JPS5999704A - Method of producing resistor - Google Patents

Method of producing resistor

Info

Publication number
JPS5999704A
JPS5999704A JP57209902A JP20990282A JPS5999704A JP S5999704 A JPS5999704 A JP S5999704A JP 57209902 A JP57209902 A JP 57209902A JP 20990282 A JP20990282 A JP 20990282A JP S5999704 A JPS5999704 A JP S5999704A
Authority
JP
Japan
Prior art keywords
resistor
resistor layer
comb
trimming
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57209902A
Other languages
Japanese (ja)
Inventor
健二 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57209902A priority Critical patent/JPS5999704A/en
Publication of JPS5999704A publication Critical patent/JPS5999704A/en
Pending legal-status Critical Current

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  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野  □ 本発明は基板上に昂刷法あるいは写真法にょっ”r形成
した抵抗体の抵抗値を□精度よく設定する抵抗体の製造
方法に関する。       ′  □従来例の構成と
その問題点 近年、電子機I普及と機器の小型化、多品化によってプ
リント基板への電子部品の高密度実装が要求されるよう
にガっそきている。そしてこの要求を楯苑すために抵抗
に即刷蝋抗が使用されるようkな;てへ九が、この印刷
抵抗はプリント基板の熱伝導が悪いために電流容量の大
きなものを形成することができす、まだその抵抗値もト
リミングによ;て得るこフ呪+きる範囲が狭いため、抵
抗値の玩藝るイン縁よって数回印刷し、所望の抵抗値の
i抗体番得□ており;これは抵抗体の裏門が非苑′に高
価と藩iのであ・た。□まず1.従来の抵抗体の製造方
法に6いて第1図〜第2図を用いて脱晶する。
[Detailed Description of the Invention] Industrial Application Field The present invention relates to a method for manufacturing a resistor, which accurately sets the resistance value of a resistor formed on a substrate by a printing method or a photographic method.' □ Conventional configurations and their problems In recent years, with the spread of electronic devices and the miniaturization and multi-products of devices, there has been a growing demand for high-density mounting of electronic components on printed circuit boards. In order to meet the requirements, ready-printed solder resistors are used for resistors; however, this printed resistor cannot be formed with a large current capacity due to the poor heat conduction of the printed circuit board. However, since the range in which the resistance value can be obtained by trimming is still narrow, it is necessary to print the resistance value several times to obtain the desired resistance value. This was due to the fact that the back gate of the resistor was extremely expensive. □ First, 1. De-crystallization was carried out using the conventional manufacturing method of the resistor using the method shown in FIGS. 1 and 2.

まず、第1’ig<おい□て、1はプリント基板等の基
板甲ありJ昼はそあ基板1筆に形成されたカーボンベイ
レト等の据抗体□層、□′起、4は前記抵抗体層20両
端部に形成された銀等からなる電極−5は前記抵抗体層
2および電極3′、4を保護するエポキシ系樹脂等□か
ら’−1””ネオ゛−バーコードである。
First of all, 1'ig<Oi □, 1 is a substrate such as a printed circuit board, J day is a fixed body □ layer such as carbon baylet formed on one stroke of the board, □' is the above-mentioned resistor. The electrodes 5 formed on both ends of the body layer 20 and made of silver or the like are made of epoxy resin or the like that protect the resistor layer 2 and the electrodes 3' and 4. The electrodes 5 are neo-barcodes made of □ to '-1''.

前記抵抗採−2の抵抗値の調整は通常第2図に示すよう
に電極3,4を結ぶ紐に対して直角方向に抵抗体層2[
サンドブラスト法等でト)ノミング線6a 、6b 、
6cを形成している。しかしながらこのトリミング線の
長さが長くなると抵抗体層2の残りの部分が少なくなり
、許容電流値が小さくなってしまうだめ、トリミングは
抵抗体層20幅のせいぜい60%程度までであり、した
がって複数のトリミング線6a〜6Cを形成しないと所
要の抵抗値を得ることができず、これはトリミング作業
が後回に及ぶため作業性が悪いものであった。
The resistance value of the resistor layer 2 is normally adjusted as shown in FIG.
G) Norming lines 6a, 6b, etc. by sandblasting method etc.
6c is formed. However, if the length of this trimming line becomes longer, the remaining portion of the resistor layer 2 will decrease, and the allowable current value will become smaller. Unless the trimming lines 6a to 6C are formed, the required resistance value cannot be obtained, and this requires trimming work at a later stage, resulting in poor workability.

発明の目的 本発明は上記従来の問題点に鑑みて、1回のトリミング
作業にて抵抗値の調整が高範囲にかつ高精度に行なえ、
また許容電力も犬きくとれる抵抗体の製造方法を提供す
るものである。
Purpose of the Invention In view of the above-mentioned conventional problems, the present invention is capable of adjusting the resistance value over a wide range and with high precision in one trimming operation.
Furthermore, the present invention provides a method for manufacturing a resistor that can reduce the allowable power.

発明の構成 本発明は基板上に印刷法あるいは写真法によって抵抗体
層を形成し、かつ前記抵抗体層の対向する両端部側から
その抵抗体層上にレーザー光を反射する材料よりなる櫛
型電極を対向状態で設け、前記抵抗体層をレーザー光に
てトリミングするようにした抵抗体の製造方法である。
Structure of the Invention The present invention provides a comb-shaped structure in which a resistor layer is formed on a substrate by a printing method or a photographic method, and is made of a material that reflects laser light onto the resistor layer from opposite end sides of the resistor layer. This is a method of manufacturing a resistor in which electrodes are provided in a facing state and the resistor layer is trimmed with a laser beam.

実施例の説明 以下本発明の一実施例について第3図〜第5図を用いて
説明する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 to 5.

7はプリント基板等の基板であり、8,9は前記基板7
上に形成されだ銅箔である。10は前記銅箔8,9間の
基板T上に印刷法あるいは写真法によって形成された抵
抗体層、11.12はそれぞれ基端部が上記銅箔8,9
に接続され、抵抗体層10の上に互いに突部が凹部内に
位置するように形成されたレーザー光を反射する材料、
例えば銀等よりなる相ij型電極である。13は前記抵
抗体層10および櫛型電極11.12をi%するエポキ
シ系樹脂等からなるオーバーコートである。14は前記
櫛型電極11.12の上方からその電!1返11.12
の突部および凹部を横切るようにレーザー光により形成
したトリミング線である。
7 is a board such as a printed circuit board, and 8 and 9 are the board 7.
A copper foil is formed on top. 10 is a resistor layer formed by a printing method or a photographic method on the substrate T between the copper foils 8 and 9, and 11.12 is a resistor layer whose base end portions are the copper foils 8 and 9, respectively.
a material that reflects laser light and is connected to the resistor layer 10 and is formed on the resistor layer 10 so that the protrusions are located within the recesses;
For example, it is a phase ij type electrode made of silver or the like. Reference numeral 13 denotes an overcoat made of epoxy resin or the like that covers i% of the resistor layer 10 and the comb-shaped electrodes 11 and 12. 14 is the electric current from above the comb-shaped electrodes 11 and 12! 1 return 11.12
This is a trimming line formed by a laser beam so as to cross the protrusions and recesses.

このように抵抗体層10の上に櫛型電極11.12を対
向状態で設け、そしてこの櫛型電極11.12の対向部
を横切るようにレーザー光によシトリミングを行なうこ
とにより、抵抗体層10と櫛型電極11.12との接続
面積が大きく、このだめ前記のように櫛型電極11.1
2の対向部を横切るようにトリミングしても許容電流の
低下は少なく、しだがって小さな面積で大電流用の抵抗
体を得ることができるものである。
In this way, the comb-shaped electrodes 11.12 are provided on the resistor layer 10 in a facing state, and the resistor is trimmed by a laser beam across the opposing portions of the comb-shaped electrodes 11. The connection area between the layer 10 and the comb-shaped electrode 11.12 is large, and as described above, the comb-shaped electrode 11.1
Even if trimmed across the opposing portions of the resistors 2 and 2, the permissible current will not decrease much, and therefore a resistor for large currents can be obtained with a small area.

そして、この場合抵抗体層10としてグラファイトを混
入したカーボン抵抗ペイントを用いることにより、トリ
ミングによる抵抗値変化はグラファイトを混入し々いカ
ーボン抵抗ペイントのみによる場合よりも連続的となり
、したがって微少な抵抗値調整が行なえるものである。
In this case, by using carbon resistance paint mixed with graphite as the resistor layer 10, the change in resistance value due to trimming is more continuous than when using only carbon resistance paint mixed with graphite, and therefore the resistance value is minute. Adjustments can be made.

第6図はトリミングの他の例を示すもので、これはトリ
ミング線14を最初を除いて櫛型型+fi11゜12の
対向部間をS型に設けて行くようにしたもので、これに
よれば抵抗値変化は連続的となり、微少な抵抗値調整が
行なえるものである。
FIG. 6 shows another example of trimming, in which the trimming line 14 is arranged in an S-shape between the opposing parts of the comb-shaped +fi11°12 except for the beginning. In this case, the resistance value changes continuously, and minute resistance value adjustments can be made.

また、第7図(a) 、 (b)は櫛型電極11.12
の他の例を示すもので、これら図示のような形状のもの
であっても同様である。
In addition, FIGS. 7(a) and 7(b) show the comb-shaped electrodes 11 and 12.
This shows other examples, and the same applies to those having the shapes shown in the figures.

発明の効果 以上のように本発明は電極をレーサー光線を反射する櫛
型電極とし、その櫛型電極の上からレーザー光によって
抵抗体層をトリミングするようにしたことにより、トリ
ミング後の残りの抵抗体層部は2つの電極間距離が短い
だめ許容電力を大きくとることができるものであり、ま
だトリミング距離を長くとることかできるため、1回の
トリミングで広い抵抗値の調整範囲となり、作業部牟が
良好となり、しだかって抵抗値の異なる抵抗ペイントの
印刷回数を少々くし、低コスト化を実現することができ
るものである。
Effects of the Invention As described above, in the present invention, the electrode is a comb-shaped electrode that reflects the laser beam, and the resistor layer is trimmed from above the comb-shaped electrode with a laser beam, thereby reducing the remaining resistance after trimming. Since the distance between the two electrodes is short in the body layer part, the allowable power can be increased, and the trimming distance can still be long, so a single trimming can provide a wide resistance value adjustment range, and the working part This makes it possible to reduce the number of printings of resistive paints having different resistance values and to reduce costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の抵抗体を示すpi面図、第2図は同トリ
ミング状態を示す上面図、第3図は本発明による一実施
例による抵抗体のl−IJ ミング状態を示す」二面図
、第4図は第3図のA−A/線断面図、第5図は第3図
のB−B’線断面図、第6図はトリミングの1mの例を
示す上面図、第7図(a) 、 (b)は電極形状の個
の例をそれぞれ示す図である。 7・・・・・・基板、10・・・・−・抵抗体層、11
.12・・・・°・櫛型電極、14・・・・・・トリミ
ング線。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名区 
   区 c3        L <D      さ  。       。 法    味
FIG. 1 is a pi side view showing a conventional resistor, FIG. 2 is a top view showing the same trimming state, and FIG. 3 is a two side view showing an l-IJ trimming state of a resistor according to an embodiment of the present invention. Figure 4 is a sectional view taken along line A-A/ in Figure 3, Figure 5 is a sectional view taken along line BB' in Figure 3, Figure 6 is a top view showing an example of 1m trimming, and Figure 7 is a sectional view taken along line BB' in Figure 3. Figures (a) and (b) are diagrams showing examples of electrode shapes, respectively. 7...Substrate, 10...--Resistor layer, 11
.. 12...°・Comb-shaped electrode, 14...Trimming line. Name of agent: Patent attorney Toshio Nakao and 1 other person
Ward c3 L < D Sa. . law taste

Claims (1)

【特許請求の範囲】[Claims] (1)基板」二に印刷法あるいは写真法に上って抵抗体
層を形成し、かつ□前記抵抗体層の対向する両端部側か
らその抵抗体層上にレーザー光を反射する材料よりなる
櫛型電極を対向状態で設□け;前記抵抗体層をレーザー
光にて) !j ミ7グすることを特徴とする抵抗体の
製造方法。   □(2)抵抗体層のトリミングを櫛型
−極の前向間で行々うようにしたことを特徴とする特許
請求の範囲第1項記載の抵抗体の製造方法。
(1) The substrate is made of a material on which a resistor layer is formed by printing or photography, and laser light is reflected onto the resistor layer from both opposing end sides of the resistor layer. Set the comb-shaped electrodes facing each other; the resistor layer is irradiated with a laser beam)! j. A method for manufacturing a resistor, which is characterized in that the resistor is subjected to microscopy. □(2) The method of manufacturing a resistor according to claim 1, wherein the resistor layer is trimmed between the comb shape and the front side of the pole.
JP57209902A 1982-11-29 1982-11-29 Method of producing resistor Pending JPS5999704A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57209902A JPS5999704A (en) 1982-11-29 1982-11-29 Method of producing resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57209902A JPS5999704A (en) 1982-11-29 1982-11-29 Method of producing resistor

Publications (1)

Publication Number Publication Date
JPS5999704A true JPS5999704A (en) 1984-06-08

Family

ID=16580533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57209902A Pending JPS5999704A (en) 1982-11-29 1982-11-29 Method of producing resistor

Country Status (1)

Country Link
JP (1) JPS5999704A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5585001A (en) * 1978-12-22 1980-06-26 Hitachi Ltd Sandwich type thick film thermistor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5585001A (en) * 1978-12-22 1980-06-26 Hitachi Ltd Sandwich type thick film thermistor

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