JPS60117380A - Pattern processing method - Google Patents

Pattern processing method

Info

Publication number
JPS60117380A
JPS60117380A JP58225651A JP22565183A JPS60117380A JP S60117380 A JPS60117380 A JP S60117380A JP 58225651 A JP58225651 A JP 58225651A JP 22565183 A JP22565183 A JP 22565183A JP S60117380 A JPS60117380 A JP S60117380A
Authority
JP
Japan
Prior art keywords
pattern
black
patterns
white
preprocessing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58225651A
Other languages
Japanese (ja)
Other versions
JPH0323948B2 (en
Inventor
Giichi Kakigi
柿木 義一
Moritoshi Ando
護俊 安藤
Akifumi Muto
明文 武藤
Kazuo Yagi
一夫 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58225651A priority Critical patent/JPS60117380A/en
Publication of JPS60117380A publication Critical patent/JPS60117380A/en
Publication of JPH0323948B2 publication Critical patent/JPH0323948B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To remove unevenness in the vicinity of the boundary of patterns only without removing minute defects by removing only empty areas in the vicinity of the boundary of the patterns in the preprocessing of patterns at the time of inspection by detecting the patterns optically. CONSTITUTION:Each part represented by A, B, C, and D at the left side of the figure shows sensors respectively and sensors B and D shown by squares with black dots correspond to black (1) and each of the sensors C corresponds to white (0). The A, B, C, and D at the right side show outputs of preprocessing of patterns and are connected with the sensors by means of an inverter 11, AND gate 12, and OR gate 13. When black appears at the marginal part of a pattern and unevenness occurs at this part, the A at the outside of the B is white and the B is connected with the D by black, and therefore, unevenness in the vicinity of the boundary of patterns disappears by preprocessing. When the disconnected part of the line is preprocessed, the A is not white and the B is connected by black with the D. Therefore, the disconnected part is left as white, namely as a disconnected part.

Description

【発明の詳細な説明】 fi1発明の技術分野 本発明はパターン処理方法、特に光学的にパターンを検
知し検査を行う装置におけるパターンの処理方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION FIELD OF THE INVENTION The present invention relates to a pattern processing method, and particularly to a pattern processing method in an apparatus for optically detecting and inspecting a pattern.

(2)技術の背景 例えばマイクロコンピュータなどに用いられる印刷基板
に形成された回路のパターン検査装置、特にパターンを
自動的に検査する装置が開発されている。パターンの自
動的検査のためには最初にパターンを光学的に読み取り
、その結果を電気的信号に変換し、この電気的信号を他
の電気回路で(1) 観察して欠陥の有無を検査する。そしてそのときに検査
に先だち前処理が行われる。本発明はこの前処理の方法
に関するものである。
(2) Background of the Technology For example, devices for inspecting patterns of circuits formed on printed circuit boards used in microcomputers, etc., and in particular, devices for automatically inspecting patterns, have been developed. To automatically inspect a pattern, first read the pattern optically, convert the result into an electrical signal, and observe this electrical signal in another electrical circuit (1) to check for defects. . At that time, preprocessing is performed prior to the inspection. The present invention relates to a method for this pretreatment.

(3)従来技術と問題点 パターン検査装置においては、欠陥検出回路の誤動作を
防止するために、検知したパターンに対して必ず前処理
が行われる。最初に読み取ったパターンそのものにはノ
イズが含まれていたりエツジに凹凸が存在するので、読
み取ったパターンそのままでは検査がしにくいから、前
処理をなしてノイズや凹凸をなくすのである。
(3) Prior Art and Problems In pattern inspection apparatuses, preprocessing is always performed on detected patterns in order to prevent malfunctions of defect detection circuits. Since the first read pattern itself contains noise and has uneven edges, it is difficult to inspect the read pattern as it is, so preprocessing is performed to eliminate noise and unevenness.

パターンは可視的には照と白で表され、黒は細く短い棒
状に現れ、黒と白は電気的には“1”と0″に対応する
。特にパターンの境界付近(エツジともいう)にはパタ
ーンに凹凸部分が発生し易いのでその凹凸をなくしたい
。そうしないとパターンは欠陥ありと検知されることに
なるからである。
The pattern is visually represented by light and white, with black appearing as a thin and short bar, and black and white electrically corresponding to "1" and "0".Especially near the boundaries of the pattern (also called edges). Since uneven parts are likely to occur in the pattern, it is desirable to eliminate the uneven parts, because otherwise the pattern will be detected as having defects.

第1図に1つのパターンが示されている。図示のパター
ンは前記した黒棒と白によって構成され(2) ているのであるが、図には黒棒の代りに模式的に砂地を
付して示す。前記のエツジにおける凹凸はその一部を縁
部1に誇張して示したが、同じような凹凸は他の縁部に
も存在する。第1図に示すパターンにお ゛いて、縁部
1の凹凸は欠陥の不存在にもかかわらず欠陥として現れ
た部分であるが、図に2と3で示す部分は現実にパター
ン間隔不良、断線欠陥が存在する。
One pattern is shown in FIG. The illustrated pattern is composed of the above-mentioned black bars and white (2), but the figure schematically shows a sandy background instead of the black bars. Although some of the unevenness on the edge is shown exaggerated on edge 1, similar unevenness also exists on other edges. In the pattern shown in Figure 1, the unevenness on edge 1 appears as a defect despite the absence of a defect, but the areas indicated by 2 and 3 in the figure are actually poor pattern spacing and disconnections. Defects exist.

第1図のパターンを従来技術に従って前処理すると第2
図に示されるパターンが得られる。縁部1の凹凸がなく
なったのはよいとしても、パターン間隔否良部分はパタ
ーンがつながってしまい、また断i部分もつながってし
まう。この前処理により微小な欠陥は除去されるが、第
2図のパターンを検査をしたとしても正確な検出ができ
ないことになる。
When the pattern shown in Fig. 1 is preprocessed according to the prior art, the second
The pattern shown in the figure is obtained. Although it is good that the unevenness of the edge 1 is eliminated, the patterns are connected in areas where the pattern spacing is defective, and the disconnected i portions are also connected. This preprocessing removes minute defects, but even if the pattern shown in FIG. 2 is inspected, accurate detection will not be possible.

上記の現象は、従来の方法においては次のようにして前
処理をしていたからである。第3図を参照すると、A、
B、Cで示す各部分はそれぞれセンサーを表し、砂地を
付したAとBのセンサーは(3) 黒(1)、またCのセンサーの各々は白(0)に対応す
るとする。従来の方法では、A=B=1のときにはC−
1とし、第4図に示す如く前処理しすべてを黒(1)に
し、かかる操作を4方向について行っていたのである。
The above phenomenon is caused by the following pretreatment in the conventional method. Referring to FIG. 3, A,
Each part indicated by B and C represents a sensor, and the sensors A and B with sandy background correspond to (3) and black (1), and each of the sensors C corresponds to white (0). In the conventional method, when A=B=1, C-
1, and preprocessed to make everything black (1) as shown in FIG. 4, and this operation was performed in four directions.

その結果、前述し7た如くにエツジの凹凸は除去された
がその他の微小欠陥までも除去されていたのである。
As a result, not only the uneven edges were removed as described in 7 above, but other minute defects were also removed.

(41発明の目的 本発明は上記従来の問題に鑑み、光学的にパターンを検
知し検査を行う装置における検査信頼度の高いパターン
前処理の方法を提供することを目的とする。
(41) Purpose of the Invention In view of the above-mentioned conventional problems, an object of the present invention is to provide a pattern preprocessing method with high inspection reliability in an apparatus that optically detects and inspects a pattern.

(5)発明の構成 そしてこの目的は本発明によれば、光学的にパターンを
検知し検査を行う際のパターン前処理を、パターンの境
界付近の空域のみ除去するようにしたこと□を特徴とす
るパターン処理方法を提供することによって達成される
(5) Structure and object of the invention According to the present invention, pattern preprocessing when optically detecting and inspecting a pattern is performed by removing only the air area near the boundary of the pattern. This is achieved by providing a pattern processing method that

(6)発明の実施例 以下本発明実施例を図面によって詳説する。(6) Examples of the invention Embodiments of the present invention will be explained in detail below with reference to the drawings.

(4) 本発明者は、パターンのエツジの凹凸をそのままにして
おくと良いパターンであっても検査で不良と判定される
かもしれないの÷、それを防止するために前処理でエツ
ジ付近の凹凸のみを除去するのであるが、しかしエツジ
部以外のその他の欠陥は微小欠陥であってもそのままに
しておかなければならぬことを認識し、第5図と第6図
に示される原理を考えた。すなわち、第5図においてセ
ンサーAとCの各々は白(0)、”センサーBとDは黒
(1)を表すとする。なお図において黒は砂地を付して
表す。そして、センサーA−0、かつ、B=D=0なら
ばC=]とするのである。その結果は第6図に示され、
本発明においてはかかるセンサーを8方向に設ける。
(4) The inventor of the present invention discovered that if the uneven edges of a pattern are left as they are, even if the pattern is good, it may be judged as defective during inspection. Although only the irregularities are removed, we recognize that other defects other than the edges must be left as they are, even if they are minute defects, and we consider the principles shown in Figures 5 and 6. Ta. That is, in FIG. 5, sensors A and C each represent white (0), and sensors B and D represent black (1). In the figure, black is represented with a sandy background. 0, and if B=D=0, then C=].The result is shown in Figure 6,
In the present invention, such sensors are provided in eight directions.

第7図は上記した動作を実現させるための回路を示し、
図において、11はインバータ、12はANDゲート、
13はORゲートをそれぞれ示す。
FIG. 7 shows a circuit for realizing the above operation,
In the figure, 11 is an inverter, 12 is an AND gate,
13 indicates an OR gate, respectively.

上記の動作をパターンの境界付近を例に第8図を参照し
て説明すると、パターンのエソ′ジである縁部1め外方
に符号4で示す黒が現れエツジに空(5′) 域が発生した、いいかえるとこの部分に凹凸ができたと
する。そこに第5図を当ててみると、Bの外方のAは白
であり、上記したところによってBからDまでは第6図
の場合の如く黒でつなげられパターンの境界付近の凹凸
はなくなる。
To explain the above operation with reference to FIG. 8, taking the area near the pattern boundary as an example, a black mark 4 appears outside the edge 1, which is the ethos of the pattern, and an empty (5') area appears at the edge. In other words, let's say that unevenness has occurred in this area. Applying Figure 5 to this, A outside B is white, and as described above, B to D are connected in black as in Figure 6, and the unevenness near the pattern boundary disappears. .

次に断線部分3゛を第9図を参照して説明する。Next, the disconnected portion 3' will be explained with reference to FIG.

断線部分に第5図を当てると、Aが白でないので、Bか
らDまでは黒でつながらなくなり、断線部分は白すなわ
ち断線そのものとして残る。
If we apply Fig. 5 to the broken line, since A is not white, there will be no connection from B to D in black, and the broken line will remain white, that is, the broken line itself.

このようにして第1図に示すパターンを前処理した結果
は第10図に示され、パターンの境界付近の凹凸はなく
なった一方で、パターン間隔不良および断線はあるがま
まに保たれて検査されることになる。
The result of preprocessing the pattern shown in FIG. 1 in this way is shown in FIG. 10, and while the unevenness near the pattern boundary has disappeared, the pattern spacing defects and wire breakage have been maintained as they are and can be inspected. That will happen.

なお上記した実施例の論理の1と0を入れかえても薇小
パターン除去処理は可能であるので、本発明の漬用範囲
は上記の場合に限定されるものでない。
Note that even if the logical 1 and 0 of the above-mentioned embodiments are replaced, the small pattern removal process is possible, so the range of application of the present invention is not limited to the above-mentioned case.

(7)発明の効果 以上群iに説明した如く本発明によれば、微小(6) な欠陥を除去することなくパターンの境界付近の凹凸の
みを除去することができるので、パターン検査の信頼性
向−ヒに効果大である。
(7) Effects of the Invention As explained in Group i above, according to the present invention, only the irregularities near the pattern boundaries can be removed without removing minute (6) defects, thereby improving the reliability of pattern inspection. - It is very effective for humans.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はパターンを示す図、第2図は第1図のパターン
を従来方法により前処理した結果を示す図、第3図と第
4図は従来のパターン前処理の原理を示す図、第5図と
第6図は本発明のパターン前処理の原理を示す図、第7
図は本発明の方法を実施するための回路を示す図、第8
図と第9図は本発明の方法の実施例を示す図、第10図
は第1図のパターンを本発明により前処理した結果を示
す図である。 1−縁部分(境界付近)、2−パターン間隔不良部分、
3−パターン断線部分、4−黒パターン、11− イン
バータ、12−ANDゲート、13−ORゲート(7)
FIG. 1 is a diagram showing a pattern, FIG. 2 is a diagram showing the result of preprocessing the pattern in FIG. 1 by a conventional method, FIGS. 3 and 4 are diagrams showing the principle of conventional pattern preprocessing, 5 and 6 are diagrams showing the principle of pattern preprocessing of the present invention, and FIG.
Figure 8 shows a circuit for implementing the method of the invention.
9 and 9 are diagrams showing an embodiment of the method of the present invention, and FIG. 10 is a diagram showing the result of preprocessing the pattern of FIG. 1 according to the present invention. 1-Edge area (near the boundary), 2-Poor pattern spacing area,
3- Pattern disconnection part, 4- Black pattern, 11- Inverter, 12- AND gate, 13- OR gate (7)

Claims (1)

【特許請求の範囲】[Claims] 光学的にパターンを検知し検査を行う際のパターン前処
理を、パターンの境界付近の空域のみ除去するようにし
たことを特徴とするパターン処理方法。
A pattern processing method characterized in that pattern preprocessing when optically detecting and inspecting a pattern removes only the air space near the boundary of the pattern.
JP58225651A 1983-11-30 1983-11-30 Pattern processing method Granted JPS60117380A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58225651A JPS60117380A (en) 1983-11-30 1983-11-30 Pattern processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58225651A JPS60117380A (en) 1983-11-30 1983-11-30 Pattern processing method

Publications (2)

Publication Number Publication Date
JPS60117380A true JPS60117380A (en) 1985-06-24
JPH0323948B2 JPH0323948B2 (en) 1991-04-02

Family

ID=16832632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58225651A Granted JPS60117380A (en) 1983-11-30 1983-11-30 Pattern processing method

Country Status (1)

Country Link
JP (1) JPS60117380A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4898886A (en) * 1972-03-29 1973-12-14
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector
JPS55124872A (en) * 1979-03-20 1980-09-26 Hitachi Ltd Noise pattern erase circuit for binary video signal

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4898886A (en) * 1972-03-29 1973-12-14
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector
JPS55124872A (en) * 1979-03-20 1980-09-26 Hitachi Ltd Noise pattern erase circuit for binary video signal

Also Published As

Publication number Publication date
JPH0323948B2 (en) 1991-04-02

Similar Documents

Publication Publication Date Title
JPH0769155B2 (en) Printed circuit board pattern inspection method
JP2000348171A (en) Pattern defect detecting method
JP3585222B2 (en) Inspection equipment using multiple lighting
JPS60117380A (en) Pattern processing method
JPH0481724B2 (en)
JPH04286943A (en) Method and apparatus for inspecting pattern of printed wiring board
JPH0519938B2 (en)
JP2003203218A (en) Visual inspection device and method
JPH0219617B2 (en)
JP4474006B2 (en) Inspection device
JP3265144B2 (en) Method for detecting bleeding in lead print pattern
JP2715634B2 (en) Wiring pattern inspection equipment
JP2812457B2 (en) Inspection equipment for 2D imaging
JPH058762B2 (en)
JPS633499A (en) Method of detecting attachment conditions of electronic parts
JPS6135303A (en) Pattern defect inspecting instrument
JPS58200141A (en) Inspection of substrate
JPH0619252B2 (en) Soldering inspection device for printed wiring boards
JP2850601B2 (en) Printed circuit board pattern inspection equipment
JPS57208153A (en) Inspecting method for defective aluminum pattern of semiconductor or the like
JPS61178606A (en) Photomask inspection
JPS63101973A (en) Formation of reference pattern for inspecting defect in pattern such as printed internal wiring pattern
JPH0263185B2 (en)
JPS58101489A (en) Method and device for inspecting printed circuit board
JPS62174886A (en) Pattern inspection device