JPS5980986A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS5980986A JPS5980986A JP19123182A JP19123182A JPS5980986A JP S5980986 A JPS5980986 A JP S5980986A JP 19123182 A JP19123182 A JP 19123182A JP 19123182 A JP19123182 A JP 19123182A JP S5980986 A JPS5980986 A JP S5980986A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- melting point
- board
- low melting
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は保安機能を有する印刷配線板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board with security functions.
印刷配線板として、最近、小型化・軽量化のために基板
の多層化や印刷配線の細線化が進み、かつ抵抗や半導体
、パワートランジスタ等の発熱性の電子部品の搭載間が
増え、そのために大電流が流れることによって基板が発
煙したり燃焼したりする事故の生、しることがある。Recently, printed wiring boards have become more multi-layered and printed wiring has become thinner in order to make them smaller and lighter, and the mounting distance between heat-generating electronic components such as resistors, semiconductors, and power transistors has increased. Accidents may occur where the circuit board emits smoke or burns due to the flow of a large current.
このような事故を防止するために、基板に設けられた印
刷配線の一部を幅を狭くして、大電流が流れた際にこの
部分が溶断させるような構造にした考案もあるが、印刷
配線として一般に銅箔が用いられておりこの銅箔の融点
が１，０８３℃であり、そのために銅箔が溶断する迄に
基板の発煙や燃焼を防止できず、実施化は不可能であっ
た。In order to prevent such accidents, some ideas have been made to narrow the width of a part of the printed wiring on the board so that this part will melt when a large current flows; Copper foil is generally used for wiring, and the melting point of this copper foil is 1,083°C, which made it impossible to prevent the board from smoking or burning until the copper foil melted, making it impossible to implement this method. .
本発明は、以上の点に鑑み、基板の発煙や燃焼等を防止
しつる印刷配線板の提供を目的とするものである。In view of the above points, the present invention aims to provide a printed wiring board that prevents smoking, combustion, etc. of the board.
本発明は、上記の目的を達成するために、印刷配線の一
部に低融点金属部分を設けることを特徴とする印刷配線
板を提供するものである。In order to achieve the above object, the present invention provides a printed wiring board characterized in that a low melting point metal portion is provided in a part of the printed wiring.
以下、本発明の実施例を図面に基づいて説明する。Embodiments of the present invention will be described below based on the drawings.
図において、１はフェノール樹脂積層板ヤ）エポキシ樹
脂積層板等の基板である。２はこの基板１の表面に設番
ノられた印刷配線であり、銅メッキあるいは銅箔の銅部
分３とこの一部を亜鉛やその合金、鉛等のメッキあるい
は箔を貼り付けた低融点金属部分４に＠換した部分とか
らなっている。In the figure, 1 is a substrate such as a phenol resin laminate or an epoxy resin laminate. 2 is a printed wiring numbered on the surface of this board 1, and a copper part 3 of copper plating or copper foil and a part of this are plated with zinc, its alloy, lead, etc., or a low melting point metal plated with foil. Part 4 consists of the part replaced with @.
本発明は、上記の通り、印刷配線２の一部が低融点金属
部分４かうなっているので、印刷配線２に大電流が流れ
た場合、この低融点金属部分４が溶融し、電流の流れが
遮断されるので基板１の発煙や燃焼が防止される。In the present invention, as described above, a part of the printed wiring 2 has a low melting point metal portion 4, so when a large current flows through the printed wiring 2, this low melting point metal portion 4 melts, and the current flow is blocked, thereby preventing the substrate 1 from smoking or burning.
なお、低融点金属の融点が２５０℃未満では、電子部品
を基板に半田ディツプにより取り付ける際に低融点金属
が溶融し、印刷配線２が断線不良を起こし好ましくない
。また、低融点金属の融点が５００℃Ｊ：り大きいと基
板の材質によっては発煙や燃焼を発生することがあるの
で５００℃以下がより適している。If the melting point of the low melting point metal is less than 250° C., the low melting point metal will melt when attaching the electronic component to the board by soldering dip, which is not preferable because the printed wiring 2 will be disconnected. Furthermore, if the melting point of the low melting point metal is higher than 500°C, smoke or combustion may occur depending on the material of the substrate, so a temperature of 500°C or lower is more suitable.
また、低融点金属として毒性や価格の点から亜鉛やその
合金が好ましく、亜鉛部の場合には作業性や溶断性から
厚さ２０〜５０μＭ程度が良い。Further, as the low melting point metal, zinc or its alloy is preferable from the viewpoint of toxicity and cost, and in the case of the zinc part, the thickness is preferably about 20 to 50 μM from the viewpoint of workability and fusing property.
以上の通り、本発明によれば、印刷配線の一部に低融点
金属部分を設けているので、大電流によって容易にこの
低融点金属部分を溶１！！ ＝ｌることにより基板の発
、煙や燃焼を防１しうる印刷配線板が得られる。As described above, according to the present invention, since a low melting point metal portion is provided in a part of the printed wiring, this low melting point metal portion can be easily melted by a large current. ! By doing this, a printed wiring board can be obtained which can prevent the board from emitting smoke or burning.
図は本発明の実施例の断面図を示づ。 １・・・基板、 ２・・・印刷配線、 ４・・・低融点金属部分。 特許出願人 日立コンデンサ株式会社 The figure shows a cross-sectional view of an embodiment of the invention. 1... Board, 2... Printed wiring, 4...Low melting point metal part. Patent applicant: Hitachi Capacitor Co., Ltd.
Claims (2)
いて、印刷配線の一部に低融点金属部分を設置ノること
を特徴とする印刷配線板。(1) A printed wiring board on which arbitrary printed wiring is installed on a board, characterized in that a low melting point metal part is installed in a part of the printed wiring.
項記載の印刷配線板。(2) The melting point of the low melting point metal is 250°C to 500°C 1
Printed wiring board as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19123182A JPS5980986A (en) | 1982-10-30 | 1982-10-30 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19123182A JPS5980986A (en) | 1982-10-30 | 1982-10-30 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5980986A true JPS5980986A (en) | 1984-05-10 |
Family
ID=16271076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19123182A Pending JPS5980986A (en) | 1982-10-30 | 1982-10-30 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5980986A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176841A (en) * | 1992-11-12 | 1995-07-14 | Seikosha Co Ltd | Wiring board |
-
1982
- 1982-10-30 JP JP19123182A patent/JPS5980986A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176841A (en) * | 1992-11-12 | 1995-07-14 | Seikosha Co Ltd | Wiring board |
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