JPS60103829U - Thermal conductive elastic sheet - Google Patents
Thermal conductive elastic sheetInfo
- Publication number
- JPS60103829U JPS60103829U JP19679383U JP19679383U JPS60103829U JP S60103829 U JPS60103829 U JP S60103829U JP 19679383 U JP19679383 U JP 19679383U JP 19679383 U JP19679383 U JP 19679383U JP S60103829 U JPS60103829 U JP S60103829U
- Authority
- JP
- Japan
- Prior art keywords
- elastic sheet
- conductive elastic
- thermally conductive
- wafer
- thermal conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案の熱伝導性弾性シートの実施例の部分
拡大平面図、第２図は同部分拡大縦断面図、第３図はこ
の考案の熱伝導性弾性シートの使用状態を示す縦断面図
、第４図は第３図に示すものの要部拡大縦断面図、第５
図は他実施例の第１図相当図、第６図は同じく第２図相
当図である。Fig. 1 is a partially enlarged plan view of an embodiment of the thermally conductive elastic sheet of this invention, Fig. 2 is an enlarged longitudinal cross-sectional view of the same part, and Fig. 3 is a longitudinal cross-section showing the usage state of the thermally conductive elastic sheet of this invention. Figure 4 is an enlarged vertical cross-sectional view of the main part shown in Figure 3;
The figure is a diagram corresponding to FIG. 1 of another embodiment, and FIG. 6 is a diagram corresponding to FIG. 2.
Claims (1)
からの熱をディスクに逃がすべくウェハとディスク面間
に介在させる熱伝導性弾性シートにおいて、上面の全域
に同一高さに突出する凸部が設けられ、この凸部のウェ
ハ下面に接する上部面は曲面構成左されている熱伝導性
弾性シート。 ２ シリコンゴム製またはフッ素ゴム製である実用新案
登録請求の範囲第１項記載の熱伝導性弾性シート。 ３ 凸部が独立して多数存在し、その凸部面が球面であ
る実用新案登録請求の範囲第１項記載の熱伝導性弾性シ
ート。[Claims for Utility Model Registration] 1. In a thermally conductive elastic sheet interposed between the wafer and disk surface to release heat from the wafer to the disk during ion implantation in an ion implantation device, the entire upper surface has the same height. A thermally conductive elastic sheet is provided with a protruding portion, and the upper surface of the protruding portion in contact with the lower surface of the wafer has a curved surface configuration. 2. The thermally conductive elastic sheet according to claim 1, which is made of silicone rubber or fluororubber. 3. The thermally conductive elastic sheet according to claim 1, wherein there are a large number of independent convex portions, and the convex portion surfaces are spherical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19679383U JPS60103829U (en) | 1983-12-20 | 1983-12-20 | Thermal conductive elastic sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19679383U JPS60103829U (en) | 1983-12-20 | 1983-12-20 | Thermal conductive elastic sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60103829U true JPS60103829U (en) | 1985-07-15 |
Family
ID=30422004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19679383U Pending JPS60103829U (en) | 1983-12-20 | 1983-12-20 | Thermal conductive elastic sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60103829U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10177964A (en) * | 1996-12-18 | 1998-06-30 | Shin Etsu Chem Co Ltd | Platen for ion implanter |
| JP2003511856A (en) * | 1999-10-01 | 2003-03-25 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | Surface structure and manufacturing method thereof, and electrostatic wafer clamp incorporating surface structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582771A (en) * | 1978-12-20 | 1980-06-21 | Toshiba Corp | Ion implanting device |
| JPS55127034A (en) * | 1979-03-16 | 1980-10-01 | Varian Associates | Device for mechanically urging semiconductor wafer to soft thermoconductive surface |
-
1983
- 1983-12-20 JP JP19679383U patent/JPS60103829U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582771A (en) * | 1978-12-20 | 1980-06-21 | Toshiba Corp | Ion implanting device |
| JPS55127034A (en) * | 1979-03-16 | 1980-10-01 | Varian Associates | Device for mechanically urging semiconductor wafer to soft thermoconductive surface |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10177964A (en) * | 1996-12-18 | 1998-06-30 | Shin Etsu Chem Co Ltd | Platen for ion implanter |
| JP2003511856A (en) * | 1999-10-01 | 2003-03-25 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | Surface structure and manufacturing method thereof, and electrostatic wafer clamp incorporating surface structure |
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