JPS5989575U - Printed wiring board lead wire mounting structure - Google Patents

Printed wiring board lead wire mounting structure

Info

Publication number
JPS5989575U
JPS5989575U JP18367482U JP18367482U JPS5989575U JP S5989575 U JPS5989575 U JP S5989575U JP 18367482 U JP18367482 U JP 18367482U JP 18367482 U JP18367482 U JP 18367482U JP S5989575 U JPS5989575 U JP S5989575U
Authority
JP
Japan
Prior art keywords
lead wire
wiring board
printed wiring
mounting structure
wire mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18367482U
Other languages
Japanese (ja)
Inventor
勇 大和
Original Assignee
株式会社ケンウッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ケンウッド filed Critical 株式会社ケンウッド
Priority to JP18367482U priority Critical patent/JPS5989575U/en
Publication of JPS5989575U publication Critical patent/JPS5989575U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来のプリント配線基板のリード線取付構造
を示す切欠斜視図、第2図は本考案に係るプリント配線
基板のリード線取付構造を示す切欠斜視図である。 1:チューブ、2ニブリント配線基板、3:リード線、
4:補強ピン。
FIG. 1 is a cutaway perspective view showing a conventional lead wire attachment structure for a printed wiring board, and FIG. 2 is a cutaway perspective view showing a lead wire attachment structure for a printed wiring board according to the present invention. 1: Tube, 2 Niblint wiring board, 3: Lead wire,
4: Reinforcement pin.

Claims (1)

【実用新案登録請求の範囲】 1 ブリシート配線基板に配線されたリード線と該リー
ド線の近傍に植設された補強ピンとを、短管状のチュー
ブで固定させたことを特徴とするプリント配線基板のリ
ード線取付構造。 2 チューブが加熱収縮性チューブであり、配線後に加
熱収縮させることにより固定するようになっていること
を特徴とする第1項記載のプリント配線基板のリード線
取付構造。
[Claims for Utility Model Registration] 1. A printed wiring board characterized in that a lead wire wired to a printed circuit board and a reinforcing pin planted near the lead wire are fixed with a short tube. Lead wire mounting structure. 2. The lead wire attachment structure for a printed wiring board according to item 1, wherein the tube is a heat-shrinkable tube and is fixed by heat-shrinking after wiring.
JP18367482U 1982-12-06 1982-12-06 Printed wiring board lead wire mounting structure Pending JPS5989575U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18367482U JPS5989575U (en) 1982-12-06 1982-12-06 Printed wiring board lead wire mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18367482U JPS5989575U (en) 1982-12-06 1982-12-06 Printed wiring board lead wire mounting structure

Publications (1)

Publication Number Publication Date
JPS5989575U true JPS5989575U (en) 1984-06-18

Family

ID=30397458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18367482U Pending JPS5989575U (en) 1982-12-06 1982-12-06 Printed wiring board lead wire mounting structure

Country Status (1)

Country Link
JP (1) JPS5989575U (en)

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