに各種浸漬法による時は、外形寸法７５Ｘｌ （固
１個異なり、寸法精度がでないという大きな問題７５玉
あるが、射出成形することにより樹脂封止された電子部
品の外形寸法は全て一定のものが得られる。Furthermore, when various immersion methods are used, the external dimensions are 75Xl (1 piece is different, and there is a big problem of lack of dimensional accuracy. However, by injection molding, the external dimensions of resin-sealed electronic parts are all constant. can get.
この寸法精度はトランスファー成形法の場合と比べても
同等かそれ以上のものを得ることができる。This dimensional accuracy can be equivalent to or better than that obtained by transfer molding.
Claims (1)
粘稠状であって低粘度のエポキシ樹脂を使用し、スクリ
ュ式射出成形機をもって低圧で射出成形を行う甫１子部
品の樹脂封止方法。 （２）常温において粘度か１０〜１ｏボイズのエポキシ
樹脂ｔ脂を使用した特許請求の範囲繊１項記載の電子部
品の樹脂封止方法。 （：３）４０〜８０重−係の無機質充填剤を含んだ常温
において帖間状のエポキシ樹脂を使用した特許請求の範
囲第１項記載の電子部品の樹脂封止方法。 （４）射出圧力２０〜２００ ”Ｚ ｍ ２で射出成形
を行う特許請求の範囲第１項記載の電子部品の樹脂封止
方法。[Claims] (2) When sealing electronic parts with resin, an epoxy resin that is viscous at room temperature and has a low viscosity is used, and injection molding is performed at low pressure using a screw injection molding machine. 1. Resin sealing method for child parts. (2) A resin sealing method for an electronic component according to claim 1, which uses an epoxy resin T resin having a viscosity of 10 to 1 o voids at room temperature. (:3) A resin sealing method for an electronic component according to claim 1, which uses an epoxy resin in the form of a square at room temperature containing an inorganic filler with a weight of 40 to 80%. (4) The resin sealing method for electronic components according to claim 1, wherein injection molding is carried out at an injection pressure of 20 to 200"Z m2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22740983A JPS60119734A (en) | 1983-12-01 | 1983-12-01 | Resin sealing method for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22740983A JPS60119734A (en) | 1983-12-01 | 1983-12-01 | Resin sealing method for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60119734A true JPS60119734A (en) | 1985-06-27 |
Family
ID=16860379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22740983A Pending JPS60119734A (en) | 1983-12-01 | 1983-12-01 | Resin sealing method for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119734A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0236916A (en) * | 1988-07-26 | 1990-02-06 | Nippon Chibagaigii Kk | Low pressure liquid injection molding method for sealing coil part or transformer |
| EP0419737A2 (en) * | 1988-09-27 | 1991-04-03 | Somar Corporation | Molding method |
| EP0787569A3 (en) * | 1996-01-31 | 1999-04-21 | Sumitomo Bakelite Company Limited | Method of producing epoxy resin-encapsulated semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892547A (en) * | 1981-11-30 | 1983-06-01 | Mitsui Petrochem Ind Ltd | Manufacture of electric and electronic components |
-
1983
- 1983-12-01 JP JP22740983A patent/JPS60119734A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892547A (en) * | 1981-11-30 | 1983-06-01 | Mitsui Petrochem Ind Ltd | Manufacture of electric and electronic components |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0236916A (en) * | 1988-07-26 | 1990-02-06 | Nippon Chibagaigii Kk | Low pressure liquid injection molding method for sealing coil part or transformer |
| EP0419737A2 (en) * | 1988-09-27 | 1991-04-03 | Somar Corporation | Molding method |
| EP0419737A3 (en) * | 1988-09-27 | 1992-03-04 | Somar Corporation | Molding method |
| EP0787569A3 (en) * | 1996-01-31 | 1999-04-21 | Sumitomo Bakelite Company Limited | Method of producing epoxy resin-encapsulated semiconductor device |
| EP0985513A2 (en) * | 1996-01-31 | 2000-03-15 | Sumitomo Bakelite Company Limited | Method of producing epoxy resin-encapsulated semiconductor device |
| EP0985513A3 (en) * | 1996-01-31 | 2000-03-22 | Sumitomo Bakelite Company Limited | Method of producing epoxy resin-encapsulated semiconductor device |
| SG91806A1 (en) * | 1996-01-31 | 2002-10-15 | Sumitomo Bakelite Co | Method of producing epoxy resin-encapsulated semiconductor device |
| KR100429046B1 (en) * | 1996-01-31 | 2004-09-18 | 스미또모 베이크라이트 가부시키가이샤 | Method of producing epoxy resin-encapsulated semiconductor device |
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