JPS5999734A - Conveyor for wafer - Google Patents
Conveyor for waferInfo
- Publication number
- JPS5999734A JPS5999734A JP20995982A JP20995982A JPS5999734A JP S5999734 A JPS5999734 A JP S5999734A JP 20995982 A JP20995982 A JP 20995982A JP 20995982 A JP20995982 A JP 20995982A JP S5999734 A JPS5999734 A JP S5999734A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafers
- transport
- instructions
- storage case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は半導体製造の□隙に、各製造装置間のウェーハ
搬送を自動化することによ“二て、製造工程の流れを円
滑にし、生産効率を向上させるためのウェーハ搬送装置
に関するものである。 □ ：近年の超ＬＳＩには
高性能特□性仕様を−だす高品質な製品が望まれている
。この様な超Ｌ Ｓ Ｉ ’４実現するだめの製造技術
も多様化、筒皮化の傾向□にある。超ＬＳＩのオＵ用技
術もコンビーータのｃｐｕ 、メモリ□周辺機器、純主
機器等広かり全み填□、製造工程も３′００〜５００に
も及び、製造上第４の流れの管理勿まず−１：す煩雑に
している。この様な背景のもとて行うウェ−ハ搬送は製
造手Ｊｌ＠＋のミスや製造条件設定のミスが生じゃ丁い
という環境にあり、その釣応としてコシピューク管′坦
しこよる工程管理システムの開発が考えられている。DETAILED DESCRIPTION OF THE INVENTION The present invention takes advantage of the gap in semiconductor manufacturing by automating wafer transfer between each manufacturing device. It is related to transport equipment. □: In recent years, high-quality products with high performance characteristics are desired for VLSI.The manufacturing technology necessary to realize such VLSI '4 is also required. There is a trend □ of diversification and cylindrical packaging.The technology for ultra-LSI OU is also widely available, including converter CPUs, memory □peripheral equipment, and pure main equipment □, and the manufacturing process is also increasing from 3'00 to 500. In addition, the management of the fourth flow in manufacturing is of course -1: It is complicated.Wafer transfer performed under such a background is prone to mistakes on the part of the manufacturing staff and mistakes in setting the manufacturing conditions. As a response to this difficult environment, the development of a process control system based on the Kosipyuuk tube is being considered.
工程管ｊ」システムは出来るだけ自動化することによっ
て入手介入によって生ずるミス’ｔ；２＜すことを狙ら
いとしているが、□そのためには、正しい作業手・順に
従って次に処理１ナベき装置゛までウェ□−ハを搬□送
する手段が必要と廃る。ウェーバ搬送は単にウェーバを
運ぶというだけでは不充分でコンビーータの管理□によ
りウェーハの流し方を、状況に応じて操作′″′ｃ′き
る様なフレキシブルな搬送機能が必要である。
′ □具体的には、各ａｆｔ工□
−ハの中で、優先市に処理すべきものは元に搬送させる
とか、同一条件のウェーハはまとめて順序良く搬送させ
るとかの機能でるる。ウェーハ搬送が自動化され、入手
介入がなくなることは単にミスの防止、工数８１Ｊ減効
果だけでなく、塵埃も少なくなり、品質向上、歩留シ向
上に大きな効果をもたらす。The process control system aims to eliminate mistakes caused by acquisition intervention by automating as much as possible. This eliminates the need for a means to transport the wafers up to the point. For wafer transport, it is not enough to simply transport the wafer; a flexible transport function is required that allows the wafer to be flown according to the situation by controlling the combeater.
' □Specifically, each aft construction□
- Among the wafers, there is a function that allows wafers to be processed in priority areas to be transported back to the original location, and wafers with the same conditions to be transported together in an orderly manner. Automating wafer transport and eliminating acquisition intervention not only prevents mistakes and reduces man-hours by 81J, but also reduces dust, which has a significant effect on improving quality and yield.
以上の問題に対処するために、搬送装置の開発が試みら
れている、ベルトコンベア方式、エアフローシュータ方
式、さらにこれらを組み合わせたベルトコンベア、エア
フローシュータ方式方式かある。In order to deal with the above-mentioned problems, attempts have been made to develop conveying devices such as a belt conveyor system, an air flow shooter system, and a combination of these systems, such as a belt conveyor system and an air flow shooter system.
ＩＢＭて開発されたＱ ’ｆ’ Ａ Ｔ製造ラインでは
、エアフローシー−り方式が利用され、コンピ−タによ
る流れの管理が行われている、しかし現在のところ搬送
装置それ自身に、（Ｒｅれを自由に市１」偶ｊできる機
能かないために先入れ先出しといった単純な搬送管理し
かできないのが実情でるる。The Q 'f' AT manufacturing line developed by IBM uses an airflow sheathing system, and the flow is controlled by a computer. Since there is no function that allows the transportation to be carried out freely, the reality is that only simple transportation management such as first-in, first-out is possible.
本発明は上記の点に着目してなされたものであり集積回
路の生涯工程における作業手順のミス、情報管理の煩雑
化を防ぎ工程管理することＶＣ工って主属の効率化をは
かるためのウェーハ搬送装置を提供することを目的とす
るものである。The present invention has been made with attention to the above points, and is intended to prevent errors in work procedures and the complication of information management in the life process of integrated circuits, to manage processes, and to improve the efficiency of main components through VC engineering. The object of the present invention is to provide a wafer transfer device.
本発明の特徴は、ウェーハをのせ平面上″Ｔ：杉送でき
る搬送ラインとその平面に垂直又は垂直に近い角度を移
シ１できる可動式ウェーハ格納ケースとを組み名わせ、
情鴇処理装しからの指示に工って搬送ラインと同ル」を
とシながら当該ウェーハ格納ケースから特定の一軟又は
抜数枚のウェーノ・の与搬送ラインにとりだし口」能と
したことでめる。The feature of the present invention is that it combines a transport line that can carry wafers on a flat surface and a movable wafer storage case that can move at an angle perpendicular or close to perpendicular to the plane.
Based on the instructions from the processing equipment, an opening was created to take out a specific wafer or several wafers from the wafer storage case while keeping the same line as the transport line. Demeru.
以下本発明の実施例を参照しながら詳細に説明する。The present invention will be described in detail below with reference to embodiments.
詑１図は本発明のウェーノ・販送装置である。１は搬送
ラインでウェーハは搬送ラインにのって左右に＃勤され
る。２は可動式ウェーノ・格納ケースで、ｌの搬送ライ
ンでのウェーハの（ｂ＠に対し、垂直方向に移動できる
。この格鼾１ケースの中には２１のウェーハ格納板が複
数枚あり、７の情報処理からの指示に従って粕定のウェ
ーハ一枚が選択さｒし、搬送ラインに移送できる位置１
で格納ケースが上下移動する。５及び６は格納ケースと
１Ｆｉ報処理装置とのインターフェース及び搬送ライン
と情報処理装置とのインターフェースである。３及び４
は搬送ライン及び格納ケースを駆動きせる制御機構で、
ｒ：）Ｕ、７の情報処理装ｆｉｆがらの指示が２２〜２
５の信号醐？］ｌ−経由してこの制徊ｌ磯祐まで伝搬さ
れる。Figure 1 shows the waeno/distribution device of the present invention. 1 is a transfer line, and wafers are moved left and right on the transfer line. Reference numeral 2 is a movable wafer storage case, which can be moved in the direction perpendicular to the (b@) of the wafers on the transport line l.In this case, there are multiple 21 wafer storage plates; According to the instructions from the information processing, one wafer is selected and moved to position 1 where it can be transferred to the transfer line.
The storage case moves up and down. 5 and 6 are interfaces between the storage case and the 1Fi information processing device, and interfaces between the conveyance line and the information processing device. 3 and 4
is a control mechanism that drives the transport line and storage case.
r:) Instructions from the information processing device fif of U, 7 are 22-2
5 signal go? ]l- This control is propagated to Isosuke.
第２図は製造装置１１から製造装置１２にウェーハが搬
送される葦での動きｔ説明した図である。FIG. 2 is a diagram illustrating the movement of reeds in which a wafer is transferred from the manufacturing apparatus 11 to the manufacturing apparatus 12.
製造装置１１で処理が終了したウェーハは搬送ラインに
のシ２の格納ケースに送られ、２１の格納板のうちａの
位置に乗せられたとする。つづいて製造装置１１で処理
されたウェーハが順次ｂ −ｅの格納板に乗さられだも
のとする。製造装置１２で処理すべきウェーハは情報処
理装置からの指示に従、りて格納板ａ −ｅのウェーハ
の中から選択される、選択されたウェーハが搬送ライン
にのせら牡る位置までウェーハ格納ケースが移動する。It is assumed that the wafer that has been processed in the manufacturing apparatus 11 is sent to the storage case 2 on the transfer line and placed on position a of the 21 storage plates. Next, it is assumed that the wafers processed by the manufacturing apparatus 11 are sequentially placed on storage plates b to e. Wafers to be processed by the manufacturing device 12 are selected from among the wafers on storage plates a to e according to instructions from the information processing device, and the wafers are stored until the selected wafer is placed on the transfer line. The case moves.
搬送ラインと格納ケースとは同期がとられウェーハの移
送に支障、ダないようになっている。The transfer line and storage case are synchronized to avoid any hindrance to wafer transfer.
ウェーハ選択の基準は製造装置１２で処理するウェーハ
の優先度、装量能力等によって決められている。The criteria for wafer selection is determined by the priority of wafers to be processed by the manufacturing apparatus 12, loading capacity, etc.
第３図（ａ）、 （ｂ）は各々搬送ラインにおける搬送
方式ニついての一例を示したもので、（ａ）のベルトコ
ンベア方式、Φ）のエアフローシュータ方式及ヒソれら
の組み合わせの混合方式が使用される。第３図（ｂ）の
エアフローシュータ方式はエア噴出口をもち、エアの方
向及び圧力によってウェーハの搬送をコントロールして
いる。Figures 3 (a) and 3 (b) each show an example of the conveyance system in the conveyance line, including (a) the belt conveyor system, Φ) the air flow shooter system, and a mixed system of these combinations. is used. The air flow shooter system shown in FIG. 3(b) has an air jet port, and wafer transport is controlled by the direction and pressure of the air.
以上説明したごとく本発明によれば、ウェーハの流れ制
御を可能とするウェーハ搬送装置が実現でき、工程管理
の効率化がはかられ、ミスの少ない高品質の集積回路製
作が可能となる。As described above, according to the present invention, it is possible to realize a wafer transport device that enables wafer flow control, improves the efficiency of process management, and makes it possible to manufacture high-quality integrated circuits with fewer mistakes.
本発明は搬送ラインと可動ウェーハ格納ケースとがコン
ピュータの指示のもとで同期して動くことを特長として
いて搬送されるものが、集積回路のウェーハに必ずしも
限定されない。The present invention is characterized in that the transport line and the movable wafer storage case move synchronously under instructions from a computer, and the objects to be transported are not necessarily limited to integrated circuit wafers.
第１図は本発明のウェーハ搬送装置の実施例。
１は搬送ライン、２ば可動式ウェーハ格納ケース３は搬
送ライン制御機構、４は格納ケース制御機構、５，６は
インターフェース、７は情報処理装置、２１はウェーハ
格納板、２２〜２５は信号線。
第２図はウェーハ搬送装置の動作手順を説明した図で、
１１．１２が製造装置。第３図（ａ）、 （ｂ）は各々
搬送ラインの実施例で、８はベルトコンベア方式の搬送
ベルト、９はエアフローシューク方式のエア噴出口、ｌ
Ｏはウェーハである。
第１目FIG. 1 shows an embodiment of the wafer transfer device of the present invention. 1 is a transfer line, 2 is a movable wafer storage case 3 is a transfer line control mechanism, 4 is a storage case control mechanism, 5 and 6 are interfaces, 7 is an information processing device, 21 is a wafer storage plate, and 22 to 25 are signal lines . Figure 2 is a diagram explaining the operating procedure of the wafer transport device.
11.12 is the manufacturing equipment. Figures 3(a) and 3(b) each show an example of the conveyance line, where 8 is a belt conveyor type conveyor belt, 9 is an air flow shoe type air outlet, and l.
O is a wafer. 1st eye
Claims (1)
、該平面に垂直方向に移動する□可動式ウェーハ格納ケ
ースとが組み合わせられ、情報処理装置からの指示によ
って前記搬送ラインと同期して前記ウェーハ格納ケース
から特定の一枚又は蓑数枚のウェーハが前記搬送ライン
にとりだされることを特徴とするウェーハ１送装置。□
□ ：□ ■霞 。A transport line that can carry semiconductor wafers and transport them on a plane is combined with a movable wafer storage case that moves perpendicular to the plane, and the wafer storage case is moved in synchronization with the transport line according to instructions from an information processing device. A wafer transport device characterized in that a specific wafer or several wafers are taken out to the transport line. □
□ :□ ■Kasumi.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20995982A JPS5999734A (en) | 1982-11-30 | 1982-11-30 | Conveyor for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20995982A JPS5999734A (en) | 1982-11-30 | 1982-11-30 | Conveyor for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5999734A true JPS5999734A (en) | 1984-06-08 |
Family
ID=16581498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20995982A Pending JPS5999734A (en) | 1982-11-30 | 1982-11-30 | Conveyor for wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999734A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52139378A (en) * | 1976-05-17 | 1977-11-21 | Hitachi Ltd | Integrated treatment apparatus for semiconductor wafers |
| JPS5681402A (en) * | 1979-11-12 | 1981-07-03 | Shinkawa Ltd | Apparatus for feeding and carrying-out of sample |
-
1982
- 1982-11-30 JP JP20995982A patent/JPS5999734A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52139378A (en) * | 1976-05-17 | 1977-11-21 | Hitachi Ltd | Integrated treatment apparatus for semiconductor wafers |
| JPS5681402A (en) * | 1979-11-12 | 1981-07-03 | Shinkawa Ltd | Apparatus for feeding and carrying-out of sample |
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