JPS5953908U - Mold temperature control device - Google Patents

Mold temperature control device

Info

Publication number
JPS5953908U
JPS5953908U JP14797482U JP14797482U JPS5953908U JP S5953908 U JPS5953908 U JP S5953908U JP 14797482 U JP14797482 U JP 14797482U JP 14797482 U JP14797482 U JP 14797482U JP S5953908 U JPS5953908 U JP S5953908U
Authority
JP
Japan
Prior art keywords
mold
passage
plate
water
mold temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14797482U
Other languages
Japanese (ja)
Other versions
JPH033380Y2 (en
Inventor
尾関 衛
Original Assignee
東芝機械株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝機械株式会社 filed Critical 東芝機械株式会社
Priority to JP14797482U priority Critical patent/JPS5953908U/en
Publication of JPS5953908U publication Critical patent/JPS5953908U/en
Application granted granted Critical
Publication of JPH033380Y2 publication Critical patent/JPH033380Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は従来の金型温度調節装置の説明図
、第3図乃至第5図はこの考案に係る金型温度調節装置
の要部断面図である。 44・・・・・・移動グイプレート、46・・・・・・
固定ダイプレート、48.50・・・・・・給水通路、
52.54・・・・・・排水通路、56・・・・・・移
動金型、58・・・・・・固定金型、60.62・・・
・・・通水路、64.66・・・・・・接続部、68・
・・・・・ノックアウトピン、70・・・・・・プラン
ジャ、72・・・・・・移動グイプし/−ト、74. 
76・・・・・・突出部、78・・・・・・給水通路、
80・・・・・・排水通路、82・・・・・・移動金型
、84.86・・・・・・ブラケット、88・・・・・
・給水ガイド、90・・・・・・排水ガイド、92・・
・・・・波型通水路、94・・・・・・移動グイプレー
ト、96・・・・・・金型取付板、98・・・・・・給
水通路、100・・丘・排水通路、102・・・・・・
金型。
1 and 2 are explanatory diagrams of a conventional mold temperature regulating device, and FIGS. 3 to 5 are sectional views of essential parts of the mold temperature regulating device according to this invention. 44...Moving Gui plate, 46...
Fixed die plate, 48.50... Water supply passage,
52.54...Drainage passage, 56...Moving mold, 58...Fixed mold, 60.62...
...Waterway, 64.66...Connection part, 68.
...Knockout pin, 70...Plunger, 72...Move grip/to, 74.
76...Protrusion, 78...Water supply passage,
80... Drain passage, 82... Moving mold, 84.86... Bracket, 88...
・Water supply guide, 90...Drainage guide, 92...
... Wave-shaped water passage, 94 ... Moving guide plate, 96 ... Mold mounting plate, 98 ... Water supply passage, 100 ... Hill / drainage passage, 102...
Mold.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)型締装置を構成する一対のグイプレートに夫々中
なくとも一つの給水通路と排水通路とを設け、一方前記
各ダイブレートに固着される一対の金型内部に通水路を
設け、グイプレートと金型とを突き合わせ密着させるこ
とにより金型温度調節のための通水回路を構成すること
を特徴とする金型温度調節装置。
(1) A pair of die plates constituting the mold clamping device are each provided with at least one water supply passage and a drainage passage, while a water passage is provided inside the pair of molds fixed to each die plate, and the die plate is provided with a water supply passage and a drainage passage. A mold temperature regulating device characterized in that a water passage circuit for regulating mold temperature is constructed by abutting and bringing a plate and a mold into close contact.
(2)実用新案登録請求の範囲第1項記載の金型温度調
節装置において、少なくとも一方のグイプレートの長手
方向両端部に突出部を設け、これらの突出部に給水通路
と排水通路とを夫々設け、一方今型の両側部にブラケッ
トを設け、夫々のブラケットに給水ガイドと排水ガイド
とを設けると共にこれら両ガイドを金型内部に設けた通
水路に連通し、金型をグイプレートに装着するに際し前
記ブラケットの端部をグイプレートの突出部に突き合わ
せることにより金型温度調節のための通水回路を構成す
ることからなる金型温度調節装置。′
(2) Utility Model Registration Scope of Claims In the mold temperature control device according to claim 1, protrusions are provided at both ends in the longitudinal direction of at least one of the gui plates, and a water supply passage and a drainage passage are provided in these protrusions, respectively. On the other hand, brackets are provided on both sides of the mold, a water supply guide and a drainage guide are provided on each bracket, and both guides are communicated with a water passage provided inside the mold, and the mold is attached to the goui plate. A mold temperature regulating device comprising: forming a water flow circuit for regulating the mold temperature by abutting the end of the bracket against the protrusion of the Goui plate. ′
(3)実用新案登録請求の範囲第1項記載の金型温度調
節装置において、グイプレートと金型との間に金型取付
板を介装し、前記取付板に少なくとも一つの給水通路と
排水通路とを設け、一方前記取付板に装着される金型内
部に通水路を設け、取付板と金型とを突き合わせ密着さ
せることにより金型温度調節のための通水回路を構成す
ることからなる金型温度調節装置。
(3) Utility model registration Scope of claims In the mold temperature control device according to claim 1, a mold mounting plate is interposed between the gou plate and the mold, and the mounting plate has at least one water supply passage and a drainage pipe. A water passage is provided inside the mold mounted on the mounting plate, and a water passage is provided inside the mold mounted on the mounting plate, and the mounting plate and the mold are brought into close contact with each other to form a water flow circuit for controlling the temperature of the mold. Mold temperature control device.
(4)実用新案登録請求の範囲第1項乃至第3項記載の
金型温度調節装置において、金型の内部に “設けられ
る通水路は波形に構成されることからなる金型温度調節
装置。
(4) Utility Model Registration The mold temperature regulating device according to claims 1 to 3, wherein the water passage provided inside the mold is configured in a corrugated shape.
JP14797482U 1982-10-01 1982-10-01 Mold temperature control device Granted JPS5953908U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14797482U JPS5953908U (en) 1982-10-01 1982-10-01 Mold temperature control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14797482U JPS5953908U (en) 1982-10-01 1982-10-01 Mold temperature control device

Publications (2)

Publication Number Publication Date
JPS5953908U true JPS5953908U (en) 1984-04-09
JPH033380Y2 JPH033380Y2 (en) 1991-01-29

Family

ID=30328910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14797482U Granted JPS5953908U (en) 1982-10-01 1982-10-01 Mold temperature control device

Country Status (1)

Country Link
JP (1) JPS5953908U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166462U (en) * 1984-04-10 1985-11-05 本田技研工業株式会社 casting mold
JPH0357463U (en) * 1990-09-13 1991-06-03
JPH0681713U (en) * 1993-04-28 1994-11-22 株式会社アサヒ Plastic bath mold

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023365U (en) * 1973-06-27 1975-03-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023365U (en) * 1973-06-27 1975-03-15

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166462U (en) * 1984-04-10 1985-11-05 本田技研工業株式会社 casting mold
JPH0357463U (en) * 1990-09-13 1991-06-03
JPH0681713U (en) * 1993-04-28 1994-11-22 株式会社アサヒ Plastic bath mold

Also Published As

Publication number Publication date
JPH033380Y2 (en) 1991-01-29

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