JPS5958073A - Heat-bonding sheet - Google Patents

Abstract

PURPOSE:To provide a heat-bonding sheet workable at a relatively low temperature (280-360 deg.C) and having excellent adhesivity, by applying a heat-bonding layer composed of a plasma-polymerized polymer of a perfluorocarbon to the surface of a heat-resistant plastic. CONSTITUTION:For example, the heat-resistant film 1 is placed on the table 3 in the vacuum chamber 2 of a plasma polymerization apparatus, and the pressure in the vacuum chamber 2 is adjusted to 0.001-10Torr by the vacuum pump connected to the evacuation pipe 4. Perfluorocarbon gas is introduced into the chamber by opening the valve 5, and plasma is generated by imposing high- frequency power between the electrodes 6, 6' to form a layer of a perfluorocarbon polymer closely on the film 1 (preferably at a thickness of 0.5-10mu) to obtain the objective sheet.

Description

[Detailed description of the invention] The present invention relates to a thermal adhesive sheet.

A heat-resistant material made of polytetrafluoroethylene (hereinafter referred to as PTFE) or polyimide (hereinafter referred to as PI), etc.
-Gate is used for electrical sheathing, cable bundling, etc.

By the way, thermal sorting is usually done by applying a silicone adhesive to the surface, laminating a tetrafluoroethylene-\xafluoropropylene (hereinafter referred to as FEP) film, or applying and drying a PEP dispersor. Then, a thermal adhesive layer is formed and used. However, in the former case, the heat resistance of the silicone adhesive is low and its use is limited to about 180°C, and there is a problem that the excellent heat resistance of the base material cannot be fully demonstrated. In order to achieve a practical adhesive strength between the adherend and the FEP layer, it is necessary to heat the adhesive to approximately 380°C, which limits the usable adherends to a narrow range. That's another problem.

The present invention solves the above-mentioned problems of the prior art and relates to a heat-adhesive sheet having a novel structure, in which a heat-adhesive layer made of perfluorocarbon plasma polymer is formed on a predetermined surface of a heat-resistant plastic sheet. It's also something that is characterized by something.

The heat-resistant plastic sheet used in the present invention has a heat-resistant temperature of about 30 il"C or higher, and
A material made of a fluororesin such as (r, f p T F B , perfluoroalkoxy resin, F)liP, a heat-resistant plastic such as polyamide, polyamideimide, or polyamide can be used.

The surface of the above heat-resistant plastic 7-t is OFC2F.
6, C2F4, C3F8.03F+6 and other perfluorinated h-bond plasma polymers with a thickness of usually about 0.05~
A 10 μm adhesive layer is formed.

It has been confirmed that the thermal adhesive layer made of perfluorocarbon plasma polymer exhibits excellent thermal adhesive properties at a temperature of about 280 to 360°C. Therefore, the heat-adhesive notebook according to the present invention can be used at higher temperatures than the above-mentioned sheet with a silicone adhesive, exhibits excellent heat resistance of the base material, and is also capable of exhibiting superior heat resistance as compared to a sheet with an FKP layer. , it can be bonded at lower temperatures and can be applied to a wide range of adherends.

The heat-adhesive material according to the present invention can be manufactured using, for example, a plasma polymerization apparatus as shown in the drawings, and the heat-resistant film 1 is placed on a stand 3 in a vacuum container 2 of the plasma polymerization apparatus.
A vacuum pump (not shown) arranged above and connected to the exhaust pipe 4 reduces the pressure inside the container 2 to approximately (1, (l O1~10
Torr, operate the valve 5 to introduce the perfluorocarbon gas, and apply the field frequency power between the electrodes 6 and 6' to generate plasma. Then, this polymer adheres in a layered manner to the upper surface of the heat-resistant film 1. The time required for plasma polymerization is determined depending on the pressure, applied power, etc., but is usually several minutes to a few minutes.
It is one hour.

In this manner, the heat-adhesive layer made of 1R polymer of 1R perfluorocarbon is formed on the surface of the heat-resistant film because the polymer has a low molecular weight of N+ and low crystallinity. Since it is low, about 28
It can be strongly bonded to various adherends in the temperature range of 0-360°C.

The present invention is made up of 44 as described in item 1, and a combination layer of perfluorocarbon that exhibits thermal adhesiveness in a temperature range of approximately 280 to 36°C (1°C) is formed on the surface of a heat-resistant notebook. It has the characteristic of fully exhibiting the excellent heat resistance of -1.

Hereinafter, the present invention will be explained in more detail with reference to Examples.

Example 1 A PI sheet (manufactured by DuPont, part name: Kapton) with a thickness of 100 μnl was placed on the stage 3 of the plasma polymerization apparatus shown in the drawing, and was heated with a vacuum pump (1.0 former 11. T).
After reducing the pressure to below Sr+- and exhausting air, etc., open Nokurupu 5 and introduce CF gas to reduce the pressure to O6l TOrr.
Maintain 4.

Next, concave frequency power of 13.56 MHz and 100 W was applied between the electrodes 6 and 6', and plasma polymerization was performed for 10 minutes.
A 5 μm thick tetrafluoroethylene polymer layer was formed on one side of the polyester to obtain thermal adhesive properties. -ft reminium plates with a thickness of 1M are stacked together and the temperature is 280 "C1 pressure cuff kQ/cytf conditions"
C10C Hot-bonded the pressurizer for 10 minutes [7 seconds].

After that, temperature 25°C1 tensile speed 5011+ffi/
When the contact force between the P exhaust and the aluminum plate was measured using the 18 + 1” beering method under the conditions of min.
950'l/am, and it was determined that the two were firmly bonded.

For comparison, F with a thickness of 6μtn was coated on one side of the above PI/-).
'When I tried to adhere an aluminum plate to a heat-adhesive sheet laminated with EP film, it required a diopter of 380°C and a pressure of 2 (1 kg/cwt.-h!?
The adhesive force was 800 g/c/n.

Example 2 Three types of heat-adhesive sheets were obtained in the same manner as in Example 1, except that the perfluorocarbon gas and plasma polymerization conditions were changed as shown in Table 1 below. In addition, as a power source, a high frequency power source of 13 and 56 MH2 was used for both ringings.

An aluminum plate was thermally bonded to the perfluorocarbon city coalescence forming layer surface of these heat-adhesive sheets under the same conditions as in Example 1, and the adhesive strength was measured. Table 1 shows the results.

Table 1 Example 3 FTFB sheet with a thickness of 200 μm and Ct4 gas were used, and the pressure during plasma polymerization was 0.05 Torr.
13. The polymerization time is 5 minutes, and 13.
56 MH2,2 (Worked in the same manner as in Example 1 except for using 10 W of high-frequency power, and thermal adhesive with a thickness of 0.7 μ#+L'/) CB'44 combined layer formed on the PTFE sheet surface. /-1・14! Ta.

Polymerization Example 1 for Forming a CF4 Polymer Layer with This Thermal Adhesion
In the same manner as in Example 1, an aluminum plate was thermally bonded, and then the adhesive strength was measured in the same manner as in Example 1.
9. , /ctn, and the PTFE sheet and aluminum plate were firmly adhered.

As is clear from the above Examples and Comparative Examples, the adhesive A7 adhesive sheet of the present invention can be bonded at a lower temperature than the conventional PEP layer 1-size thermal adhesive sheet, and has a good bonding strength with the adherend. It has been determined that the cost is equal to or greater than that of conventional products.

[Brief explanation of the drawing]

The drawing is a schematic view showing an example of a plasma polymerization apparatus used to obtain a thermally adhesive sheet according to the present invention. ■... Heat resistant film 2... Decompression container 6.13'... Yugoku 71 tomb 4 Applicant: Nitto Ichiki Kogyo Co., Ltd. Representative: Mr. Hijikata Department

Claims (1)

[Claims] A heat-adhesive sheet comprising a heat-adhesive layer made of perfluorocarbon plasma polymer formed on a predetermined surface of a heat-resistant plastic sheet.