JPS5965537U - Semiconductor pellet mounting equipment - Google Patents
Semiconductor pellet mounting equipmentInfo
- Publication number
- JPS5965537U JPS5965537U JP16129982U JP16129982U JPS5965537U JP S5965537 U JPS5965537 U JP S5965537U JP 16129982 U JP16129982 U JP 16129982U JP 16129982 U JP16129982 U JP 16129982U JP S5965537 U JPS5965537 U JP S5965537U
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- semiconductor pellet
- mounting equipment
- semiconductor
- pellet mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のペレットマウント装置のＸＹテーブルの
スキャン（移動）方法を示す図、第２図は本考案による
小領域スキャンの方法を示す図、第３図は本考案の一実
施例のブロック図である。
１・・・半導体ウェハー、６． ７． ８． ９・・・
疑似的ストロークリミット、１０・・・ペレット検出部
、１１・・・ウェハー搭載台、１２・・・ＸＹテーブル
、１３・・・ＸＹテーブル制御部。Fig. 1 is a diagram showing a method of scanning (moving) an XY table of a conventional pellet mount device, Fig. 2 is a diagram showing a small area scanning method according to the present invention, and Fig. 3 is a block diagram of an embodiment of the present invention. It is a diagram. 1... semiconductor wafer, 6. 7. 8. 9...
Pseudo stroke limit, 10... Pellet detection unit, 11... Wafer mounting stand, 12... XY table, 13... XY table control unit.
Claims (1)
、該ＸＹテーブル上に装着され、ペレットに分離した半
導体ウェハーを搭載するウェハー搭載台と、該ウェハー
搭載台上のペレットの有無及びその位置を検出するペレ
ット検出部と、特性のそろったペレットをマウン１する
ため半導体ウェハー面を分割した小領域内でＸＹテーブ
ルの進行方向を制御するＸＹテーブル制御部とを備えた
ことを特徴とする半導体ペレットのマウント装置。An XY table that moves in two orthogonal axes in a horizontal plane, a wafer mounting table that is mounted on the XY table and that mounts a semiconductor wafer separated into pellets, and a wafer mounting table that monitors the presence or absence of pellets on the wafer mounting table and its position. A semiconductor pellet comprising: a pellet detection section for detecting pellets; and an XY table control section for controlling the traveling direction of an XY table within a small region obtained by dividing a semiconductor wafer surface in order to mount pellets with uniform characteristics. mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16129982U JPS5965537U (en) | 1982-10-25 | 1982-10-25 | Semiconductor pellet mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16129982U JPS5965537U (en) | 1982-10-25 | 1982-10-25 | Semiconductor pellet mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5965537U true JPS5965537U (en) | 1984-05-01 |
| JPH029554Y2 JPH029554Y2 (en) | 1990-03-09 |
Family
ID=30354526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16129982U Granted JPS5965537U (en) | 1982-10-25 | 1982-10-25 | Semiconductor pellet mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5965537U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292933A (en) * | 1985-06-20 | 1986-12-23 | Rohm Co Ltd | Method and apparatus for picking up pellet |
| JPH02174132A (en) * | 1988-12-26 | 1990-07-05 | Toshiba Corp | Die bonding of semiconductor pellet |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138338U (en) * | 1981-02-24 | 1982-08-30 |
-
1982
- 1982-10-25 JP JP16129982U patent/JPS5965537U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57138338U (en) * | 1981-02-24 | 1982-08-30 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292933A (en) * | 1985-06-20 | 1986-12-23 | Rohm Co Ltd | Method and apparatus for picking up pellet |
| JPH02174132A (en) * | 1988-12-26 | 1990-07-05 | Toshiba Corp | Die bonding of semiconductor pellet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH029554Y2 (en) | 1990-03-09 |
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