JPS60113999A - Part inserting device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Techniques and 11 Fields] The present invention produces parts having lead wires in the same direction in nine dimensions and shapes. This invention relates to the structure of a device that can be embedded into a printed circuit board, etc., regardless of the lead spacing.

[Prior art]

As shown in FIG. 4, a conventional device of this type employs a method of grasping the outer shape of a component 41 to be inserted and inserting it into a board 44. In the insertion process, the positional accuracy of the lead tip is required, but in the example shown in FIG. It is formed. , When cutting, bend the lead wire toward the guide plate, insert 11 toes, and insert groove 45.
It is inserted into the board hole using as a guide.

Since this conventional component insertion device has a structure that grasps the outer shape of the element, it has the following drawbacks.

1) Since the lead tips of the parts are defined by the guide plate 46, the lead spacing of all the target parts must be the same.For parts whose hanging lead spacing differs from the standard value,
Lead and wire forming processing is required in advance. In addition, as shown in Figure 8, in order to unify the lead spacing,
Out of 81 1ζ parts that are molded, 86 parts are not molded.
Compared to this, the height after inserting the part becomes higher, the thickness of the part becomes thinner, and there is a problem of Chapter 1 on b.

2) FIG. 5 shows a state in which the component 51 is inserted adjacent to the already inserted component 56 and the grasping claws 52 are opened. The broken line indicates the position before the inserted part 56 interferes with the opened claw and is bent to the position shown by the solid line. Since the conventional component insertion device uses a method of grasping the external shape of the component, the claws are opened according to the maximum external shape of the component, regardless of the size of each individual component. Normally, the diameter of the non-coaxial parts used is φ5 to φ12.
In my case, the opening of the claws is around 20m1 on the outside of the claws. For this reason, if the distance between the parts is less than 10++, the claws and the inserted parts will interfere, which is not desirable. In order to avoid this interference, there is no choice but to thin out the parts and mount them, and then manually insert the uninserted parts in a later process, or to make the intervals between the parts wider than necessary. The former reduces the automation rate of insertion and increases the number of man-hours, while the latter impedes miniaturization of the product by reducing the packaging density.

3) FIG. 6 shows a case where a component 61 is to be inserted between two already mounted components 66 and 67. In this case as well, with the conventional component insertion device, it is impossible to insert a new component 61 because the guide plate 63 interferes with the already mounted component 66, as shown by the broken line.

As mentioned in 1) to 2) above, the conventional component insertion device grasps the external shape of the element and uses the guide plate to position the lead wires, thereby avoiding interference between the already mounted components and the insertion mechanism. This makes it unsuitable for high-density packaging.

Some parts insertion machines currently on the market use a guide bin for the guide plate.

The mechanism of this device is shown in FIG. During insertion, the guide pin 73 receives the lead tip of the component 71 that protrudes from below through the board hole. After that, the guide bin is lowered together with the parts to guide the leads into the holes. Compared to the device using the guide plate described above, this device can be mounted even if the distance between components is narrow, and is suitable for high-density mounting. However, even in this device 4, the lead spacing of the components must be unified to one type, and the above-mentioned drawback 1) has not been solved. Furthermore, the board hole (lead wire diameter φ0.
5 mm, the guide pin must pass through the hole diameter φl (9 mm is standard), and the guide pin diameter is φ0, 7 mm.
The actual situation is that the guide bin is becoming as thin as 9 mm, the guide bin is frequently bent, and the machine is frequently stopped.

〔the purpose〕

The present invention is intended to solve such problems that conventional component insertion devices had, and its purpose is to stably perform high-density mounting of a single component, which has not been possible with conventional mechanisms. It is about making things possible.

〔overview〕

The component insertion device of the present invention uses a pair of L-shaped claws and directly grasps the lead wire rather than the external shape of the component, thereby achieving both the functions of holding the component and positioning the tip of the lead. It is held in the parts gripping section.

〔Example〕

Figure 1 shows an embodiment of the present invention, in which 1 indicates a component grasping claw, 2
6 is a component to be inserted, 4 is a lead for the component, 5 is a tape for supplying components, and 6 is a board into which the component is inserted.

The packaging of parts with lead wires in the same direction is shown in Figure 1 (a).
The dipping products shown in are common. In the taped state, the lead spacing of component B and the position of 2N degrees with respect to the tape reference hole are accurate.

When cutting the lead along the two-dot chain line 14, by pinching the lead, the positional accuracy of the lead tip is reduced by one point. FIG. 1(b) is a diagram of FIG. 1(a) viewed from the P1 direction.

Next, while grasping the component, the component grasping section is moved to the corresponding insertion position and inserted (FIG. 1(C)).

In the insertion device of the present invention, since the lead wire is grasped directly, there is no need for a guide plate or a guide pin as in conventional component insertion devices.

After inserting the lead tip into the board hole, open the grasping claw and retract the claw from under the component, then push the component to the board surface. For pushing, a component pushing mechanism 2 provided separately from the claw is used. The state in which the pushing of the parts is completed is 1st +Q(a). The reason why the claw is retracted from under the component is that in the state 1 iq (c), the component is lifted from the board surface by the thickness of the claw, and the reason why the pushing mechanism is eccentric with respect to the claw is that when the claw is retracted and This is to position the pushing mechanism on the element in a stretched state.

〔effect〕

The effects of the component insertion device according to the present invention will be described in comparison with conventional component insertion devices.

(Effect 1) High component mounting density. FIG. 2 shows a state in which a component 13 is inserted between already inserted components 14 and 150 using the component insertion device according to the present invention, and the grasping claw 11 is viewed. Since the diameter of the lead wire of the component is φ0.6 to 0.8 mm, the opening amount of the claws by 2 mm is sufficient, and even if the claws are opened, they will not interfere with other parts.

Therefore, components can be mounted close to each other. For comparison, FIG. 6 shows the case of a conventional device. Grasping claw 21
As already mentioned, in order to avoid interference between the guide plate 22 and the guide plate 22, the mutual spacing between the parts must be widened. Comparing FIG. 2 with FIG. 6, it is clear that the component insertion device according to the present invention has superior packaging density.

(Effect 2) No need for front alignment of component lead wires.

The insertion device of the present invention can carry parts with arbitrary lead spacing. Therefore, it is only necessary that the insertion hole spacing and the Ij-dot spacing match, and it is not necessary to make the lead spacing of all parts the same.

(Effect 6) It can handle parts with any number of leads. There is no limit to the number of leads as long as the lead wires are lined up in a line and the length is within the length of the bottom of the grasping claw. Conventional component insertion equipment has a specific lead spacing and number (5im spacing 2
The range of parts that can be mounted can be expanded compared to the case where it is only possible to handle parts with a distance of 2.5y+m or 5 pieces at 2.5y+m intervals.

(Squid fruit 4) The groove construction is simple and highly reliable.

t) On the other hand, with conventional component insertion equipment, the guide pin bandai allows for high-density mounting, but pin breakage is a problem, and the guide plate method cannot support high-density mounting. The superiority of the component inserting device of the present invention, which is capable of performing the following operations and is highly reliable, is obvious.

[Brief explanation of the drawing]

FIGS. 11(a) to 11(u) show parts insertion g I of the present invention.
L! Kazumi E? r1,000 teri. FIG. 2 shows the possibility of high-density mounting of the component insertion device of the present invention, and shows an example of component insertion. FIG. 3 shows the mounting density of a conventional component insertion device for comparison with FIG. 2, and shows an example of component insertion. Volume 41 (a), tb, and (c) are examples of conventional component insertion devices that use guide plates. FIGS. 5 and 6 are examples of component placements that have caused mounting problems in conventional component insertion devices. FIG. 7 shows an example of a conventional component insertion device that uses a guide pin. Fig. 81 is a comparison of the height of a part with a lead T-shape formed and a part without molding after mounting. 1.11...Component grasping claw 21 of the component insertion device of the present invention
．． 42.52...Component grasping claw 2 of conventional component insertion device
．． 72...Pushing mechanism 3.13, 14, 15, 23, 24, 25, 41, 51
,56,61゜71.81.86 ・・・・・・Parts 66.67 ・・・Other mounted parts (Drp etc.) 4・
・Lead wires for parts 5 ・Tape for raw materials 6.16, 25
44, 54, 64, 74.84... substrate 22.45,
53.65...Guide plate 76...Guide pin or above C0-) ('ct') Ko C (d) Shock 7 Figure 8

Claims (1)

[Scope of Claims] (A component insertion device characterized by comprising 11 component grips 41M f4B or a pair of L-shaped claws. The component insertion device according to claim 1, characterized in that the component pushing mechanism is mounted at a position where the components do not overlap. (3) The grip;
Degree of freedom (any position in 3D space!Transfer to thickness, help/stop,
and a rotational movement around a vertical axis at the tip and stopping at an optional q rotation angle). Parts insertion device.