JPS5985746A - Sheet-shaped molding material for shielding electromagnetic wave - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sheet-like molding material suitable for manufacturing a single body of various electronic devices such as computer equipment, medical equipment, and consumer equipment that require shielding from electromagnetic waves. .

Housings used for various electronic devices have conventionally been generally manufactured by sheet metal processing of metal plates. However, such sheet metal processing is not only unsuitable for mass production, but also increases costs, and it is difficult to form curved surfaces, etc., which limits the degree of freedom of sheet metal production. However, recently it has been replaced by a molded product made of materials such as base material and base material. There is an 11th point that can be produced not only because it is possible to produce it, but because it is an insulating material, it is not a problem with a metal casing. The lack of electromagnetic wave shielding fi1g is no longer pointed out.Especially as the electronic devices mentioned above have become highly popular these days,
Strong magnetic wave shielding function (a few bundles, sooner or later; 1; f1.
FrrIJ will be controlled, so: 11. From this point of view, Imajo ``r:1〆 does not include ritJ.
If? 414 Oro 1v 1〆 body with box skin wave shielding 1
Two methods of providing energy cooling with one unit of cooling capacity have been scrapped one by one, and some have been put into practical use. 1) These methods can be broadly classified as follows: 1. Conductive limbs 114 are formed on the inner surface of the scrap casing by painting, gold-plated 91° plating, vacuum deposition, etc. form.

■ Attach a wire mesh to the synthetic resin casing or inside the device.

■ The casing is made of synthetic resin material mixed with conductive substances such as gold coffin foil and metal fibers, and then crushed.

(Q There are three methods.

The way to form the conductive film is to form a conductive film. Poor reliability, irregularly shaped parts and protrusions f5j-
There remain problems such as difficulty in forming a uniform 7-inch coating on the parts, etc., and the need for post-processing. In addition, as with the method (■), there are some problems, such as the complexity of attaching the wire mesh, the difficulty in processing it into a complicated shape, which limits the shape of the housing (i), and the possibility of deterioration of the wire mesh over time. Shortcomings have been pointed out. Finally, method 1) manufactures the i7 body using a synthetic 11°l fat material mixed with a conductive substance in advance, so it does not require the complicated one-manufacturing process like methods ① and ②, but it uses 7F! ＋? Because specific substances are expensive and are used in large quantities, monthly interest costs increase, large quantities are added, it is difficult to mix them uniformly, and the housing itself is difficult to mix. 1.C is a type of conductor, so insulation processing is required to prevent electric shock, city protection, and internal parts protection, and moldability is reduced and the life of the mold is shortened.
7. This may lead to a decrease in physical properties such as strength and heat resistance of the molded product. I+ that lowers! 1 is there, etc. (y,,) There is a point in 3.1, and it is still solved.
There are many things that should not be done.

The present invention has been made in view of the above five circumstances, and is an intermediate layer between the synthetic resin sheet-like molded materials 1 and 1, which covers almost the entire surface of the synthetic resin-based sheet-like molded materials. The seed-form molding material has the following characteristics:

The present invention will be described below with reference to drawings of embodiments.

1V/1 is an example in which the resin forming the synthetic resin sheet-like molding material is a thermoplastic synthetic resin (11 to 1), and the E132 figure is an example in which the resin forming the synthetic resin-based seed-form molding material is A thin layer (2) containing 1.c from the contact land (1') of F RP is intensively layered over almost the entire surface of the synthetic resin sheet-like molding material, resulting in C(・ru). .

Here "T: Thermoplastic synthetic resin (ll is ABS tree J] '1r, polycarbonate resin, vinyl chloride resin, styrene resin, acrylic resin, A S 4ffJ
Fat.

Modified polyphenylene oxide resin, )z +) F.

Pyrene + t'I, fat, etc. can be used, and F
RPσ) Compound (1') is made by applying glass fiber, carbon fiber, etc. as reinforcement to vesicular polyester, epoxy resin, etc. as a resin base. Selected appropriately.

A thin layer containing conductive material (21) is used in the form of a fiber or mixed on a foil piece. Examples of conductive materials in the form of fibers include metal fibers made of aluminum, copper, copper foil, etc. 1. There are glass fibers with metallized surfaces, carbon fiber sui 1, etc. Foil-like materials include aluminum flakes, etc., and powder-like materials include carbon black, etc. 5) Fiber-like or foil-like materials are usually left as they are in a thin layer (21), but may be formed by forming a layer with another support. The lead interview bar is usually lead rli'
, like paint1. It is often used in the C state or mixed into a film or the like and used as a lump. The conductive 14γ layer (2) is generally formed by forming a sheet of synthetic resin over medium heat, as shown in Figures 1 and 2. However, depending on the purpose, it may be unevenly distributed on either surface as shown in FIG. 3, or two or more thin layers (2) may be formed as shown in FIG.

1t, this conductivity gain -f1 is * 1'J itγ layer (2
) must be present in most parts of the molded product after it is molded using the sheet molding method of the present invention. The stone must be intensively layered over almost the entire area of the synthetic resin sheet material. Additionally, this thin layer (2) undergoes 911 elongation during molding.
Therefore, it is desirable that the temperature be as high as possible. By intensively forming a thin layer (2) containing the conductive flJ, the conductive Tlj can be reduced to 6I'', and the conductivity of the constant b1 can be reduced. Even if the molded layer 1 is stretched during molding due to the material it contains, and the thin layer (2) is substantially stretched thinly, the electromagnetic wave shielding effect will not be affected.

Synthesizing layer (2) containing such a conductive material 4fl II
There are various methods of intensively forming a layer in the middle of the process, but for example, when extruding a thermoplastic synthetic resin sheet using two extruders, the sheet has not yet cooled down. A method is to apply a conductive material on the If'-out sheet located at the lower part of the part, and then roll the upper sheet to integrate it, or use this method. There is a method of supplying and laminating films containing a high concentration of 1 material. In addition, when bonding two synthetic resin sheets together by bonding them together, a conductive material is mixed into the adhesive. (There is also a 5-force method.) When using the compound of
Sheet-form molding 44) is recommended. Do it like this'
[Get 1 Konn 4 DJ Jiil? System sheet molding 4
4. Make the fun of the food into a purpose, even! '? :, 1:
11! TJa is 2 to 10 degrees open.

,su,''-by (7tei-choF included-form 1i'+
, fat-based sheet molding + 4 years old'') is thermal plastic synthesis (αi! In addition, when using an FRP compound, it can be press-molded using a general SMC molding machine.
The body and other molded products have a 41-temperature insulator on the inside and outside surfaces, similar to general synthetic resin molded products, so they look good and do not have any negative effects on slave devices. 1.
Without a doubt, the conductive sheet-like material is located inside all 4 bodies of the 13 [rC] body, so TIE (jD
It is less susceptible to waves, shielding effects, oxidation and deterioration over time, and maintains its performance over a long period of time.

The present invention is based on the configuration as described in detail below.1. Since it is a 4:4 sheet material, it can be applied to conventional manufacturing equipment to produce molded products such as casings. °, it has the advantage of exhibiting a magnetic wave shielding effect over a long period of time.

[Brief explanation of the drawing]

; F 1 Figure 7 Figure 4 h', r, ,Synthetic resin sheet-like molding of the present invention] ゛Partial cross-sectional view showing an example of the 4 materialW)〇〇(])... ...Thermoplastic synthetic resin (white...FRP compound)

Claims (1)

[Claims] 1. A thin layer containing one or more conductive materials in the form of fibers, flakes, or powder particles is placed in the middle of the synthetic resin sheet-like molding material and almost entirely in the synthetic resin sheet-like molding material. Sheet-shaped molding April, April characterized by intensive layering over the area. 2. 'l''j'+i''jtj' indicates that the synthetic resin sheet-shaped molding material is a thermoplastic synthetic resin.
'! The sheet-like molding material described in item 1. 3. Synthetic resin sheet molding 44a:') is FRP
The sheet-shaped molding material according to claim 1, which is a compound of: