JPS60111058U - semiconductor laser equipment - Google Patents
semiconductor laser equipmentInfo
- Publication number
- JPS60111058U JPS60111058U JP20147083U JP20147083U JPS60111058U JP S60111058 U JPS60111058 U JP S60111058U JP 20147083 U JP20147083 U JP 20147083U JP 20147083 U JP20147083 U JP 20147083U JP S60111058 U JPS60111058 U JP S60111058U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- correction plate
- laser equipment
- cap
- astigmatism correction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の説明に供する半導体レーザの光学系を
示す断面図、第２図は第１図の半導体レーザの接合面に
垂直な面に沿う断面図、第３図は平行平面ガラスによる
非点収差の補正を説明する図、第４図は本考案による半
導体レーザ装置の実施例を示す平面図、第５図はその断
面図、第６図は半導体レーザ装置を光学レンズ系に組込
んだ状態の断面図である。
１．１１は半導体レーザチップ、１２は支持台、１３は
窓、１４はキャップ部、１７は非点収差補正板、１８は
凹部である。
第３図
第４図Fig. 1 is a cross-sectional view showing the optical system of a semiconductor laser used to explain the present invention, Fig. 2 is a cross-sectional view of the semiconductor laser shown in Fig. 1 along a plane perpendicular to the bonding surface, and Fig. 3 is a cross-sectional view of the semiconductor laser shown in Fig. 1. A diagram explaining the correction of astigmatism, FIG. 4 is a plan view showing an embodiment of the semiconductor laser device according to the present invention, FIG. 5 is a cross-sectional view thereof, and FIG. 6 is a diagram showing the semiconductor laser device incorporated into an optical lens system. FIG. 1.11 is a semiconductor laser chip, 12 is a support base, 13 is a window, 14 is a cap portion, 17 is an astigmatism correction plate, and 18 is a concave portion. Figure 3 Figure 4
Claims (1)
体レーザチップから導出されるレーザ光の非点収差補正
板が窓部に所定角度類）＞て配されたキャップ部とを有
し、前記非点収差補正板によって前記非収差が補正され
る如く前記キャップ部の外周部を除゛く部分に位置合せ
部を形成して成る半導体レーザ装置。It has a support base on which a semiconductor laser chip is mounted, and a cap part in which an astigmatism correction plate for a laser beam derived from the semiconductor laser chip is disposed at a predetermined angle in a window part, and the astigmatism correction plate A semiconductor laser device comprising an alignment portion formed in a portion of the cap portion excluding an outer peripheral portion so that the aberration is corrected by a correction plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20147083U JPS60111058U (en) | 1983-12-28 | 1983-12-28 | semiconductor laser equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20147083U JPS60111058U (en) | 1983-12-28 | 1983-12-28 | semiconductor laser equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60111058U true JPS60111058U (en) | 1985-07-27 |
Family
ID=30763290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20147083U Pending JPS60111058U (en) | 1983-12-28 | 1983-12-28 | semiconductor laser equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60111058U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7417937B2 (en) | 2004-02-10 | 2008-08-26 | Funai Electric Co., Ltd. | Optical pickup apparatus |
-
1983
- 1983-12-28 JP JP20147083U patent/JPS60111058U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7417937B2 (en) | 2004-02-10 | 2008-08-26 | Funai Electric Co., Ltd. | Optical pickup apparatus |
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