JPS5955433A - Fine pattern conductor - Google Patents

Abstract

PURPOSE:To obtain a large current value with a high density wiring, by forming a thick film pattern made of a photopolymerizable material on a conductive substrate, electrodepositing a conductor, removing the conductive substrate, and forming a thick film fine pattern conductor having rectangular section and a specified thickness or more. CONSTITUTION:A photopolymerizable compsn. layer 5 contg. a photopolymn. initiator having a low absorption coefft. is formed on the conductive substrate 3 made of Al or Zn or the like, a mask 6 having a desired pattern is brought into contact with the layer 5 by the medium of a PP film 9, exposed 7, and developed to remove the unexposed parts with a developing soln. 8, forming a thick film fine pattern 4 rectangular in the section. Then, the conductor 10 is formed between the pattern 4 by copper plating using the substrate 3 as an electrode. An insulating film 12 made of a polyimide film or the like is stuck with pressure and heating using a phenol resin-nitrile rubber type adhesive 11 or the like. The substrate 3 is etched off, and further, the pattern 4 is removed to obtain a fine pattern having a rectangular section and >=20mum height. As a result, a high-density wiring and a large current value are obtained.

Description

[Detailed description of the invention]

The present invention relates to a patterned conductor capable of achieving relatively large conductivity and conductivity in high-density 111[u wiring, and furthermore, the present invention relates to a patterned conductor capable of achieving relatively large conductivity and conductivity in high-density 111[u wiring], and furthermore, the conductor is Form a lid on the patterned portion of the substrate, and then remove the conductive substrate. 1) The relief coefficient of the photopolymerization initiation stiffness of the photopolymerizable composition constituting this relief is compared in the excitation wavelength range. It is characterized by its small size and is one of the most important materials for fine pattern conductors. As shown in FIG. In this case, the ratio of the cross-sectional dimension σ of the relief 2 to the height h is 1/1, which is J′ smaller, and usually 1 wa of the relief 2 is the resist film thickness (relief 20 height 11). The relief 2' of the letterpress printing plate I has a Fuji-shaped cross-sectional shape to prevent deformation when force is applied during printing, as shown in Figure 2. Yes, this one is +IIf
The distance between the relief and the i contact 1 is close at the f part.
child. Therefore, these conventional patterned conductors have a high relief height relative to the relief width and have a rectangular 101 face shape, making it difficult to obtain a 4-thick film with a 4-fine pattern. It cannot be used for various electronic parts etc. that undergo deformation or deterioration.There is one drawback. The present invention was developed in view of the drawbacks of the conventional technology. 7. The present invention relates to a film fine patterned conductor, and the present invention is a photosensitive resin composition for the above-mentioned patterned conductor. 1,), or the f:dissolubility in various solvents is less than δ? 1 photopolymerizable composition with 1, -0 general photosensitive properties (
Among the resin compositions, there are optical double-hatched compositions, diazo thread compositions, and optical "J (
The R-IJI acid temple is busy curing a thick film, which is strange, as mentioned above! It is difficult to use the 1q fine pattern of the present invention for fabricating 811 layers. Kinoe Shigai et al. & J. Sensai investigated and found that the light f "5 specific of the conjugate composition) Y:, ilc conjugate initiator 1. The present invention was completed by discovering that it is possible to obtain a product with a high surface area and a rectangular relief cross section. The original shavings added as a starting material also have a relatively small extinction coefficient.
This can be achieved by using a photopolymerizable composition. light 11

[Synthetic composition is mentioned above in 111! Photosensitivity of system 1'F +Q111
Although it is generally easier to obtain a product with a higher relief height than the M composition, in the present application σ) has the desired relief height of 20μ or more, and has a height h) higher than the relief l], and has a relief cross section. In order to obtain a rectangular shape 11-hook turn, use light 1 [combinant cutting 1] as in book kC1.
There is an 8th sho that uses a smaller version of the 1st branch and the lower rank. Thick potatoes cannot be cured, and the relief height is 81CpJt 'J.
If there is an f-power, then the relief "1" 6, the sacrificial one is missing, and the number of rays passed through one piece is increased. The original version σ) is thicker than the width of the turn, and as a result, the height of the relief is higher than the width of the turn. What is 6001?
It is preferable that the molar extinction coefficient at absorption maximum in the range 11μ to 420 mμ is 1000 g/ml . )'C; 114. Examples of the combination starting ill are those shown by the θζ formula, (Rina. t1 1t1-C-C-R2 11 (J R3 where ItlH: phenyl group,
It2 is l■, hydroxyl group, alkoxy group, haloken, ■(
3 represents a hydroxyl group or an alkoxy group. Examples Evahentwin, benzin methyl ether, benzoin ethyl ether, penzoin inoglopylether, benzoin-fobiyl ether, beni/twin isobutyl ether ether, 2,2-shibiki 7-2-phenylacetophenone, 2,2-dimethoxy -2-phenylacetophenone, 2,2-jethoxy-2-phenylacetophenone 7J, to name a few, p/J. Such optical JK joint cutting is 0.01 to 0.01 to the composition.
It can be used within the range of 1 0 3.1 (jf( A photopolymerization reaction is caused by Mll, and components of the photopolymerizable composition include, for example, a prepolymer having an ethylenically unsaturated group and, if necessary, an ethylenically unsaturated monomer, a t@ polymerization initiation rule, and a thermal polymerization inhibitor. The prepolymers include unsaturated polyesters, unsaturated polyurethanes, oligoester acrylates, unsaturated polyamides, unsaturated polyimides, unsaturated polyethers, and unsaturated poly(meth). Acrylates and their respective ΦV injection bodies, carbon-carbon difli bonds, are known as rubber compounds, JP f.Example 1-.The number average molecular weight of these prepolymers is
Tue: It is common to use 500 or more for J4U. In addition, to give an example of a physical block, unsaturated phase polyesters and alkoxides include unsaturated dibasic acids such as maleic acid, fumar rα, itacon, etc. !l sword and ethylene glycol,
Propylene glycol, diethylene glycol, triethylene glycol, glycerin, Torino I-

[''-propane, pentaerythritol, 1,4-=+rliptadiene with a terminal hydroxyl group, hydrogenated titanium
hydrogenated 1,2-polybutadiene-acrylonitrile)
1 (polyester with polyester such as merging with alcohol, some of the acid components mentioned above, such as phosphoric acid, adipi / [sad, phthal ^
Isophthalic anhydride, Trimeritic acid 1
Examples of unsaturated polyurethanes include polyesters substituted with saturated polybasic acids such as feces, polyesters modified with drying oil fatty acids or semi-drying oil fatty acids, etc.; The terminal V! of the compound linked via the derived Unotane group! Addition-polymerizable unsaturated groups are introduced for incyanate groups or hydroxyl groups, such as 01'. polyols such as polyhydric alcohols, polyester polyols, polyether polyols, etc. 1,4-borine tadiene having a terminal water FFIJN,
tjC stock or non-hydrogenated 1.2M liptadiene, butadiene-styrene copolymer, butadiene-acrylonitrile co-MC combination and toluylene diisocyanate, Schiff 1-
1; Reaction of wood end isocyanate or hydroxyl group of urethane with polyinsyanate such as 11.4'-diyne/anate and herimethylene diisocyanate! r,? Unsaturated group y for A11! ′z
What about active hydrogens such as hydroxyl groups, carboxyl groups, and amino groups among the unsaturated carboxylic acids or esters thereof mentioned above? Introducing an unsaturated group by reacting a compound with incyanate, or introducing an unsaturated group fiP by reacting a compound with a carboxyl group with a hydroxyl group.
4 compounds or the unsaturated polyester mentioned above? Compounds linked by polyisocyanate, etc., can be used as oligoester acrylate 4'1 by making acrylic acid or methacrylic acid coexist with an ester reaction thread of 1-, that is, a polyhydric acid and a polyhydric alcohol. Combine each molar number 71J W and molecule iit 200~5[J
OOX present 1j branch, and once a dihynic acid, phthalic acid, inophthalic acid, inophthalic mycelium [or [・47;, l
Condensation is carried out by coexisting acrylic acid or methacrylic acid in an ester reaction system of 1b water and polyhydric alcohols such as ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, glycerin, trimethylolpropane, pendaerythritol, etc. iJ of epoxy acrylates, such as polyhydric alcohols, polyhydric phenols or polyphenols, with epichlorhydrone or alkylene oxides.
Eboki obtained by rM synthesis reaction /) ^ (!- Compound with acrylic acid (Yo ester with methacrylic acid,
11 (11) A polymeric compound having an addition-polymerizable carbon-carbon double bond in the button, for example, a polymeric compound having a hydroxyl group such as polyvinyl alcohol or cellulose, and a carboxylic acid or its anhydride. Do7An1,1;Sa・
Compounds such as methacrylic acid, polymers of methacrylic acid, or polymers of methacrylic acid or combinations of methacrylic acid, etc.
1 texyl group, r is also molecularized ↑ I has a small sister (11
Alcohol, glycidyl acrylate or methacrylate (ester viscous, anhydrous maleic)
I? In addition, J1 polymers containing glycidyl acrylate or the like as reaction products with allyl alcohol, hydroxyalkyl acrylate or methacrylate, etc. Reactant with ac-11ruic acid or methacrylic rv2]
, [and η(C too many to mention, and various rubber compounds include tl+ 1.4 = lτ liptadiene, 1
．． 2-Polybutadiene, butadiene-styrene co-car body, butadiene-acrylonitrile copolymer, 1', PD
M, ([l) the above (hydrogenated product of Il, isobutylene isoprene copolymer, ethylene propylene copolymer, and +
Known techniques i'1 for compounds of each god rubber or higher shown in 11
；I caused the ethylenic phase crystallization, and the fujiil that was
Examples include phase-modified rubber. Although the compound of +11 can be used as it is, it is convenient to use a compound with a terminal functional group that can be removed from the unsaturated group. ] If a rubber compound having a 1.2-sru butadiene segment is added to the compound (by adding maleic anhydride, then the inf'-tQ
(II 4 can be easily introduced. As a prepolymer other than the above, ethylene 1'←2jj
Compounds that do not contain the two-carrying bond by a mechanism other than the addition of one bond, such as water-soluble (jF-nylon 5,1℃ ribinyl alcohol and its rA i!P (
4: ? : Even if it is used at one time), it is difficult to hold it. As the ethylene small monomer, various known compounds can be used, or it can be converted into Examples of 37 products include acrylic + S'2, methacrylamide-based carbon t1'9 or its ester,
(9 examples are argyl-, Schiff['alkyl-, halogenated-r-roxy, alcoginalkyl-, hydroxyalkyl-, amino-r-ruxy, tetra-10 furfuryl-, allyl-, chrycidyl-, benzyl-, phenoxy- Acrylates and methacrylates, alkylene glycols, mono- or diacrylates and methacrylates of polyoxyalkylene glycols, trimethylolpropane triacrylates and methacrylates, pentaerythritol tetraacrylates and methacrylates, etc., acrylamide 1″′, methacrylamide or its ?A J74 , for example, alkyl, hibiroxyalkyl, N-1〆((also 61 N, N'-i/, ',
lfg+ acrylamide and methacrylamide, diacetone acrylamide and methacrylamide, N
, N'-algylene bisacrylamide and methacrylamide, allyl compounds such as allyl alcohol, allyl isocyanate, diallyl phthalate, triallyl cyanurate, maleic acid, maleic anhydride,
fumar r′ (or its esters, e.g. alkyl,
Alkyl halides, alkoxyalkyl mono- or dimaleates and fumarates, and other non-uniform substances.
Compound '4) Examples include ebastyrene, vinyltoluene, divinylbenzene, N-vinylcarbasol, and N-vinylpyrrolidone. In addition, these monoclear N+li'/azide thread compounds such as 4.4'-diazibistilpene, p-phenylene-bisazide, 4.4'
-Diazidobenzophenone, 4,4'-diazibiphenylmethane, 4,4'di°divicalcone, 2.6
-di(4'-diazidopenzal)-cyclohex'non, 4,4'-diazidostilbene-(1-carboyl
+Z, 4,4'-diazyl-'diphenyl, 4,4
'-Diazidostilbene-2,2'-disulfonic acid sodium can be replaced with 'I'. These instep L: 1 II & 1 Evrevolima 100 weight
The addition level is good in the range of 0 to 200 'jlj Fd parts. In addition, 'f' during the lli weaving: increased quality, saliva and bones due to heat? 1. p to stop X! Polymerization inhibition substances include Banko, hydroquinone, mono-tert-butylhydroquinone, benzoquinone, 2,5-diphenyl-p-benzoquinone, picrin RL, p-)fluorophenylamine, p-methoxyphenol, 2,6-diphenyl-p-benzoquinone, Tertiary-butyl-p-cresol, etc. can be added.These thermal polymerization inhibitors 1j preferably prevent the loss of thermal polymerization reaction (dark reaction).Therefore, the thermal polymerization inhibitors 1j Addition: 0.005 to 5Φ to the total E and H of the prepolymer and crosslinking agent.
It is preferably in the range of 1.4 tones. In the present invention, liquid photocurable compositions are preferred over planar photocurable compositions. The reason for this is that the relief pattern is removed by dissolving and removing the uncured part with I/C various types of I/C of solid light (l force ratio composition removes the uncured part *-7,). While there is a drawback that the relief pattern swells with solvent when the uncured part is dissolved and removed using IJ,
The liquid original hardening fl acid used in the present invention is JP Gen 1.
τ;l::ju: It is the duty to fight off monsters, and in some cases remove them by mechanical means such as F-blow, shower, etc.
? : This is because the relief pattern has the characteristics that can be obtained. The cross-sectional shape and dimensions of the relief of the pattern 24 electric body of the present invention are as specified by the law. That is, as shown in FIG.
The aged relief 4 on the conductive substrate 6 has a height h.
is 20μ or more (preferably &'J, 5!5μ or more)
, IIJa is 5 to 200μ (preferably 10 to 100μ)
), the ratio a/h of the width a and the crystallinity 11 is 5 or less (preferably 11 or less), the cross-sectional shape of the relief 4 is rectangular, and the angle between the side surface of the relief 4 and the base &6 is θ is 90″
±10° (80° to 100°), and furthermore, the mutual spacing b between adjacent reliefs 4 (width of the C-shaped pattern to be placed in this area) is 1CJttl'J. The above-mentioned one-electroconductive substrate 5 is made up of one 28-thickness board, and the pattern is formed by removing it from the 241-th board. In particular, foils of aluminum, tin, lead, etc. are preferably used.
As for the plate, 1 to 500 μL￥P and 10 to 100 tz are frequently used. Other products include Q.kis laminate plastics and metal vapor deposited plastics. For example, a laminate sheet of aluminum foil and polyethylene film or a polyester film made of aluminum vaporized foil can be used. Lead 1 used in the present invention! The surface treatment substrate may be subjected to four different surface treatments as required. For example, cleaning, etching, polishing, 1 of 11
In addition to the shop 7ry and 1st class, there are also things like nurimachi steaming d1 etc. Y: Ijima? X vLjail , +Je, t)g 3 pj)
Tit, R, remove the board'l-Z) iC is removed.
↑Etching characteristics different from the body→−￥tsuJ, 5-electrode], (
Remove by etching using a plate. Electric, 1゛Kasumi゛1. Electric body Cu, i47 space board Aluminum Uno 1, Tin, +1FQly, +Clicker It
71 < Etsufeng with the book liquid, this &', Tentative removal jealousy 1. Talk &r,? ',) is f: led'+Ij,
Body yr-insulation ('R-; 81 on the board, 14-on the board on the board <y<- what you want to do:),
I, < , By doing this, the insulation,
I'il work 1f, pattern possible C can be created. Examples of loquat f4 substrates that can be used in 19 Futagawa include 1, film substrate, B11''n), -5 board, glass, 1 board, ceramic board, and gold λ<+i board coated with an insulating layer. Film substrates are particularly preferred.As film substrates, polyester films, epoxy films, polyimide films, polyparabanic acid films, triazine films, and nato films can all be used, but from the viewpoint of flexibility and heat resistance, A polyimide film, a polyparabanic acid film, and a triazine film are preferable, and the If/% thickness of the film-like substrate is 1.;
It is preferable to use 7 items (as much as possible in the 54-day conversion process). /J I
n, especially 10-150 am, history VC10-100μr
n is a preferred range. Mask it with resist on the akc&e board? (i, l'
lT metsukike χ, above P, edge pouring substrate metal area 1
1. As for the method of pasting it with γ-missing hit, hit flying is 1
Preferably, the heat method using 1 is used. Further, in the case of using adhesion, no particular substrate is used, and it is sufficient to simply apply a layer of 1 coat on the electrolytic plated layer, or they may be bonded together using lf'LTej. Adhesives include polyester-inocyanate thread, phenol resin-petitral thread, phenolic resin-nitrile rubber thread, epoxy-nylon system, epoxy-nitrile rubber thread, etc. It is preferable to use a material with ambiguous M properties, and in particular, epoxy-nitro rubber yarn and phenol resin-nitrile comb yarn are preferable. D5 J? The film thickness of jl is 1 to 200 μm, especially 2 to 200 μm, from the viewpoint of high density and adhesion.
A preferred range is 100 μm. As a method for removing the thin metal plate by etching, a method of etching using a laser beam or etching method is used. Further, when aluminum, tin, or lead is used as the thin metal plate, it is preferable to use an aqueous alkali solution for etching, which does not etch the electroplated conductor. Further, in order to further improve the 4g reliability, after the gold J% thin plate is removed by etching, a process such as providing a protective layer with a polymer is performed. Further, if necessary, removing the photocuring material 1)-7 of the photopolymerizable composition is also carried out. Furthermore, when implementing the present invention, when forming a conductor w2 Ishisugi,! As for the type of electroplating, any conductor may be used, but silver, gold, steel, nickel, tin, etc. are preferred, and copper is particularly preferred from the viewpoint of conductivity and economy. There are cyan ratio phase plating, birophosphate copper plating, copper sulfate plating, copper fluoroborate plating, etc. as copper electrolyte plating, but IF! ? K pyrophosphate 214 plating is preferred. In this case, a conductor A is formed between the reliefs, but it is permissible to leave out a core J that does not contact the conductor pattern in %li contact. i Shiny "[Patterned conductor of the present invention σ) 1'"4'A 1lk1K, +Q l!']
``'1- Next (') JITl') Te Z+ 6
゜That is, in manufacturing the patterned conductor of the present invention;
(as shown in vr 1, as above) 9 d Ken 1 board 3 and light j
([Total t'I, tri-compound acid J-required pattern:
1% transparent image that becomes a mask! , II j After layering on the body 6 and the missing 11L' mountain, this carrier 611+1
From 1, the active ray 7 is illuminated with 1[ρ゛1°C, and then 1
13 bodies 6 and -) Yj, l (non-spotted portions of the composite composition 5 are removed by spraying the present dispersion 8 to form four thick film reliefs on the surface of the substrate 60 as described above, and then Nimeme 4
〃6 Noshi 11-74 is formed and 1 Go II] 1 city, Qi plating) Jl! ! By using the lever, a pattern of sigma is formed between the reliefs 4, and as the adhesive 11 is applied to the outer surface of each of the four electrical bodies 10, The insulating substrate 12 was then fixed to the conductor 101C through this contact layer 1111, and then the conductive substrate 5, which served as the support base for the relief 4 and the 4-sided body 10,
The turn core 1h body of the present invention is created by peeling off and removing the relief 4. Remove the relief 4 by removing the relief 4 shown in νu ((, pattern 75 tfi,
Is it possible to create a body?
, fi of 111+L composition (1 ng!) and 111 body 6
l ni ni ii ii iii s're 1 ko, taku 1 υ tsunorasu 1 - tutasnoir people” (: h ;,,. + ii J series's guide ii 1', Ilg J (!: 4k,
1 to city 8 go 11 composition'; 2] 1 (hereinafter 411 f, 11
1 character) and 1 figure for Ma A4 image Iff
As a way to add 4'Crl ink' to the above group 4
1. 'a;'L'i' is 20~21J00μ and the paint film layer 7 is transferred to the transparent cabinet. Masks and chrome masks made by the salt method, active ('I: )Y; lines that are substantially transparent, plastic films or sheets, transparent glass sheets, cellophonium I' By printing the pattern of Jr.
Success! 1 of course 11C4'+'i I〆. Also 4-ut
, In addition to this, transparent painting 1 request 1110 bodies A, 11 formations'
After forming the snout layer 2! Ne, K('i: close the substrate,
Place the 1° 1 and 4 well, and then use the substrate and the transparent image carrier J' / regulation book spacer for a while? Provide and place d, shi, during this time, liquid composition y! ″
May be injected. 1 cape, e.g. arc lamp, water x1
+N lamp, gysenon lamp, ultraviolet universal firefly) [lamp, solar lamp, incandescent lamp, one laser, L E l) 7z Which light is irradiated with 15A L, composition and transparent image'' []
From the viewpoint of image reproducibility, it is preferable to place the composition in close contact with the body, but if the composition is in liquid form, it is preferable to place the composition in close contact with the body.
111! Providing a 1 meter intermediate layer of transparent plastic film, such as polypropylene film, polycarbonate film, ethylene terephthalate film, acetyl cellulose film, polyvinyl alcohol film, cellophane, etc., between the old body and the composition improves the protection of the transparent stroke carrier. It is effective because it has the effect χ of preventing contact between the image carrier and the composition layer. Mononi 3
The method for removing the base part in 1 is a known method, 1+11.
After 9 winters of image formation electrification, Kawauchi 1 and carrier 1 (lid
Excluded Motomachiai 141. Install it on a drum or flat plate with Kawanari physical agent outside τ111, JI+', I liquid? This can be done by spraying it onto the surface of the printing plate and washing it off, or by dipping a brush in a developer and using the brush to remove the astigmatism spots. The JK shape of the cross section of the relief pattern is irradiation 1 of active light!
It is desirable that it be close to parallel nine lines, but it is not necessarily limited. The most reliable method for adjusting the exposure time is to use a test mask having the same pattern ITI. If the Tenawara relief pattern is trapezoidal, it is 1ii at the time of exposure.
1, -4 < the same, increases if it is offshore or an inverted triangle. Example 1゜Propylene glycol, diethylene glycol, adipi/n2.7-v/l/ (fj f + A/ratio 0.
1510.3510.5510.15 to 100 M of unsaturated polyester antifat (acid value 30), 12 parts of diethylene glycol dimethacrylate, 50 parts of tetraethylene glycol dimethacrylate I + (Niecht 10 xyethyl methac II rate 18 parts, penzoin isopugol ether 2?j15.4 tcrt
The following thick film fine pattern was created using a photopolymerized iE composition prepared by adding 0.06 part of 7" tilcatechol. The molar extinction coefficient of benzoin isobutyl ether is 225 d/mob-+ in benzene. (542m tt
), 219 // mol rM (530
mar ) tertr + ivy. Maro Akira 741X51 Ir, non-transparent 8870μ pitch' (5, negative film kegarasu 41 with air circuit pattern) /Fi /I! Y cover. In this seven, -l: ++8 photosensitive cultivation'1s'e
1rir, L, thick, then this J2 thickness 50
tt, Al foil (70 μm), 11 (after laminating, negative film (1111, exposed for 120 seconds with a 5 KW water-cooled super-infrared pressure mercury lamp)
After exposure, peel off the 11-noropyrene film, wash off the unexposed and uncured areas with a 1% aqueous solution of soda at a liquid temperature of 45°C, and place it on the foil with rtJ50μ.
A fine pattern with a height of 70μ and a spacing of h″F+70μF+70μ and a relief cross section of rectangular thickness was created. At this time, the angle between the side surface and the Al plate was 87°. Thick film fine turn
r)'II, I'f, Ii-\
City, I created a qi circuit. Next, varsho ulli: ampyrroline rN'i
11 Rimetsuki ((Using N', A I R5', c
liA M, kr54? y′rlJ, iAr,
Vfj IWIA/dln'' IH was achieved in 1'rx during the turn of Liu + Il Kelley in the glue installation.The cane was made of DuPont's Po-11 Imide Film Stick's Phenol 4G 41x-Nitrile J A
After drying system 4b Rakusha rXA564-4J, the film thickness was 5 μml.
The above mold. W
(15 pieces of aluminum foil were plated on top of χ)
Paste with heat pressure IQ [2] at 0℃ for 60 minutes, then remove A 13riii in a 5N sodium hydroxide water bath, wiring density 10 wires / armor, body thickness 7
0μ, [D70μ, 50μ between conductors 14]
f. Ki IL13vR *:+V) Puko. 'Example 1' 11 2. Example 1) '1': 2,2-dimethoxy/-2-phenyl-r-humanphenone was used in place of the commercially available compound acid pencey/isobutyl ether.1. ：Kyuzansha Teij
1. 1 eno! A fine pattern of the film was created. 2.2-dimethoxy-2-phenone was absorbed into benzene by 25 5 /
/inole"M<542...It) 1 in ethanol
It was 8 17/mol·m (5 0 Ill/l). 9 Bodhisattva fζriro. 'sQ non';i 1'll 1. 2 widths of transparent Ha instead of negative film. μ, opaque 1; 1; σ Month T] Instead of using a negative film to print a spiral pattern of 80 μ
6 L) tt and carried out 1f11 Same as 1 (,・T operation, relief width 20μ, I depth 60 ti
A spiral relief pattern with a V active of 80μ between the reliefs was created. Then, in the same manner as in Example 1 (7 steps were taken to etch aluminum at λ), a spiral pattern of 7L1, body 11J 80μ, conductor spacing 20μ, and conductor film thickness 6oμ was created. .Example Example i.In place of a 70μ spacer in VC,
It is for 50μ spacer, red f7C and 1'j &
p It, l+: q% 10 layer Jrf. Salmon 150μ
Toshi, water? N% yuan time ke54 due to M type product and silver moon Lτ
The same except that it takes 0 seconds.
K fTl on Mihoki 5 0 μ, l'+'R +'%
A thick film pattern with a relief cross section in the form of an air circuit with a pitch of 15 Ll/' and a pitch of 70 μm was prepared. (J)Ill at this time, and the vertical angle of the supporting substrate was 92°. ) Use this pattern 2 to create a central #ili in the darkness between the reliefs.
1 rll 1 same (>li /L condition) i
l□4 's', 'Ichi Nori sa-1 Here, aluminum 11゛1 etching removed, Jtsu film'CG, circuit? Created [7 blocks. Example 5゜Polyethylene ambate (diol, molecule h12000
) 200 parts tolylene diiso7ane) 551-1s
, dibutyltin laurate [J, b filske, 70 <] - 22 hours, -) and ethylene oxide 9, propylene oxide copolymerizate 0 (ethyltin oxide 55 wt%) Add 100 parts of the block conjugate diol, molecule; 2000) and react with 17, and add 1 block conjugate diol (-) to the inner layer 1 to add an 7 anate group. 300 parts of this polymer
-25 parts of hydroxyethyl methacrylate,
Lokino y 0.1 tsls 7 plus 214 at 70C
Polymer 2 was prepared by adding 500ml of polymer. This polymer 5o O? 5 tl, α-hydroxypropyl methacrylate 75 Bll, rχ-ethylhexyl acrylate) 15? ': L 50ml of n-butyl acrylate and 6 parts of benzoin ethyl ether were added and mixed to prepare a photopolymerizable composition. This composition (
It is a syrup-like composition. The temperature of benzoin ethyl ether is 240 l/mol·c-(542 m tt )' in benzene,
600 // mol・Shin (528 mμ) in ethanol
Met. This photopolymerizable composition 7 was applied to a 150 μm thick C'T cloth on a 100 nm thick aluminum plate, and this was covered with a 91 nm thick polypropylene film.1. Transparent part 50μ
, a pattern of electric turn with a pitch of 100 μ in the non-light part,
Place the negative film on top of it and place the glass plate on it.
t, the light used in Example 1 (i=:4 for 240 seconds at original
)'(-, do. Exposure (:, after the polypropylene film is published, rll +!! 43℃ alkylbenzene sulfone r4 n-da 1 water solution; to the original uncured part χγ bright kneel) , tl on aluminum thin plate]5
Q4. I made a relief 100 tt putter with a spacing of 100μ and a height of 100 tt. In addition to the relief part of this pattern, 5'pil f '+'+3', λ! After doing that,
The aluminum plate was peeled off to obtain an electric circuit with a thickness of Itζ1. 1-C in place of benzoin ethyl ether in Example 5
l-Anthraquinone (absorption coefficient i'! in ethanol)
1.900 //mol・en (554mp)
) was used, but the same operation was performed, or the shape of the relief became tapered and did not adhere to the aluminum surface. Exposure time 6
Although the width of the relief was increased to about 70 μm even though the width was doubled, the relief could not be formed because it did not come into contact with the aluminum surface. 2-Methyl-anthraquinone (extinction coefficient in ethanol, 8007!/lnol-cwI (626m Ii
) The result using f also looked like [glIl'] and it was not possible to create a relief.

[Brief explanation of the drawing]

Figures 1 and 2 are explanatory diagrams showing conventional patterns;
12 is an explanatory diagram showing the pattern of the present invention, 211°41z
1 is an explanatory diagram showing a process of manufacturing a pattern of the present invention. 1.5 is the support substrate, 2.2', 4 is the turn, 5
(Ni 2 polymerizable composition, 6 is carrier, C, U)'
ll, 8 is developer, 10 is electrocardiograph, 11 is adhesive, 12G-! Absolute F7: Sexual substrate. Watch applicant Asahi Kasei Koso Co., Ltd. Figure 1 Figure 2 Figure 3 ↓ JLJ (o) JJJ 8 ■ (E) m- 12 (G) ■ (1) 12

Claims (1)

[Claims] m s >-)Y', l of the photopolymerizable composition on the conductive substrate
l'J! Relief made of monsters pattern 7SB J'
A pattern r9 formed at 173 minutes outside 1 and formed by 47.3 parts of the relief and the conductive substrate that are in contact with each other 1a.
1 (minute 1c/le after forming the 1R prefecture and consolidating the city, lead 11
T, the thickness of 1iλ fine pattern 5 pieces created by removing the base plate is 1.1i, the cross section of the relief is rectangular, and the height of the relief is 2 (J tt D), h. ,
Thick film fine pattern 4 characterized by a relatively small extinction coefficient in the wavelength range where the relief coefficient of parentheses consists of the d + 1 Sumitomo acids.
i (t body. 12) After removing the 4-electroconductive substrate, the relief consisting of the original cured product of the light-containing composition was removed to create 1.
A pattern 4 electric body according to item 1 of the scope of special WF requirements characterized by the following.