JPS5991249A - Wall panel material made of inorganic substance - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inorganic wall board material, and more particularly to an inorganic wall board material manufactured by extrusion molding.

Conventionally, wallboard materials have been widely manufactured by extrusion molding of inorganic materials. This inorganic extruded wall board material has the great advantage of being able to manufacture wall boards with or without hollow holes continuously and in large quantities, but because the finished molded product has a high density and is hard, The problem was that it was difficult or impossible to drive nails, which caused problems in the installation of wallboards.

Therefore, hollow holes A and A' were provided along the extrusion direction at the nail driving position of the inorganic extruded wall board material, as shown in Figure 1, in order to realize or facilitate the driving of the nail B. However, with this structure, when the nail B is driven and penetrates to the back side of the wall board 0, the back side part 0°
In addition, the nail hole in wall board 0 formed by nail B is a so-called stupid hole, so if the base vibrates or if you drive in too many nails, etc. There was a drawback that the nail B would sink into the wall board O, and the holding force would no longer be exerted.

In view of the above-mentioned drawbacks, this invention has been developed to
An inorganic wall board material that is extruded with or without hollow holes and is made for the purpose of providing a material that can be easily nailed and exhibits sufficient holding power. This is characterized in that a large number of small-diameter through-holes are formed in a bundle in the wall thickness immediately below the surface nail driving position along the extrusion direction.

This invention will be explained below with reference to Examples.

FIG. 2 is a sectional view of an embodiment of the invention.

The inorganic wall board material 1 of the present invention has a hollow hole or an extrusion-molded inorganic wall board material (in the case shown, the one with a hollow hole) 1'' has surface nailing points 8. It is constructed by forming a large number of small-diameter through holes 3 . . . 3 that are continuous along the extrusion direction (backward direction of the paper in the figure) in a bundle shape 3'' within the wall thickness immediately below.

It is desirable that the inner diameter of the through-holes 3 mentioned above be as small as possible, and that the number of through-holes 3 that can fit within one bundle 3' be as large as possible.

Further, in the above embodiment, reference numeral 4 in the figure represents an engaging protrusion formed at the end of the wall plate material 1, and 5 represents an engaging recess.

When the inorganic wall board material 1 of the present invention is fixed on the wall base, small diameter through holes 3...3 are used as shown in FIG.
The nail 6 is driven into the bundled part 3'.

At this time, the density of the nail driving points of the inorganic wall board material 1 is substantially lowered by the large number of through holes 3...3, so the nails 6 can be driven easily, and the through holes 3
Since the driving point is reinforced in the thickness direction (arrow It is possible to prevent the nails 6 from sinking in due to over-driving or vibration of the base material, and it is also possible to prevent the nails 6 from falling off over a wide area on the back side of the wall board material.

Since the present invention is constructed as described above, even inorganic wall boards, which were conventionally difficult to fix by nailing, can be fixed by nailing by providing a large number of small-diameter through holes in the wall thickness. This makes it easier to fix, and the strength with which the nails hold the wallboard can be improved. Furthermore, when manufacturing the wall board material of the present invention, it can be manufactured simply by arranging a large number of small-diameter axial mandrels in a conventional extrusion molding die, so that it has various effects such as easy manufacturing.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional example, FIG. 2 is a sectional view of an embodiment of the present invention, and FIG. 3 is an enlarged sectional view of a main part showing the usage state of the embodiment. □ 1... Inorganic wall board material, 2... Nail driving location, 3
...Small diameter through hole, 3°...bundle. -2:

Claims (1)

[Claims] (1) A large number of small-diameter through-holes are formed in a bundle along the extrusion direction in the wall thickness immediately below the nail driving position on the surface of an extrusion-molded inorganic wall board material with or without hollow holes. An inorganic wall board material characterized by: