JPS5992594A - Method of producing printed board unit - Google Patents
Method of producing printed board unitInfo
- Publication number
- JPS5992594A JPS5992594A JP20278582A JP20278582A JPS5992594A JP S5992594 A JPS5992594 A JP S5992594A JP 20278582 A JP20278582 A JP 20278582A JP 20278582 A JP20278582 A JP 20278582A JP S5992594 A JPS5992594 A JP S5992594A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- pieces
- conductive wire
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子機器に使用されるプリント基板装置の
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a printed circuit board device used in various electronic devices.
従来例の構成とその問題点
従来、プリント基板同士を接続する場合、一方のプリン
ト基板にソケットを、他方のプリント基板にプラグをお
のおの設けるコネクタ方式が多く採用されてきたが、多
数の部品を要するためコストが高くなり、実用上採用し
がたいという欠点があった。また、他に一方のプリント
基板に接続用端子を設け、この接続用端子を他方のプリ
ント基板に設けた孔に挿入し裏面銅箔パターンにはんだ
付けして両プリント基板を接続するという方法も提案さ
れていたが、上記のような多数の接続端子を備えたプリ
ント基板の作製法について合理的なものはいまだ得られ
ない状態にある。Conventional configurations and their problems Traditionally, when connecting printed circuit boards, a connector method in which a socket is installed on one printed circuit board and a plug is installed on the other printed circuit board is often adopted, but this method requires a large number of parts. Therefore, it has the disadvantage that it is expensive and difficult to adopt in practice. Another method proposed is to connect the two printed circuit boards by providing a connecting terminal on one printed circuit board, inserting this connecting terminal into a hole in the other printed circuit board, and soldering it to the copper foil pattern on the back side. However, a rational method for manufacturing a printed circuit board having a large number of connection terminals as described above is still not available.
発明の目的
本発明は複数の接続端子を備えたプリント基板を多数枚
、容易に得ることができ、かつ他のプリ３ベージ
ント基板との接続も確実に行えるプリント基板装置の製
造方法を提供することを目的とする。OBJECTS OF THE INVENTION The present invention provides a method for manufacturing a printed circuit board device that can easily produce a large number of printed circuit boards each having a plurality of connection terminals, and can also be reliably connected to other pre-board boards. With the goal.
発明の構成
本発明は１枚のプリント基板を多数枚のプリント基板片
に分割可能とし、かつこの分割部を形成する長孔をはさ
んで対向するプリント基板片の間を導線で接続しておき
、この後、前記プリント基板片を分割部により分割する
とともに導線を必要な寸法長に切断して、接続端子とな
る複数の導線を備えた複数枚のプリント基板片を得るも
のである。Structure of the Invention The present invention enables one printed circuit board to be divided into a large number of printed circuit board pieces, and connects opposing printed circuit board pieces with conductive wires across a long hole forming the divided portion. Thereafter, the printed circuit board piece is divided by the dividing portion and the conductive wires are cut into required lengths to obtain a plurality of printed circuit board pieces each having a plurality of conductive wires serving as connection terminals.
実施例の説明
以下本発明の一実施例について添付図面を用いて説明す
る。第１図ａ、ｂは１枚のプリント基板に複数枚のプリ
ント基板片を構成したところの分割前の状態を示す。こ
のプリント基板１には、これを複数枚のプリント基板片
１ａ、１ｂ、１ｃ。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. FIGS. 1a and 1b show a state in which a plurality of printed circuit board pieces are formed on one printed circuit board before being divided. This printed circuit board 1 includes a plurality of printed circuit board pieces 1a, 1b, and 1c.
１ｄ・・・・・・に分割するための長孔２および丸孔３
を設けている。との長孔２のうちプリント基板１のほぼ
中央に長さ方向にそって形成された長孔２′はその幅を
他のものより広くして、との長孔２′をはさんで対向す
るプリント基板１ａと１０，１ｂと１ｄとの間に複数の
単線構造の導線４がかけわたせるようにしている。この
ために各プリント基板片１ａ、１ｂ、１ｃ、１ｄ・・・
・・・の長孔２′ に沿った端縁にはおのおの導線４が
挿入される小孔６を設けている。ここで、第１図におい
てプリント基板１は、両面プリント基板を構成しており
、所要の回路を構成する部品、たとえば抵抗、コンデン
サ等のリードレス部品６をはんだ付けにより接続固定し
ている。この部品６のはんだ付は時、導線４についても
プリント基板片１ａ、１ｂ、１ｃ 。Long hole 2 and round hole 3 for dividing into 1d...
has been established. Of the long holes 2 with and, the long hole 2' formed along the length direction at approximately the center of the printed circuit board 1 is made wider than the others, and faces opposite to each other across the long hole 2' of. A plurality of conductive wires 4 having a single wire structure are arranged to extend between the printed circuit boards 1a and 10, and between the printed circuit boards 1b and 1d. For this purpose, each printed circuit board piece 1a, 1b, 1c, 1d...
... A small hole 6 into which the conducting wire 4 is inserted is provided at the edge along the long hole 2'. Here, in FIG. 1, a printed circuit board 1 constitutes a double-sided printed circuit board, and components constituting a required circuit, such as leadless components 6 such as resistors and capacitors, are connected and fixed by soldering. When soldering this component 6, the conductive wires 4 are also soldered to the printed circuit board pieces 1a, 1b, and 1c.
１ｄ・・・・・・の表面、裏面においてはんだ付けを施
し、プリント基板片１ａ、１ｂ、１ｃ、１ｄ・・・・・
・に対する導線４の接続を強固なものとしている。Solder the front and back sides of 1d... and print the printed circuit board pieces 1a, 1b, 1c, 1d...
・The connection of the conductor 4 to the terminal is made strong.
この後、第２図に示すように複数組のカッター７．８を
用いてプリント基板１を長孔２および丸孔３にそって分
割するとともに、長孔２′内において導線４を必要な寸
法長に切断して、分割されたプリント基板１ａ、１ｂ、
１Ｃ２１ｄ・・・・・・を得６ベージ
る。分割した状態を第３図に示す。したがって、この方
法によれば所要の回路を構成し、かつ複数の導線４を備
えたプリント基板片１ａ、１ｂ、１ｃ。Thereafter, as shown in FIG. 2, the printed circuit board 1 is divided along the long holes 2 and round holes 3 using multiple sets of cutters 7. Printed circuit boards 1a, 1b, which are cut into lengths and divided into parts,
Obtain 1C21d...6 pages. The divided state is shown in FIG. Therefore, according to this method, the printed circuit board pieces 1a, 1b, 1c constitute the required circuit and are provided with a plurality of conductive wires 4.
１ｄ・・・・・・を一度に多数得ることかできる。この
切断時、導線４はプリント基板１０表、裏面においては
んだ付けしているため、プリント基板１に対する直角度
１曲り等が発生しなく、切断することができる。なお、
この分割はカッターによって一度に分割してもよく、ま
た長孔２′の長さ方向にそった方向のみカッターで分割
しくしたがってこの状態ではプリント基板片１ａと１ｂ
、またプリント基板片１Ｃと１ｄは結合したままである
）、その後、上記方向と直角な方向を折曲分割するよう
にしてもよい。It is possible to obtain many 1d... at once. At the time of cutting, since the conductive wire 4 is soldered on the front and back surfaces of the printed circuit board 10, the conductive wire 4 can be cut without being bent at a right angle to the printed circuit board 1. In addition,
This division may be done at once with a cutter, or it may be done with a cutter only in the longitudinal direction of the elongated hole 2'. Therefore, in this state, the printed circuit board pieces 1a and 1b
(Also, the printed circuit board pieces 1C and 1d remain connected), and then the printed circuit board pieces 1C and 1d may be bent and divided in a direction perpendicular to the above direction.
このようにして得られたプリント基板片１ａを他のメイ
ンプリント基板９に接続した状態を第４図、第５図に示
す。プリント基板片１ａはメインプリント基板９に対し
てほぼ直角に位置し、メインプリント基板９に挿入され
た導線４は裏面の銅箔パターン（図示せず）にはんだ付
けされる。な６１、−ノ
お、導線４の切断の際、カッター８にて導線４を波形に
成形することにより、メインプリント基板９に挿入して
はんだ付けする際、はんだ付は固定が確実に行える。ま
た、上記例ではプリント基板１を両面プリント基板とし
て説明したが、片面プリント基板でも同様に適用できる
ものである。さらに、分割用の長孔２および丸孔３は、
プリント基板の表裏面にＶ溝を設けて代用するようにし
てもよい。The state in which the printed circuit board piece 1a thus obtained is connected to another main printed circuit board 9 is shown in FIGS. 4 and 5. The printed circuit board piece 1a is positioned substantially perpendicular to the main printed circuit board 9, and the conductive wire 4 inserted into the main printed circuit board 9 is soldered to a copper foil pattern (not shown) on the back side. 61.-No. When cutting the conductive wire 4, the cutter 8 forms the conductive wire 4 into a wave shape, so that when the conductive wire 4 is inserted into the main printed circuit board 9 and soldered, the soldering can be reliably fixed. Further, in the above example, the printed circuit board 1 was explained as a double-sided printed circuit board, but a single-sided printed circuit board can be similarly applied. Furthermore, the long hole 2 and round hole 3 for division are
V-grooves may be provided on the front and back surfaces of the printed circuit board as a substitute.
発明の効果
以上のように本発明によれば、所要の回路を構成しかつ
複数の接続用導線を備えだプリント基板片を複数枚、一
度に容易に得ることができ生産性が良好となる。また、
コスト的にも安価に得ることができる。さらに導線をプ
リント基板の表裏においてはんだ付けすることにより、
導線切断時の導線の変形等を防止することができる。ま
たこの際、カッターにて導線にたとえば波形加工を施す
ことにより、プリント基板片の他のプリント基板への接
続の際のプリント基板片の浮き等を防止す７ベージ
ることかでき、確実なはんだ付は接続が可能となる。Effects of the Invention As described above, according to the present invention, it is possible to easily obtain a plurality of printed circuit board pieces at one time that constitute a required circuit and are provided with a plurality of connection conductive wires, thereby improving productivity. Also,
It can also be obtained at low cost. Furthermore, by soldering the conductors on the front and back of the printed circuit board,
It is possible to prevent deformation of the conductor when the conductor is cut. In addition, at this time, by applying waveform processing to the conductor wire with a cutter, it is possible to prevent the printed circuit board piece from floating when connecting it to another printed circuit board, and to ensure reliable soldering. connection is possible.
第１図ａ、ｂは本発明によるプリント基板装置の製造方
法におけるプリント基板の分割前の平面図、断面図、第
２図は分割時の状態を示す図、第３図は分割されたプリ
ント基板を示す図、第４図。
第６図はプリント基板片を他のプリント基板に挿入接続
した状態を示す斜視図、断面図である。
１・・・・・・プリント基板、１ａ、１ｂ、１ｃ、１ｄ
・・・・・・プリント基板、２，３・・・・・・分割用
長孔、丸孔、２′・・・・・・長孔、４・・・・・・導
線、６・・・・・・小孔、６・・・・・・部品、７，８
・・・・・・カッター、９・・・・・・他のプリント基
板。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図 （（：Ｌｌ （ｔ））４１1A and 1B are a plan view and a sectional view of a printed circuit board before division in the method of manufacturing a printed circuit board device according to the present invention, FIG. 2 is a diagram showing the state at the time of division, and FIG. 3 is a divided printed circuit board. FIG. 4 shows the diagram. FIG. 6 is a perspective view and a sectional view showing a printed circuit board piece inserted and connected to another printed circuit board. 1...Printed circuit board, 1a, 1b, 1c, 1d
...Printed circuit board, 2,3...Elongated hole for division, round hole, 2'...Elongated hole, 4...Conductor wire, 6... ...Small hole, 6...Parts, 7,8
...Cutter, 9...Other printed circuit boards. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure ((:Ll (t))41
Claims (3)
リント基板片に分割するだめの分割部を形成し、かつ前
記プリント基板に長孔を設け、この長孔をはさんで対向
するプリント基板片の間を前記長孔をまたぐ導線で接続
し、次に前記プリント基板を分割部および導線を切断す
ることによって複数枚のプリント基板片に分割し、接続
端子となる導線を備える複数のプリント基板片を得るこ
とを特徴とするプリント基板装置の製造方法。(1) A dividing portion is formed on the printed circuit board to divide the printed circuit board into a plurality of printed circuit board pieces, and a long hole is provided in the printed circuit board, and the printed circuit board pieces face each other across the long hole. A plurality of printed circuit board pieces are connected by a conductive wire that straddles the elongated hole, and then the printed circuit board is divided into a plurality of printed circuit board pieces by cutting the dividing portion and the conductive wire, and the plurality of printed circuit board pieces are provided with conductive wires that serve as connection terminals. A method of manufacturing a printed circuit board device, characterized by obtaining the following.
けされた特許請求の範囲第１項記載のプリント基板装置
の製造方法。(2) The method for manufacturing a printed circuit board device according to claim 1, wherein the conductive wires are soldered on the front and back surfaces of the printed circuit board.
つこのカッターは導線の切断部を境にその両側に波形加
工を施す手段を備える特許請求の範囲第１項記載のプリ
ント基板装置の製造方法。 ２’、−−／(3) The method for manufacturing a printed circuit board device according to claim 1, wherein the conductive wire of the printed circuit board is cut by a cutter, and the cutter includes means for applying waveform processing to both sides of the conductive wire with the cut portion as a border. . 2', --/
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20278582A JPS5992594A (en) | 1982-11-17 | 1982-11-17 | Method of producing printed board unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20278582A JPS5992594A (en) | 1982-11-17 | 1982-11-17 | Method of producing printed board unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5992594A true JPS5992594A (en) | 1984-05-28 |
Family
ID=16463147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20278582A Pending JPS5992594A (en) | 1982-11-17 | 1982-11-17 | Method of producing printed board unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5992594A (en) |
-
1982
- 1982-11-17 JP JP20278582A patent/JPS5992594A/en active Pending
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