JPS60106817A - Polyamide resin composition and production of polyamide resin molding therefrom - Google Patents

Abstract

PURPOSE:A resin composition providing a lowly water-absorptive polyamide resin molding, prepared by mixing a linear polyamide with a specified hydrophobic polymer. CONSTITUTION:About 1-50pts.wt. hydrophobic polymer containing at least 1.05 aliphatic unsaturated bonds on the average in the molecule, having a MW <=3,000, and having a SP value of about 7-10 is melt-blended with 100pts.wt. linear polyamide (e.g., nylon 6). The obtained resin composition can form a molding low in water absorption and excellent in water resistance, heat resistance, creep resistance, etc., by molding the composition and crosslinking the molding by irradiation with a radiation (e.g., electron beams).

Description

DETAILED DESCRIPTION OF THE INVENTION Technical field The present invention is a polyamide 1υ (fat composition 1υ) which forms a polyamide 1 fat with low water absorption and a polyamide 4 fat molded product using the same. Do 1.

Conventional technology Polyamide 1 resin is an excellent engineering plastic that is strong and has a self-staining property of 4"Q?+i, and is oil resistant and defect resistant. This polyamide resin has high water absorption, and when it absorbs water, it becomes 1! The hydrogen bond between the amide bonds of +1 fat is broken.When the hydrogen bond between the uamide bonds is broken, the strength of 2 is greatly reduced to 1i+Q, and the dimensions of 2 are greatly changed.

In order to improve these shortcomings, the Special Publication No. 40-7380
The publication discloses a resin in which a styrene-acrylonitrile copolymer is mixed with polyamide. There is also a description of polyamide alloys in Plastics Vol. 32, No. 8, 65 (1981). There.

It has been shown that the water absorption of polyamide resins can be reduced by mixing hydrophobic polymers.

Hydrophobic polymer and 4? In order to increase the compatibility of IJ amide, polar groups are introduced into this hydrophobic polymer.

In order to lower the water absorption of polyamide resin, it is effective to add a water-freezing polymer as described above. However, the phase of the hydrophobic polymer and the polyamide resin has a τ property, and in order to improve this, polar moss is introduced into the +b14 water injection polymer as described above. However, when a polar group is introduced into a hydrophobic polymer, the water absorption of the aqueous polymer itself increases. Therefore 'C
1. The conventional method described above has a limit in reducing the water absorption of polyamide 1fil lI+r. Also, +l+li
71 (Note: By adding polymer.

The 11■1 thermal 0 strength and creep properties of polyamide 4iil resin also have a negative impact.

OBJECTS OF THE INVENTION An object of the present invention is to provide a composition and material that can form a polyamide resin with low water absorption while retaining the excellent properties of the polyamide resin. The object of 1 (IJ) of the present invention is to provide a composition capable of forming a polyamide resin having excellent heat resistance and creep properties.A further object of 41j of the present invention is to provide a polyamide resin molded article with low water absorption. Another object of the present invention is to provide a method for using #[h].
The purpose of this invention is to provide a method for producing polyamide resin molded products with excellent heat resistance and creep properties.

SUMMARY OF THE INVENTION The present invention involves adding a polymer having an aliphatic unsaturated bond in the molecule as a hydrophobic polymer to a polyamide, molding it, and then further polymerizing the hydrophobic polymer with radiation.
This was completed based on the inventor's knowledge that the water absorption of polyamide can be suppressed by providing it with a crosslinking structure. therefore.

The polyamide composition of the present invention includes a linear polyamide.

The above-mentioned object is achieved by containing a hydrophobic polymer having aliphatic unsaturated bonds in the molecule at an average ratio of 1.05 or more and a molecule:11 of 3000 or less.

In addition, the method for producing a polyamide resin molded product of the present invention is characterized in that the linear polyamide and the molecule have a molecular weight of q; A step of mixing a polyamide composition containing a hydrophobic polymer having a hydrophobic polymer of 3,000 or less with a warm wire above the 1hJB point J'J of the I'11 composition to obtain a mixed material; molding the mixed material. The process τ and the process 4 for irradiating the radiation pattern are capable of A', and thus the above objective is achieved.

The linear polyamide contained in this product is a polyamide 1δJ++i1 which mainly has amide bonds, such as 1, for example, the product name Nylon 6, the product name There are names such as Noiron 66.

1 ill of the present invention! The water-based polymer has a molecular weight of 3000
It is essential that the following is true. If the molecular weight is less than 30,001υ, the compatibility with the polymer will be excellent. When a low molecular weight polymer with a molecular weight of 300 + 1 or less is mixed with polyamide, the heat resistance of the entire fat will decrease. Creep: It is normal for the i property to decrease.

However, in the present invention, we take advantage of the fact that this hydrophobic polymer has unsaturated bonds, and crosslink it by irradiating it with radiation (1
The 1# structure is created to improve water resistance, iM heat resistance, and creep properties. The molecular weight of this hydrophobic polymer is preferably 1500 or less.

When the molecular weight of this hydrophobic polymer exceeds 3000.

Poor compatibility with polyamide. This hydrophobic polymer also has a carbon-carbon 2m bond at the end or side chain of one molecule. The average number is 1.05 or more, preferably 1.5 or more per molecule. Linear +C below 1.05
However, the crosslinked structure is not sufficiently formed, and a resin with excellent heat resistance and creep customization cannot be obtained. This hydrophobic polymer has a polarity of 7 to 10, preferably 8 to 10 for SPflTF.
It is 9.5. The addition ratio is 1 to 50 parts by weight per 100 parts by weight of polyamide.

Preferably it is 5 to 30@i parts.

The polyamide composition of the present invention can also contain appropriate amounts of reinforcing fibers, fillers, etc., if necessary.

The method for producing the polyamide ffB'IN molded article of the present invention is as follows.

kneading the polyamide composition above the melting point of the composition,
Step 11) of mixing the mixed material, molding the mixed material into the desired shape (this refers to the step of irradiating with radiation). Gamma rays, ultraviolet rays.

Electron beams, etc. are used. γ) Mathematics and electron beams are preferably used.

Example Below are Kizu and Akira fruit 11! An example i will be explained.

Example 1 Nylon 6 (manufactured by Kaishishiki Company 7) was used as polyamide resin.
Mira 7 CM 1021) 100 'fi'jj
+tN3offi a=L.

To this was added 1,2-polybutadiene (1000 for molecules) and styrene E-Tsummer-10 weight f?B and heated to uniformly loosen the mixture.After cooling, it formed into a flat plate with a thickness of 1 lung.

A part of the flat surface was cut out and irradiated with 10 Mrad of C city electrons. The irradiated plates were each immersed in warm water at 60° C. for 48 hours, and the water absorption rates were determined by the difference in the strength of the previous and subsequent placements. The strength at room temperature at the humidity of 4'.1 o'clock was also determined. The results are shown in Table 1. Furthermore, regarding the flat plate irradiated with electron beam.

During drying, a stress isow/- was applied at room temperature, and the creep strain was determined to be constant in oil. The strength when dry was also measured. The results are shown in Table 2.

Implementation) 112 20ffl of a compound having the following structure (average number of unsaturated groups: 2.0; molecular weight: approximately 512) in which methacrylic acid is added to the molecular end of bisphenol type epoxide instead of 1,2-polybutadiene and styrene monomer. Everything is the same as Kotobuki I Commercial Example 1 except that it was used.

Comparative Example A flat plate was formed using only nylon 6 and irradiated with electron beams. Its water absorption and strength are shown in Table 2.

Table 1 Table 2 Effect of the invention The PoIJ7 mido bristle composition of the present invention is thus prepared.

Co-produce a small polymer with 11" Q (Q-like molecules) as hydrophobic poly 7-1). Therefore, it is preferable to combine this hydrophobic polymer with polyamide. The hydrophobic polymer is Un+t?o: 9 because there is a li+ bond
When the composition of the present invention is irradiated with radiation, the hydrophobic polymers form a bridge structure with each other, resulting in a further improvement in the phase 1 and A to the polyamide. and effectively suppress water penetration1li11 'q'
/,)be able to. In the case of fil, 97 people of the acid-contained polyamide resin product of the present invention, the above-mentioned hydrophobic L polymers are polymerized and crosslinked with each other through a radiation irradiation step.

The resulting polyamide molded product has excellent water resistance, heat resistance and creep properties.

that's all Applicant: Sekisui Chemical Co., Ltd.

Claims (1)

[Claims] 11.3-type polyamide and 9 molecules of fat 11. A polyamide composition containing a hydrophobic 17I polymer having molecular stitches of 3000 J and below. 2. West 11^J1Tun aqueous polymer before iJJ polyamide 100" bar total 1; l (literally 1 ~ 50 medium:,
:: Part n'p11 of patent claim 1lii' that can be combined with M
+ 1111, 'α [composition described in JJ'1. 3, 1: M-shaped HO IJ)-MiF t, min-7-in +
Ukyun 1. +15+
1111y with a molecular excitement of 3000 or less, /
A polyamide composition containing poly7- and
A step of kneading the kneaded material at a temperature above the temperature of the acid and forming the kneaded material; A step of forming the kneaded material; 4. A method of manufacturing a polyamide molded product. 4. A method of manufacturing a polyamide molded product. The method according to claim 3. 5. The method according to claim 3, wherein the radiation is ionizing radiation.