JPS60101949A - Cleavage opening apparatus for semiconductor crystal plate - Google Patents

Abstract

PURPOSE:To obtain a chip having the cleavage surface without damaging substrate surface by providing the recessed surface and the flat surface connected thereto to the surface of pedestal which forms a semiconductor cleavage opening apparatus, a slide glass is attached to the semiconductor substrate while it is held on the flat surface with the cleavage opening surface is exposed, and breaking the substrate at the cleavege surface and then dropping it into the recessed surface. CONSTITUTION:A flat surface and a recessed surface connected thereto are formed on the surface of pedestal 12 which forms a semiconductor cleavage opening apparatus, a slide glass fixing base 16 is provided to the end part of flat surface and two sheets of slide glass 14 holding the semiconductor substrate 1 are protruded therefrom in parallel to the pedestal 12. Next, while the area being apart from the cleavage opening area is exposed between such two sheets of glass 14, the semiconductor substrate 1 is held, the substrate 1 is broken by the end part of glass 14 and it is then dropped into the recessed surface 13. Thereby, the lower surface 1b of broken substrate does not entirely in contact with the pedestal 12, only the end part is in contact with the recessed surface 13 and edge of pedestal 12. Accordingly, any contamination and damage is not generated on the surface of substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for cleaving a semiconductor crystal plate, which is often used in manufacturing semiconductor devices.

(Structure of conventional example and its problems) In recent years, the need for semiconductor crystal plate cleaving devices has been increasing. When fabricating an element by growing crystals on a semiconductor crystal plate or fabricating an element by fabricating electrodes, it is essential that the semiconductor crystal plate be cleaved without strain and in a clean environment.

Moreover, the conditions during cleaving affect the yield of the semiconductor crystal plate and the quality of the characteristics of the manufactured devices.A conventional semiconductor crystal plate cleaving apparatus will be described below. When separating a part of the semiconductor crystal plate by cleavage, as shown in FIG.
Write about the length of ~3 poems.

Next, the crystal plate is transferred to two glass slides 14 of a semiconductor crystal plate cleaving apparatus 10, which includes a table 12, a slide glass 14, a slide glass fixing table 16, etc., as shown in FIG.
Incorporate more. At that time, the groove 2 made in the semiconductor crystal plate 1
so that it overlaps the end surface 14a of the slide glass. A glass slide] 4 is fixed firmly, and the end of the semiconductor crystal plate 1 that is far from the slide glass is held down, thereby opening the semiconductor crystal plate 1 in a plane including the groove 2.

However, in the above configuration, the semiconductor crystal plate 1 is
When the crystal plate falls onto the table 12, the entire surface of the crystal plate comes into contact with the surface 12a of the table 12, and as a result, the surface of the crystal plate is damaged by the fine particles of GaAs released during cleaving. Problems arise such as dust and dirt on the surface of the semiconductor crystal board sticking to the semiconductor crystal board. This causes a loss in the flatness and specularity of the semiconductor crystal plate, which significantly impairs the electrical properties, optical properties, and in-wafer yield of devices fabricated using the semiconductor crystal plate. It turns out.

(Object of the Invention) The present invention solves the above-mentioned problems, and provides a semiconductor crystal plate cleavage device that can perform cleavage without impairing the cleanliness, specularity, and flatness of the surface of the semiconductor crystal plate. The purpose is to provide the following.

(Structure of the Invention) In order to achieve the above object, a semiconductor cleavage device of the present invention includes a clamping body that clamps a semiconductor crystal plate from both sides, and a pedestal having an upwardly concave surface, The cleavage is held by the concave surface, and with this configuration, cleavage can be performed without impairing the cleanliness, specularity, and flatness of the surface of the semiconductor crystal plate. .

(Description of Examples) Examples of the present invention will be specifically described below. FIG. 3 shows an example of an embodiment of the present invention. The semiconductor cleavage apparatus 10 includes a table 12, a slide glass 14 for sandwiching the semiconductor crystal plate 1, and a slide glass fixing table 16. The surface of the table 12 has a constant depth in the direction parallel to the cleavage plane. A concave surface i3 whose depth varies in the vertical direction is provided.

Therefore, if there is a gap or the semiconductor crystal board 1 falls,
The surface 1b of the semiconductor crystal plate 1 is in contact with the surface on the table 12 of the cleavage device through two straight lines. Moreover, one of the lines is a straight line where the semiconductor crystal plate surface 1b and the cleavage plane intersect, and the cleanliness, specularity, and flatness of the semiconductor crystal plate surface are almost unchanged before and after the cleavage.

FIG. 4 shows another embodiment of the present invention in which the concave surface is a spherical surface. In this embodiment, the radial dimension of the concave surface treatment 3 is larger than the length dimension of the cleaved semiconductor crystal plate 1 as shown in the figure, and a portion of it may be located below the slide glass 14. That's what I do. In this case, as shown in FIG. 4(b), the entire semiconductor crystal plate 1 with a gap will not fall into the concave surface 13, and therefore, the contact portions will also be placed at the four corner points. Since the contact occurs, the semiconductor crystal plate surface 1b is completely protected.

FIG. 5 further shows another embodiment of the present invention,
In this example, the four surfaces 13 are formed by a plurality of planes, and even if the reeds and concave surfaces 13 are formed in this manner, substantially the same effect as in the case of FIG. 3 can be obtained, and the processing is also easy.

(Effects of the Invention) As described above, in the semiconductor crystal plate cleaving apparatus of the present invention, a concave surface is provided on the table on which the semiconductor crystal plate falls, thereby improving the cleanliness of the semiconductor crystal plate surface.

The specularity and flatness are not impaired, and the practical effect is great.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a semiconductor crystal plate for explaining one of the cleaving operations, Fig. 2 is a sectional view showing a conventional example of a semiconductor cleaving device, and Figs. 3 (a) and (b) are the present invention. FIG. 4(a) is a cross-sectional view showing cleavage cutting and cleavage thinning of a semiconductor cleavage apparatus as one embodiment of the present invention. 5(a) l b) is a cross-sectional view of a semiconductor cleavage apparatus as another embodiment of the present invention without showing cleavage and cleavage. 1... Semiconductor crystal plate, 10... Semiconductor cleavage device,
12...stand, 13...concave surface, 14...slide glass, 16...slide glass fixing stand. Figure 1 1a Figure 2 Figure 3 (0) (b) Figure 4 (a) (b) Figure 5 (a) ■ (b)

Claims (3)

[Claims] (1) Semiconductor crystal plate cleavage device comprising a clamping body that holds a semiconductor crystal plate from both sides and a pedestal having an upwardly concave surface, and the semiconductor crystal plate is held by the concave surface. Device. (2) A special feature characterized by a concave surface forming a spherical surface.
1. A semiconductor crystal plate cleaving device according to claim (1). (3) The semiconductor crystal plate cleaving device according to claim (1), wherein the concave surface is composed of a plurality of flat surfaces.