JPS5954180U - metal joining equipment - Google Patents
metal joining equipmentInfo
- Publication number
- JPS5954180U JPS5954180U JP14846582U JP14846582U JPS5954180U JP S5954180 U JPS5954180 U JP S5954180U JP 14846582 U JP14846582 U JP 14846582U JP 14846582 U JP14846582 U JP 14846582U JP S5954180 U JPS5954180 U JP S5954180U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- medium solution
- metal bonding
- bonding device
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の金属接合装置を示す説明図、第２図は従
来の金属接合装置の作用を示す説明図、第３図は本考案
の実施例による金属接合装置を示す説明図、第４図は本
考案の実施例による金属接合装置の作用を示す説明図で
ある。
各図中同一部材には同一符号を付し、１０は被接合物、
１２は下部電極、１４．１６は上部電極、１８．２０は
液体槽、３０．３２は接合物、３４゜３６は含浸材、１
００，１０２は媒溶液である。FIG. 1 is an explanatory diagram showing a conventional metal bonding device, FIG. 2 is an explanatory diagram showing the operation of the conventional metal bonding device, FIG. 3 is an explanatory diagram showing a metal bonding device according to an embodiment of the present invention, and FIG. The figure is an explanatory view showing the operation of the metal bonding apparatus according to the embodiment of the present invention. Identical members in each figure are given the same reference numerals, and 10 is the object to be joined;
12 is the lower electrode, 14.16 is the upper electrode, 18.20 is the liquid tank, 30.32 is the bonded material, 34°36 is the impregnating material, 1
00,102 is a medium solution.
Claims (1)
的に接触する上部電極及び下部電極と、媒溶液が貯えら
れた液体槽と、を含み、被接合物と接合物との間に晩媒
溶液を媒介させて両電極から電流を供給し、抵抗接合を
行う金属接合装置において、媒溶液を含浸し被接合物及
び液体槽に接触する位置に移動する含浸材を設け、含浸
材が被接合物表面に移動して接触したときに、被接合物
に媒溶液が塗布され、含浸材が液体槽に接触する・
位置に移動したときに、液体槽の媒溶液が含浸材に含浸
されることを特徴とする金属接合装置。It includes an upper electrode and a lower electrode that are arranged opposite to each other and electrically contact the object to be bonded and the object to be bonded, respectively, and a liquid tank in which a medium solution is stored, and a late medium solution is provided between the object to be bonded and the object to be bonded. In a metal bonding device that performs resistance bonding by supplying current from both electrodes via a When it moves to the surface and comes into contact with it, the medium solution is applied to the object to be joined, and the impregnating material comes into contact with the liquid bath.
1. A metal bonding device characterized in that an impregnating material is impregnated with a medium solution in a liquid bath when the metal bonding device is moved to a certain position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14846582U JPS5954180U (en) | 1982-09-30 | 1982-09-30 | metal joining equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14846582U JPS5954180U (en) | 1982-09-30 | 1982-09-30 | metal joining equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5954180U true JPS5954180U (en) | 1984-04-09 |
Family
ID=30329848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14846582U Pending JPS5954180U (en) | 1982-09-30 | 1982-09-30 | metal joining equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954180U (en) |
-
1982
- 1982-09-30 JP JP14846582U patent/JPS5954180U/en active Pending
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