JPS5989800U - Satellite onboard equipment - Google Patents
Satellite onboard equipmentInfo
- Publication number
- JPS5989800U JPS5989800U JP18661782U JP18661782U JPS5989800U JP S5989800 U JPS5989800 U JP S5989800U JP 18661782 U JP18661782 U JP 18661782U JP 18661782 U JP18661782 U JP 18661782U JP S5989800 U JPS5989800 U JP S5989800U
- Authority
- JP
- Japan
- Prior art keywords
- board
- satellite
- chassis
- onboard equipment
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の人工衛星搭載機器の概念図、第2図はこ
の考案の人工衛星搭載機器の概念図、第3図はこの考案
の特徴をなすバイメタルの部分を示す図である。
図中1は部品、2は基板、3はシャーシ、4は衛星構体
、5は熱伝導の主な経路を示す矢印、6は熱絶縁材料、
7はバイメタルである。なお、図中同一あるいは相当部
分には同一符号を付して示しである。FIG. 1 is a conceptual diagram of a conventional satellite-mounted device, FIG. 2 is a conceptual diagram of a satellite-mounted device of this invention, and FIG. 3 is a diagram showing a bimetallic part that is a feature of this invention. In the figure, 1 is a component, 2 is a board, 3 is a chassis, 4 is a satellite structure, 5 is an arrow indicating the main path of heat conduction, 6 is a thermal insulation material,
7 is bimetallic. Note that the same or equivalent parts in the figures are indicated by the same reference numerals.
Claims (1)
、上記基板に取付けられた部品と、端部が上記構体に接
し、かつ上記基板および部品を覆うシャーシとからなる
人工衛星搭載機器において、上記基板とシャーシの間、
シャーシと構体との間にそれぞれ熱絶縁材料を介在させ
るとともに、上記基板と構体との間には基板側の温度に
応じて構体と接触、非接触をするバイメタルを設けたこ
とを特徴とする人工衛星搭載機器。A satellite-mounted device consisting of a board disposed at a predetermined distance from a satellite structure, parts attached to the board, and a chassis whose ends are in contact with the structure and cover the board and parts, Between the above board and chassis,
The artificial body is characterized in that a heat insulating material is interposed between the chassis and the structure, and a bimetal is provided between the board and the structure to make contact with or not to contact the structure depending on the temperature on the board side. Satellite onboard equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18661782U JPS5989800U (en) | 1982-12-09 | 1982-12-09 | Satellite onboard equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18661782U JPS5989800U (en) | 1982-12-09 | 1982-12-09 | Satellite onboard equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5989800U true JPS5989800U (en) | 1984-06-18 |
Family
ID=30403045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18661782U Pending JPS5989800U (en) | 1982-12-09 | 1982-12-09 | Satellite onboard equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5989800U (en) |
-
1982
- 1982-12-09 JP JP18661782U patent/JPS5989800U/en active Pending
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