JPS5989755A - One side hot dipping method of steel strip - Google Patents

Abstract

PURPOSE:To prevent the generation of a recessed flaw on a stop-off surface in the stage of plating a steel strip formed with a layer of a plating stop-off agent on one surface by removing the metallic balls sticking on the stop-off surface before the stop-off agent surface contacts with a roll. CONSTITUTION:A steel strip 1 is coated with a plating stop-off agent on one surface A thereof with a coater 2 and is then subjected to calcination of the stop-off agent,that is, the formation of a stop-off agent layer together with annealing in a continuous annealing furnace 3. The strip 1 is thereafter dipped in a molten metal pot 4, and is subjected to hot dipping on one side, and is guided by rolls 5-8 so as to be transferred to the succeeding stage. A brushing device 9 is provided in a desired position in the section after the passage of the port 4 and before the contact of the surface A with the roll 8, for example, in the position between the rolls 5 and 6, to brush the surface A and to remove the fine metallic balls sticking on the surface A. The formation of a recessed flaw on the surface A owing to the contact of said surface having such balls sticking thereon with the roll 8 is thus prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for single-sided hot-dip plating of copper strips, and in particular, by removing the metal deposited on the plating inhibitor surface after plating and before the plating inhibitor surface contacts the roll. B. A method for single-sided hot-dip plating of a copper strip that prevents the occurrence of dents on the surface of the anti-nausea agent.

- When hot-dipping only one side of the strip, a method is adopted in which a coating layer of a plating inhibitor is formed on the plating-inhibiting surface of the HV14 strip and then passed through a molten metal pot to deposit metal on one side.

Various types of plating inhibitors have been proposed for use in such continuous single-sided hot-dip plating methods, but generally stable oxides that do not react with molten metal are used.

Such a plating inhibitor has excellent repellency against molten metal.

However, when plating is carried out through a molten metal pot, it is inevitable that fine particles of the molten metal (for example, metals with a diameter of t or about 5 fi) adhere to the surface of the plating inhibitor.

In the conventional hot-dip plating method, after plating, the plating is directly transported to a cooling device or post-processing device. There was a drawback that the contact with the roll caused a force υ, which caused concave scratches on the plating blocking surface.

The purpose of the present invention is to eliminate such drawbacks of the prior art,
To provide a single-sided hot-dip plating method for a copper strip in which a smooth non-plated surface with less gate current is obtained by removing the metal on the plating inhibitor surface before the plating inhibitor surface comes into contact with a roll after plating. That's true.

That is, according to the present invention, in a method for single-sided hot-dip plating of a copper strip, in which a layer of a plating inhibitor is formed on one side of the copper strip, the copper strip is continuously passed through a molten metal pot to plate one side. Single-sided melting of a copper strip, characterized in that after passing through a metal bot and before the plating inhibitor surface contacts the roll, the plating inhibitor surface is brushed to remove metal balls adhering to the plating inhibitor surface. A plating method is provided.

The present invention will be described in detail below with reference to the drawings.

In FIG. 1, a steel strip l to be single-sided hot-dipped is first coated with a plating inhibitor on one side (non-plated surface) A in a coater 2, and then coated with a plating inhibitor while annealing the copper strip in a continuous annealing furnace 3. , that is, the formation of a layer of a plating inhibitor, is performed, and then continuously immersed into a molten metal pot 4 to perform single-sided hot-dip plating.

The steel strip l passed through the molten metal bot 4 is passed through a turn roll 5,
6, 7.8, and transported to the next process.

Therefore, in the illustrated example, the three turn rolls 5, 6.7 located on the upstream side are all rolls in contact with the plating surface B of the steel strip 1, and the last turn roll 8 is a roll with a plating inhibitor surface. (Non-plated surface) The roll is in contact with A.

At a desired position in the section before the plating inhibitor surface A contacts the roll (turn roll 8) after passing through the molten metal pot 4, that is, at a position between the turn rolls 5 and 60 in the illustrated example,
A brushless device 9 for brushing the plating inhibitor surface A is installed.

This Brassino device 9 has fine particles (for example, about 0.0 mm) deposited on the plating inhibitor surface A while passing through the molten metal pot 4.
This is for removing 5 wa coarse grain size metal beads. As the brush brush device 9, for example, a rotary brush device in which wires are planted on the circumferential surface of a rotating drum is used.

In the illustrated example, the Brassino device 9 is installed between the rollers 5 and 60 that are in contact with the plating surface B, but this installation location is at another suitable location between the molten metal bot 4 and the roll 8 that is in contact with the plating inhibitor surface AK. can be selected. For example, it can be selected at any position between point X and point Y in FIG.

Further, in the illustrated example, one Brassino device 97 is installed, but it is also possible to install an appropriate number of two or more.

It is preferable to use a strong brushing wire as the plastic material of the brushless device 9 that removes metal balls adhering to the surface of the hot copper strip 10 after hot-dip plating, and use steel-based brushing rather than nylon-based brushing. It is preferable to do so. Among steel-based materials, it is preferable to use stainless steel from the viewpoint of heat resistance.

In addition, nylon-based wire brushes tend to seize, but in order to prevent this, water spray is also used.

Furthermore, in order to minimize the number of remaining metal balls and to stably minimize the number of dents, it is preferable to use a plurality of plasticine pieces rather than one.

Next, examples of the method of the present invention will be described based on specific data.

N aI OS i Os B鵞Os , Mg O
-T 1Otr An Altos-based plating inhibitor is applied to one side of the cleaning copper strip, and the copper strip is annealed and the plating inhibitor is fired in a continuous annealing furnace, and then passed through a molten ZN bot to perform ZN plating. Ta.

Immediately after passing through the pot, at the vertical rise point, a gas throttling device was used to control the amount of Zn adhering to the plating surface, and fire was applied to the plating inhibitor surface to prevent Zn from adhering. The plastic and tushing effect of the wire brass was evaluated by the number of gates on the non-plated surface of the copper strip after the anti-plating agent was removed.

Table 1 is a table showing data for Tests 1-5, which are examples of the present invention, and a conventional example in which brushing was not performed.

In each of Examples 1 to 5, the material of Brassino is SUS.
304 and a wire diameter of 0.3 m was used.

As in Example 1, when the rotation was reversed at a rotation speed of 11,000 rpm (tangential speed in the opposite direction to the copper band advancing direction), even with one plasticine, the 1 mm comb flow was 35, compared to the conventional example without plasticine. We were able to achieve a significant reduction in the number of gates compared to the 195 gates in the case.

When the number of plastic brushes is set to two, as shown in Examples 2 to 5, the number of 1 mm combs can be reduced to 5 or less even under various brushing conditions (forward rotation or reverse rotation speed, etc.), which prevents the occurrence of scratches. was able to be minimized.

As is clear from the explanations in Table 1 and above, the present invention provides a single-sided hot-dip plating method for steel strips that can form a smooth non-plated surface with less gate flow.

[Brief explanation of the drawing]

FIG. 1 is a schematic illustration of an apparatus for carrying out the single-sided hot-dip plating method for steel strip according to the present invention. ■...Steel strip, 2...Coater for applying eyelash inhibitor, 3...Continuous annealing furnace, 4...Melting whole island pot. 5.6, 7.8...Roll (turn mouth/role). A: Plating 1 adhesive side, B: Plating side. Agent Tatsuyuki Unuma (and 2 others)

Claims (1)

[Claims] (1) In the single-sided hot-dip plating method for copper strips, in which a layer of plating inhibitor is formed on one side of the copper strip and then the copper strip is continuously immersed in a molten metal pot to plate one side, the copper strip passed through the molten metal pot. 1. A method for single-sided hot-dip plating of a copper strip, which comprises brushing the plating inhibitor surface to remove metal deposited on the plating inhibitor surface before the plating inhibitor surface comes into contact with a roll.