JPS5995629U - Resist coating equipment - Google Patents

Resist coating equipment

Info

Publication number
JPS5995629U
JPS5995629U JP19124682U JP19124682U JPS5995629U JP S5995629 U JPS5995629 U JP S5995629U JP 19124682 U JP19124682 U JP 19124682U JP 19124682 U JP19124682 U JP 19124682U JP S5995629 U JPS5995629 U JP S5995629U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
suction
resist
resist coating
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19124682U
Other languages
Japanese (ja)
Inventor
圭一 柴田
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP19124682U priority Critical patent/JPS5995629U/en
Publication of JPS5995629U publication Critical patent/JPS5995629U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の装置を示す断面図、第2図は本考案の一
実施例を示す断面図、第3図は排気量調節装置の一例を
示す断面図、第4図は塗布時間とレジストの微粒体との
増加率および発生状態を示す図、第5図は排気量調節操
作を示す図である。 1・・・吸着板、3・・・駆動装置、4・・・ノズル、
6・・・外囲器、7・・・ダクト、10・・・排気量調
節装置、11・・・制御装置。
Fig. 1 is a sectional view showing a conventional device, Fig. 2 is a sectional view showing an embodiment of the present invention, Fig. 3 is a sectional view showing an example of an exhaust amount adjusting device, and Fig. 4 is a sectional view showing coating time and resist. FIG. 5 is a diagram showing the rate of increase with fine particles and the state of occurrence, and FIG. 5 is a diagram showing the displacement adjustment operation. 1... Adsorption plate, 3... Drive device, 4... Nozzle,
6... Envelope, 7... Duct, 10... Exhaust volume adjustment device, 11... Control device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウェハを吸着保持して回転させる回転機構と、上
記回転機構の半導体ウェハ保持部を取り囲み飛散物を収
容する外囲器と、上記吸着保持されて回転される半導体
ウェハにレジストを同心的に滴下させるレジスト供給装
置と、上記外囲器に接続する通気路を介して上記吸着保
持部の周囲に排気流を発生させる排気装置と、上記排気
装置の排気量をレジスト塗布時間に合わせて変化させる
調節装置とを備えたレジスト塗布装置。
a rotation mechanism that suction-holds and rotates a semiconductor wafer; an envelope that surrounds a semiconductor wafer holding portion of the rotation mechanism and accommodates scattered objects; and a resist concentrically dripping onto the semiconductor wafer that is suction-held and rotated. an exhaust system that generates an exhaust flow around the suction holding section through a ventilation path connected to the envelope; and an adjustment that changes the exhaust volume of the exhaust system in accordance with the resist application time. A resist coating device equipped with a device.
JP19124682U 1982-12-20 1982-12-20 Resist coating equipment Pending JPS5995629U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19124682U JPS5995629U (en) 1982-12-20 1982-12-20 Resist coating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19124682U JPS5995629U (en) 1982-12-20 1982-12-20 Resist coating equipment

Publications (1)

Publication Number Publication Date
JPS5995629U true JPS5995629U (en) 1984-06-28

Family

ID=30411879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19124682U Pending JPS5995629U (en) 1982-12-20 1982-12-20 Resist coating equipment

Country Status (1)

Country Link
JP (1) JPS5995629U (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612206B2 (en) * 1973-06-08 1981-03-19
JPS5652745A (en) * 1979-10-05 1981-05-12 Matsushita Electric Ind Co Ltd Method and apparatus for applying photosensitive resin
JPS5666044A (en) * 1979-11-05 1981-06-04 Toshiba Corp Semiconductor device
JPS5918636A (en) * 1982-07-22 1984-01-31 Nec Corp Deposition of photoresist
JPS5950438B2 (en) * 1975-03-25 1984-12-08 カワサキユコウ カブシキガイシヤ high speed hydraulic press

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612206B2 (en) * 1973-06-08 1981-03-19
JPS5950438B2 (en) * 1975-03-25 1984-12-08 カワサキユコウ カブシキガイシヤ high speed hydraulic press
JPS5652745A (en) * 1979-10-05 1981-05-12 Matsushita Electric Ind Co Ltd Method and apparatus for applying photosensitive resin
JPS5666044A (en) * 1979-11-05 1981-06-04 Toshiba Corp Semiconductor device
JPS5918636A (en) * 1982-07-22 1984-01-31 Nec Corp Deposition of photoresist

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