JPS599141A - Electrically conductive high-strength copper alloy with softening resistance - Google Patents

Electrically conductive high-strength copper alloy with softening resistance

Info

Publication number
JPS599141A
JPS599141A JP11803582A JP11803582A JPS599141A JP S599141 A JPS599141 A JP S599141A JP 11803582 A JP11803582 A JP 11803582A JP 11803582 A JP11803582 A JP 11803582A JP S599141 A JPS599141 A JP S599141A
Authority
JP
Japan
Prior art keywords
softening resistance
alloy
electrically conductive
conductivity
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11803582A
Other languages
Japanese (ja)
Other versions
JPS5939492B2 (en
Inventor
Kazutaka Nakajima
和隆 中島
Osamu Moroi
諸井 修
Takako Sato
貴子 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP57118035A priority Critical patent/JPS5939492B2/en
Publication of JPS599141A publication Critical patent/JPS599141A/en
Publication of JPS5939492B2 publication Critical patent/JPS5939492B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE:To provide a Cu alloy consisting of prescribed percentages of Ni, Fe, Sn, P and B and the balance Cu with inevitable impurities and having high softening resistance, electric conductivity, platebility, solderability, mechanical strength, etc. CONSTITUTION:This electrically conductive high-strength Cu alloy with softening resistance consists of, by weight, 0.05-0.40% Ni, 0.05-0.40% Fe, 0.05-0.20% Sn, 0.05-0.10% P, 0.005-0.050% B and the balance Cu with inevitable impurities. The Cu alloy has high softening resistance, electric conductivity, heat conductivity, platability, solderability, mechanical strength, etc. Accordingly, the Cu alloy is suitable for use as the material of electric and electronic parts requiring said characteristics, the material of the fins of a heat exchanger, etc.

Description

【発明の詳細な説明】 本発明は、耐軟化性、導1B4性、メッキ性、・・ンタ
付性、機械的強度などの特性が要求される電気、電子部
品−や熱交換器のフィン月なとに好適な銅合金に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention is applicable to electrical and electronic components and heat exchangers that require properties such as softening resistance, conductivity, plating properties, and mechanical strength. The present invention relates to a copper alloy suitable for various purposes.

従来、半導体機器のリード材−セラジェータなどの熱交
換器のフィン材などには、燐脱酸鋼や、すす入り銅が使
用されており、良好な導電性、伝熱性、メッキ性、/・
/ダ付性を有しているものの、耐軟化性および機械的強
度が不十分であり、製造上あるいは使nロー制限を受け
ている。特に、電気41料等に使用される場合は、消費
電力の高い箇所、さらに詳しくは、出力用ICやパワー
トラ/ラスタ等のリードフレーム桐等に使用される場合
に問題がある。
Conventionally, phosphorus-deoxidized steel and soot-filled copper have been used for lead materials for semiconductor devices and fin materials for heat exchangers such as Cerageta, and they have good electrical conductivity, heat conductivity, plating properties, and...
/Although it has sagging properties, it has insufficient softening resistance and mechanical strength, and is subject to manufacturing and usage restrictions. In particular, when used for electricity, etc., there is a problem when used in places with high power consumption, more specifically, when used in lead frames of output ICs, power tractors/rasters, etc.

本発明はかかる点に鑑み、従来の燐脱酸鋼、丁ず入り銅
などの銅基合金のもつ欠点全改良し、電気、電子部品や
熱交換器のフィン相等π好適な耐軟化性の良好な導電用
高力銅合金を提供するものである。
In view of these points, the present invention has completely improved the drawbacks of conventional copper-based alloys such as phosphorus deoxidized steel and copper-filled copper, and has good softening resistance suitable for fin phase of electrical and electronic parts and heat exchangers. The present invention provides a high-strength copper alloy for conductive use.

本発明は、旧; 0.05〜0.40重量’lx 、 
Fe ; 0.05〜0.4[J重量% 、 Sr+ 
; 0.05〜0.20重量% l PIO905〜0
.10重量係、  B ; 0.005〜0.050重
量係。
The present invention is based on the old; 0.05-0.40 weight'lx,
Fe; 0.05 to 0.4 [J weight%, Sr+
; 0.05-0.20% by weight l PIO905-0
.. 10 weight ratio, B; 0.005 to 0.050 weight ratio.

残部が銅と不可避的な不純物よりなる耐軟化性、導電性
、伝熱性、メッキ性、・・ンダイ」け性、機械的強度等
のすべて良好な銅基合金である。
The balance is copper and unavoidable impurities, making it a copper-based alloy with good softening resistance, electrical conductivity, heat conductivity, plating properties, dieability, and mechanical strength.

次に、本発明合金を構成する合金成分の添加理由とその
限定理由全説明する。
Next, the reasons for adding the alloy components constituting the alloy of the present invention and the reasons for their limitations will be fully explained.

N1FJ、機械的強度、耐軟化性、および耐食性を改善
する元素であるが、N1含有量が0.05重量%未満で
に強度と耐軟化性が得られず、逆VcNi沈有用が0.
40巾:6%金こえると導j4j件が低ト1′る。
N1FJ is an element that improves mechanical strength, softening resistance, and corrosion resistance, but if the N1 content is less than 0.05% by weight, strength and softening resistance cannot be obtained, and the reverse VcNi precipitation rate is 0.05% by weight.
40 width: If the amount exceeds 6%, the number of leads will decrease by 1'.

Feに、結晶粒を微細化1−る効朱全1、ら、17こ、
t+Ii 、  P、  Pどの44]17作用により
酬基tl12 、用熾申Vrl微T前(lこ分散(−て
111II軟化1′1−お上(]・碑電率を向1−パせ
る fPe’;’;;有吊がlJ、05 市川%未満−
Ciq↓面1110、fl−1牛、機械的強11jが低
く導[4′、4低い。F(’ * h計カL1.4iJ
毛川係け−1−では、iil軟fヒ訃r」良好だが、導
電I牛および加工性が低下−」る。これ全図面の試験結
眼に基いて説明すると、第1図(r、J、O,T6係1
゛Ii 、 [LO8%S11 +0.07係P、 [
J、018係)3残部011の合宿tc’b・いて11
゛(・係を変ずヒさぜグζ場合の導電率(係LACS)
丘示し1こく)のであるが、Fe係がU、05〜0.4
[11%の間−C1傷人1直をもつピークが存在するこ
とがわ力・る3、な4パ、試1験14、にt第4図し′
C)1<シ1こ−1−稈図に従つU 1′I成しグζく
)のCある1、17v、44′S2図&−t’1図と同
じ合iしTついてFe係と+fliI熱j晶間の関1系
を調へたイ、の−〇あるが、y゛rrt2)K’iノj
1+1’i”J:す1ll11’ ”!、(+a I隻
カ泡激vc増加L、0.4%1:1近てこのり)(7ド
が飽和もしくに減少1頃向衛示1−ζどがわ/ハる。;
lj、 3図ン、を第2図の関1糸をさらに詳細に示し
1こイ)ので、加熱温度と硬IWの関係全示し−Uいる
。¥6図に見られるようVC,、Feが無べ≦加(NI
130)、F)無添加(NQ13)、Fe O,Ui 
% (Nα551FC比・\、F(l全適@倫加し1こ
ものは軟化温度が商い1、なお、第6図Fおけるト1f
14 n Sn O,i % 。
The effect of refining grains on Fe is Zhuquan 1, et al., 17.
t + Ii, P, P etc. 44] 17 The action of the exchange base tl12, the use of the Vrl microT (l this dispersion (-te 111II softening 1'1-Ogami()) and the electric rate can be increased in the direction of fPe ';';;Aritsuri is lJ, 05 less than Ichikawa%-
Ciq↓ plane 1110, fl-1 cow, mechanical strength 11j is low leading [4', 4 low. F(' *h total power L1.4iJ
In Kegawa-kake-1, the softness was good, but the conductivity and processability were poor. To explain this based on the test eyelids in all drawings, Figure 1 (r, J, O, T6 section 1
゛Ii, [LO8%S11 +0.07 section P, [
J, 018 Section) 3 remaining 011 training camp tc'b and 11
゛(・Electrical conductivity when the ratio is unchanged and the ratio is ζ (ratio LACS)
The hill is 1k), but Fe staff is U, 05~0.4
[Between 11% and 11%, there is a peak with C1 injury 1 shift.
C) 1<C1-1-U according to culm diagram I investigated the relationship 1 system between the relationship and the +fliI heat j crystal.
1+1'i"J:su1ll11'"! , (+a I ship's strong VC increase L, 0.4% 1:1 near leverage) (7 do is saturated or decreased around 1. 1-ζ Dogawa/Haru.;
1j, 3, and 3 are shown in more detail for the yarn in Figure 2, so the relationship between heating temperature and hardness IW is fully shown. ¥6As seen in the figure, VC, Fe is not present ≦ addition (NI
130), F) Additive-free (NQ13), Fe O, Ui
% (Nα551FC ratio \, F(l total suitability@Rinka 1) The softening temperature is 1, and 1f in Figure 6 F.
14nSnO,i%.

+30.0L15 % 、残部Cuの比較【911であ
る。
+30.0L15%, balance Cu comparison [911].

Snは、銅基地組織中に固鑓して軟化温+it高める。Sn hardens into the copper matrix structure and increases the softening temperature +it.

S II含有敏が0.05千州係未満ては、基地組1蛾
の強化がイてト分て゛あり、1120重量係以−J、Z
ては導i(、i、白が低下する 1” rat、脱酸効¥全もち、IIIII軟化にtを
向−1ニさせる][、素−Cある。P含有量が1.(1
5重量係未満では機械的強度と111il軟化性の向上
がモト分(第2〜3図参1(j ]−rあり、′!l:
た、他の添θ[」元素と化合物を形成し、十JLc−)
ヲ基地、1llv&中へ分散析出させる効果が不十分て
あり導電性も低下する(第1図参照)。
If the S II content sensitivity is less than 0.05 thousand states, it is impossible to strengthen the base group 1 moth, and if the strength is less than 1120 weight factors - J, Z
There is a conductive i (, i, white decreases 1" rat, deoxidizing effect has full effect, III softens t towards -1 di) [, element-C. P content is 1. (1
When the weight ratio is less than 5, the improvement in mechanical strength and 111il softening property is significant (See Figures 2 and 3 with 1(j)-r,'!l:
In addition, it forms a compound with other additive θ['' elements, 10JLc-)
The effect of dispersing and precipitating it into the base is insufficient, and the conductivity also decreases (see Figure 1).

■゛菖−有晴が0.+0屯喰係以−にでは導1b、性が
低下する。
■゛Iris - Ariharu is 0. After +0 tonne, the lead 1b becomes weaker.

B iJ、強力な脱酸効果と結晶粒O′11.細化およ
び結晶粒わ1大化阻止効果全もつ元素である。B含有量
が0.005東量係未満ては、添加VC,l:る効果が
小中5F(“あり、U、050中用係以七てt、1、(
奈〕Ju肋果が飽和する。
B iJ, strong deoxidizing effect and crystal grain O'11. It is an element that has the effect of reducing grain size and preventing grain size from becoming large. If the B content is less than 0.005 ton, the effect of adding VC,l:
[Na] Ju ribs are saturated.

J6施1シリ ■1表に示−を成汁組1戊の合金となるように高固波九
?溶解炉にて溶IW L、、40 (+137 X 1
50 (長さ)x40 (Jf4) (7’>イ:/ 
コノhVC鋳造1〜1ζ。800 Uて熱間圧延し、j
ツ、さ8 mmの板とし、次にこの板金曲帛′の酸洗処
理全しグこ後、冷間圧延、・焼鈍、酸洗金繰り返して厚
さ肌62 mmの1反を得/こ。ついて、500C11
時間焼鈍して酸洗後、冷間圧延て゛厚さ0.5mmの板
とし7こ。このようVCして調整びれ/こ試オー1の評
価として機(戴的強度は引張り試験、剛軟1ヒ付け7分
間加熱後の硬度が、圧kIL後の硬度の8U%となると
きの畠IW、導電性と伝熱性は導電率(係[ΔC8)、
ハンダ刊は性(dハ/ダ拡がり試験法で行1つlこ。そ
の結果を第1表に示しプζ。
J6 test 1 series ■ 1 Table shows - is the alloy of Seiju group 1 戊 high solid wave nine? Melt IW L in the melting furnace, 40 (+137 X 1
50 (length) x 40 (Jf4) (7'>i:/
Kono hVC casting 1-1ζ. Hot rolled at 800 U,
A plate with a thickness of 8 mm was prepared, and after the sheet metal curve was completely pickled, cold rolling, annealing, and pickling were repeated to obtain one roll with a thickness of 62 mm. . Then, 500C11
After time annealing and pickling, it was cold rolled into a plate with a thickness of 0.5 mm. In this way, VC was used to adjust the fins.As an evaluation of this trial O1, the strength was determined by the tensile test, when the hardness after heating for 7 minutes with 1 hit of bending and bending was 8U% of the hardness after pressure kIL. IW, electrical conductivity and thermal conductivity are electrical conductivity (coupling [ΔC8),
Handa published one line for the d/da spread test method.The results are shown in Table 1.

・第1表に示すごとく本発明Vこ係る合金’t:1−J
−<れ1ζ而j軟化11.および1−分な機械的強度、
導76、性、仏典性、ハ/久1:[け性全有することが
明ら71)で高い信頼性が要求びれる市電、電子機器部
拐、とくにリードフレームとし゛C好適である。
・As shown in Table 1, the alloy of the present invention V't: 1-J
-<Re1ζJ Softening 11. and 1-min mechanical strength,
It is suitable for use in streetcars and electronic devices, where high reliability is required, especially for lead frames.

なお、本発明合金は、溶解、熱間1f延、冷間IE延お
よび中間処理t!I!汗は全く容易であり、なんら技術
的な困111Idみられな刀\つ1ζ、これに、特殊な
如(+)+j理セ復)イトなエイ♀が必要な1回基合(
1〉より節弔に製置することがてきる。
The alloy of the present invention can be melted, hot rolled at 1f, cold IE rolled and intermediate treated at t! I! The sweat is quite easy, and there is no technical difficulty in the sword\tsu1ζ.
From 1>, it can be placed as a memorial service.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図にl悄係と導電率(係1. A CS)との関係
図、−82図1’:tFe係と1制熱温度との関1系図
、第5図は加熱温度と硬度(Hv lとの関係図1.君
4図汀−g1〜6図の試、5吋こ供]71こ試11の作
成]−程図である1゜ 出+m人  同和鉱業株式会社 第1図 1−”C・(%) [謳1■「二]−(’+ゝ)Iiノン1\!1り)↓ 口I(1−1゛、固θム貞り)僧再イ旬1↓ 囚IFjFIIIII)   (59+#>、34tV
、・+> 2 [1山)↓ ■−巨n (61] II ”(ソ))I)↓ [万g−(nll % +1.::哨り)」 ↓ [■二■?η〕工圓ア丁]を可]](1:  rll 
 1JII 111↓ [医亜¥不] い囲い1111 ↓ 「I■1■ (41,61lJH ↓ [EE奪7jOヤ不[■]”(c)lli+ ”(’、
 x i tl+↓ ロー厘口(16ン11.67 l 〕 ↓ ロ正コIロー (「、nll O+山 11↓ [1画コロ ([1,62ン(1,J l・第4図 59暇〜Vl〉、69山)、151’lt/ nun+
 )6[]%) %If2:i(1,フイ1.) 1、li iめ ) []ダt・il、!:’す47(9,’j: ]6LI
%) 目11.(1行汐) 1111・46140 (ジ乙Iい+Ll+iイ() J11トイ:2(]%) ゛11メzi+ン・11.511+。 ×1!tシJノ×11.′メ1ン 、イ2と ) +□(10 千 そ;シ1山 市 1’4’ (自発)1冒/1庁長
′自 若杉和夫  殿 1 中伸の表示 昭41+ 57  ’I−特 許 顆第118(135
号2 発明の名称  耐軟化1牛導電用高力銅合金3、
 71ロ止をする者 車(lIとの関係  特許出願〕( 代表者 西 (」4  尭 4  代  理  人  〒 162 6 浦市の内容 1) 発明の詳細な説明を上記のとおり袖止し寸ず1.
4己 ffl  明細用第5自11行の’、’ o、oz%P
jkIJ’ 0.05%1゛」に補正し寸ず。 (「リ 明細内組4頁6行の(” (NIL 30 )
、P無添加(sn 33 )−1を「(Nn5)、P無
添力++ (Na7) j +c補1[シ寸す。 (・)明線]書第4頁5〜4行の1’(Nα35)1を
U’(Nα6)JlK補正し寸す。 −)明細両組405行の[” N[l /ljを「Nα
9.IK補IFしまず。 6+)明細書第6頁の第1表中軟化温度の欄のNα1の
段の[soo、Jを「5osjに補正し、甘たNa 4
の段の155θ」ン・11−6+o」に補正し1す。 )図面(第1図、第2図、第す図、第4図)を添イτ1
図面のとおり補正しま一1゛。
Figure 1 shows the relationship between the tFe ratio and the conductivity (1.ACS), Figure 1' shows the relationship between the tFe ratio and the heat suppression temperature, and Figure 5 shows the relationship between the heating temperature and the hardness (1. Relationship with Hv l Diagram 1. Kimi 4 Diagram - G1 to 6 Diagrams, 5 inches] 71 Creation of Diagram 11 -"C・(%) [Song 1 ■ "2] - ('+ゝ) Ii non 1 \! 1 ri) ↓ Mouth I (1-1゛, solid θmu jiri) monk re-injun 1 ↓ prisoner IFjFIII) (59+#>, 34tV
,・+> 2 [1 mountain) ↓ ■-giant n (61] II ”(So)) I) ↓ [10,000 g-(nll % +1.::shu)” ↓ [■2■? η
1JII 111↓ [Medical Asia\N] Isai 1111 ↓ ``I■1■ (41,61lJH ↓ [EE 7jOyafu[■]''(c)lli+ ''(',
x i tl+↓ Low mouth (16 N 11.67 l) ↓ Ro Seiko I low (``,nll O+Mountain 11↓ [1 stroke Colo ([1,62 N (1, J l・Figure 4 59 time 〜Vl〉, 69 mountains), 151'lt/ nun+
)6 []%) %If2:i (1, 1.) 1, li ime) []da t・il,! :'su47(9,'j: ]6LI
%) Item 11. (1 line Shio) 1111・46140 (Ji Ot I + Ll + i I () J11 Toy: 2 (]%) ゛11 mezi+n・11.511+. 2 and ) + □ (10,000 so; shi 1 mountain city 1'4' (spontaneous) 1 de / 1 director's own Kazuo Wakasugi Tono. 135
No. 2 Title of the invention Softening resistance 1 High strength copper alloy for electrical conductivity 3
71 Ro stop vehicle (Relationship with II Patent application) (Representative Nishi ('4 Taka4 Agent 〒162 6 Ura City Contents 1) Detailed explanation of the invention as described above. 1.
4selfffl 5th line 11th line for details ',' o, oz%P
jkIJ' Corrected to 0.05% 1゛''. ("Re-specification, page 4, line 6 (" (NIL 30)
, No addition of P (sn 33 ) -1 as ``(Nn5), No addition of P ++ (Na7) j +c Supplement 1 [Size. (Nα35)1 is corrected by U'(Nα6)JlK.
9. IK supplementary IF first. 6+) In Table 1 on page 6 of the specification, [soo, J in the column of Nα1 in the softening temperature column was corrected to 5osj, and sweet Na 4
Correct it to 155θ of the stage of 11-6+o. ) Attach the drawings (Fig. 1, Fig. 2, Fig. S, Fig. 4) τ1
Corrected as shown in the drawing.

Claims (1)

【特許請求の範囲】[Claims] Ni ; 0.05〜0.40重量% 、  F’e;
 0.05〜0.40重量% 、 Sr] −〇、05
〜0.20 @計% 、  l’ ;[J、05〜0.
IU市量係、 Fl ; 0.005〜0.050重喰
係、残部が銅と不6工避的な不純物よりなる耐軟(ヒ性
導電用高力銅合金。
Ni; 0.05-0.40% by weight, F'e;
0.05-0.40% by weight, Sr] -〇, 05
~0.20 @total%, l'; [J, 05~0.
IU market weight, Fl; 0.005 to 0.050 heavy weight, the balance being copper and unavoidable impurities. High-strength copper alloy for soft conductivity (arsenic conductivity).
JP57118035A 1982-07-07 1982-07-07 High strength copper alloy for conductive use with softening resistance Expired JPS5939492B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57118035A JPS5939492B2 (en) 1982-07-07 1982-07-07 High strength copper alloy for conductive use with softening resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57118035A JPS5939492B2 (en) 1982-07-07 1982-07-07 High strength copper alloy for conductive use with softening resistance

Publications (2)

Publication Number Publication Date
JPS599141A true JPS599141A (en) 1984-01-18
JPS5939492B2 JPS5939492B2 (en) 1984-09-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP57118035A Expired JPS5939492B2 (en) 1982-07-07 1982-07-07 High strength copper alloy for conductive use with softening resistance

Country Status (1)

Country Link
JP (1) JPS5939492B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
US5024815A (en) * 1989-05-23 1991-06-18 Yazaki Corporation Copper alloy with phosphorus and iron
JPH04227842A (en) * 1990-05-29 1992-08-17 Unilever Nv Semitransparent thixotropic aqueous gel containing non-granular denatured protein, its manufacture and food and cosmetics containing said gel
US6132529A (en) * 1995-10-09 2000-10-17 Dowa Mining Co., Ltd. Leadframe made of a high-strength, high-electroconductivity copper alloy

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60175350U (en) * 1984-04-30 1985-11-20 パイオニア株式会社 Information recording disk clamper holding mechanism

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147420A (en) * 1974-05-20 1975-11-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147420A (en) * 1974-05-20 1975-11-26

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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