JPH033380Y2 - - Google Patents
Info
- Publication number
- JPH033380Y2 JPH033380Y2 JP1982147974U JP14797482U JPH033380Y2 JP H033380 Y2 JPH033380 Y2 JP H033380Y2 JP 1982147974 U JP1982147974 U JP 1982147974U JP 14797482 U JP14797482 U JP 14797482U JP H033380 Y2 JPH033380 Y2 JP H033380Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- water
- die plate
- water supply
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 51
- 238000007789 sealing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、射出成形機の金型温度調節装置に
係り、特に型締装置においてダイプレートへの金
型装着を簡便に達成することができる金型温度調
節装置に関する。[Detailed description of the invention] [Industrial application field] This invention relates to a mold temperature control device for an injection molding machine, and in particular can easily achieve mold attachment to a die plate in a mold clamping device. The present invention relates to a mold temperature control device.
一般に、金型温度の制御は、成形品の品質およ
び成形作業能率に及ぼす影響が大きく、射出成形
における操作管理上の重要な要素となつている。
In general, mold temperature control has a large effect on the quality of molded products and molding work efficiency, and has become an important element in operational management in injection molding.
例えば、金型の冷却を迅速に行うことによつて
結晶化を抑制し、無定形部分を多くして透明な成
形品を得るためには、少なくとも金型温度を5〜
25℃以内に保持することが行われる。そこで、こ
のように金型温度を保持するため、従来より所謂
個別接続法および集中接続法と称する金型への通
水手段が利用されている。 For example, in order to suppress crystallization and increase the amorphous portion by cooling the mold quickly to obtain a transparent molded product, the mold temperature must be at least 5 to 5.
The temperature must be kept within 25°C. Therefore, in order to maintain the mold temperature in this manner, means for passing water through the mold, known as the so-called individual connection method and the centralized connection method, have been used.
すなわち、前者の個別接続法は、第1図に示す
ように、相対する金型10の各側面から複数の給
水枝管12と排水枝管14とをそれぞれ導出し、
給水枝管12を直接差し込みまたはカプラを使用
して給水本管16に配設された複数の給水ガイド
18に接続し、さらに排水枝管14を排水本管2
0の受部22に接続して構成したものである。こ
れに対し、後者の集中接続法は、第2図に示すよ
うに、一端部が排水本管26に弁装置28を介し
て接続した給水コネクタ30を、所定間隔離間し
て配設された複数の弁付き給水枝管32を介して
金型34の一方の側面に連通し、また一端部を排
水本管36の受部38に接続した排水コネクタ4
0を、所定間隔離間して配設された複数の排水枝
管42を介して金型34の他方の側面に連通して
構成したものである。 That is, the former individual connection method, as shown in FIG. 1, leads out a plurality of water supply branch pipes 12 and drainage branch pipes 14 from each side of the opposing mold 10,
The water supply branch pipe 12 is directly inserted or connected to a plurality of water supply guides 18 arranged in the water supply main pipe 16 using a coupler, and the drainage branch pipe 14 is connected to the water supply main pipe 2.
This configuration is connected to the receiving portion 22 of No. 0. On the other hand, in the latter centralized connection method, as shown in FIG. A drain connector 4 communicates with one side of the mold 34 via a valved water supply branch pipe 32 and has one end connected to a receiving portion 38 of a drain main pipe 36.
0 is connected to the other side of the mold 34 via a plurality of drainage branch pipes 42 arranged at predetermined intervals.
これらの従来から利用されている金型温度調節
手段によれば、金型の通水路を構成する要素とし
てそれぞれ種々の弁装置を備えているため、これ
を型締装置を構成するダイプレートに装着する場
合、必然的に前記種々の弁装置の開閉を行うため
の人為的作業を必要とし、型締装置における金型
装着の自動化を困難にしている。特に、移動ダイ
プレートに通水路を設ける場合、その加工作業が
煩雑となる。すなわち、移動ダイプレートに設け
られている金型装着のためのT溝と干渉する個所
や移動ダイプレートを貫通する製品押出棒の取付
穴と干渉する個所には、通水路を設けることがで
きないので、金型装着の自動化に適する個所に通
水路を設けることが困難になると共に、加工作業
に多くの制約を受けることから通水路の穴あけ加
工に手間が掛り、加工コストが増大する。
According to these conventionally used mold temperature control means, each of them is equipped with various valve devices as elements constituting the mold passageway, so it is necessary to attach these to the die plate that constitutes the mold clamping device. In this case, manual operations are inevitably required to open and close the various valve devices, making it difficult to automate mold mounting in the mold clamping device. In particular, when a passageway is provided in the movable die plate, the processing operation becomes complicated. In other words, it is not possible to provide water passages in areas that interfere with the T-slots for mounting molds provided on the movable die plate or with the attachment holes of the product extrusion rods that pass through the movable die plate. In addition, it becomes difficult to provide a passageway at a location suitable for automation of mold mounting, and since there are many restrictions on processing operations, it takes time and effort to drill holes for the passageway, increasing processing costs.
そこで、本考案の目的は、金型をダイプレート
に装着するだけで簡便かつ確実に金型の温度調節
を行う通水回路を構成することができ、型締装置
における金型装着の完全自動化を達成することが
できる金型温度調節装置を提供することにある。 Therefore, the purpose of this invention is to be able to construct a water flow circuit that easily and reliably controls the temperature of the mold simply by mounting the mold on the die plate, and to fully automate mold mounting in the mold clamping device. The object of the present invention is to provide a mold temperature control device that can achieve the above objectives.
本考案に係る金型温度調節装置は、型締装置を
構成する一対のダイプレートにそれぞれ着脱自在
に装着される一対の金型内部にそれぞれ通水路を
設け、これらの金型を前記各ダイプレートに装着
することにより金型温度調節のための通水回路を
構成してなる金型温度調節装置において、
移動ダイプレートの長手方向両端部に突出部材
を設けると共にこれら突出部材に給水通路と排水
通路とをそれぞれ設け、一方金型の両面にブラケ
ツト部を設け、これらのブラケツト部に給水ガイ
ドと排水ガイドとを設けると共にこれら両ガイド
を前記金型内部に設けた通水路とそれぞれ連通
し、前記各突出部材の各通水路開口端部と前記各
ブラケツト部の各ガイド開口端部とをシール部材
を介して突き合わせ密着することを特徴とする。
The mold temperature control device according to the present invention includes a pair of molds that are removably attached to a pair of die plates constituting a mold clamping device. In a mold temperature control device that configures a water flow circuit for controlling mold temperature by being attached to a movable die plate, projecting members are provided at both ends in the longitudinal direction of the movable die plate, and water supply passages and drainage passages are provided in these projecting members. and a bracket part is provided on both sides of the mold, and a water supply guide and a drainage guide are provided in these bracket parts, and these guides are respectively communicated with a water passage provided inside the mold, and each of the above-mentioned The present invention is characterized in that each water passage opening end of the projecting member and each guide opening end of each of the brackets are brought into close contact with each other by abutting each other via a sealing member.
本考案に係る金型温度調節装置によれば、型締
装置を構成する一対のダイプレートにそれぞれ着
脱自在に装着される一対の金型内部にそれぞれ通
水路を設け、これらの金型を前記各ダイプレート
に装着することにより金型温度調節のための通水
回路を構成してなる金型温度調節装置において、
移動ダイプレートに突出部材を設けてこの突出部
材にそれぞれ給水通路および排水通路を設けるこ
とにより、移動ダイプレートには通水路を設けな
いために該ダイプレートと金型との装着が簡便と
なり、通水回路の接続は移動ダイプレートに設け
た突出部材と金型との突き合わせによつて確実に
達成することができる。従つて、本考案の金型温
度調節装置によれば、型締装置における金型の装
着を容易に自動化することができる。
According to the mold temperature control device according to the present invention, a passageway is provided inside each of the pair of molds that are detachably attached to the pair of die plates constituting the mold clamping device, and these molds are connected to each of the above-mentioned molds. In a mold temperature control device that configures a water flow circuit for controlling mold temperature by being attached to a die plate,
By providing a protruding member on the movable die plate and providing a water supply passage and a drainage passage on each of the protruding members, the movable die plate does not have a water passage, and therefore the die plate and the mold can be easily attached to each other. Connection of the water circuit can be reliably achieved by abutting the protruding member provided on the movable die plate with the mold. Therefore, according to the mold temperature control device of the present invention, it is possible to easily automate the mounting of the mold in the mold clamping device.
次に、本考案に係る金型温度調節装置の実施例
につき、添付図面を参照しながら以下詳細に説明
する。
Next, embodiments of the mold temperature control device according to the present invention will be described in detail below with reference to the accompanying drawings.
第3図は、本考案に係る金型温度調節装置の一
実施例を示すものである。すなわち、第3図にお
いて、参照符号72および46はそれぞれ型締装
置を構成する移動ダイプレートおよび固定ダイプ
レートを示し、これら移動ダイプレート72と固
定ダイプレート46に対してそれぞれ移動金型8
2と固定金型58が装着されている。 FIG. 3 shows an embodiment of the mold temperature control device according to the present invention. That is, in FIG. 3, reference numerals 72 and 46 respectively indicate a movable die plate and a fixed die plate constituting the mold clamping device.
2 and a fixed mold 58 are attached.
しかるに、本実施例においては、移動ダイプレ
ート72の長手方向両端部に突出部材74,76
を設け、前記突出部材74には給水通路78を開
設すると共に前記突出部材76には排水通路80
を開設する。また、移動金型82には、波形通水
路92を設けると共に、該移動金型82の両側に
ブラケツト部84,86を設け、一方のブラケツ
ト部84に給水ガイド88を設け、他方のブラケ
ツト部86に排水ガイド90を設けて、これら両
ガイド88,90を前記通水路92にそれぞれ連
通する。 However, in this embodiment, protruding members 74 and 76 are provided at both ends of the movable die plate 72 in the longitudinal direction.
A water supply passage 78 is provided in the protrusion member 74, and a drainage passage 80 is provided in the protrusion member 76.
will be established. Further, the movable mold 82 is provided with a corrugated water passage 92, and bracket portions 84, 86 are provided on both sides of the movable mold 82, a water supply guide 88 is provided on one bracket portion 84, and a water supply guide 88 is provided on the other bracket portion A drainage guide 90 is provided in the drain guide 90, and both guides 88, 90 are connected to the water passage 92, respectively.
これに対し、固定ダイプレート46には給水通
路50と排水通路54とを設け、そして固定金型
58には波形通水路62を設ける。 On the other hand, the fixed die plate 46 is provided with a water supply passage 50 and a drainage passage 54, and the fixed mold 58 is provided with a corrugated water passage 62.
このように構成した移動ダイプレート72と固
定ダイプレート46に対し、それぞれ移動金型8
2と固定金型58を装着するに際し、移動ダイプ
レート72側ではその突出部材74,76に移動
金型82のブラケツト部84,86をそれぞれ突
き合わせることにより、直ちに金型温度調節のた
めの通水回路が構成される。また、固定ダイプレ
ート46側においても、これに固定金型58を装
着するだけで、直ちに金型温度調節のための通水
回路が構成される。 For the movable die plate 72 and the fixed die plate 46 configured in this way, the movable die 8
2 and fixed mold 58, on the movable die plate 72 side, by butting the bracket parts 84, 86 of the movable mold 82 against the protruding members 74, 76, respectively, the passage for mold temperature adjustment is immediately established. A water circuit is constructed. Also, on the fixed die plate 46 side, simply by attaching the fixed mold 58 thereto, a water flow circuit for controlling mold temperature is immediately constructed.
なお、この場合、突出部材74,76とブラケ
ツト部84,86のそれぞれ給水通路78と給水
ガイド88および排水通路80と排水ガイド90
との接続部、すなわち前記両ガイド88,90の
開口端部側には、それぞれOリングやインロー等
のシール部材64,66を設けてシールを行う。
同様にして、固定ダイプレート46と固定金型5
8についても、それぞれ給水通路50および排水
通路54と通水路62との接続部、すなわち前記
通水路62の開口端部側にシール部材64,66
を設けてシールを行う。さらに、参照符号68
は、プランジヤ70の一端部に保持されて移動金
型82から成形品を取出すためのノツクアウトピ
ンを示す。 In this case, the water supply passage 78 and the water supply guide 88 and the drainage passage 80 and the drainage guide 90 of the protruding members 74 and 76 and the bracket parts 84 and 86 respectively
Sealing members 64 and 66 such as O-rings and spigots are provided at the connection portions with the guides 88 and 90, that is, at the open end sides of the guides 88 and 90, respectively, for sealing.
Similarly, the fixed die plate 46 and the fixed mold 5
8, seal members 64 and 66 are provided at the connection portions between the water supply passage 50 and the drainage passage 54 and the water passage 62, that is, on the open end side of the water passage 62, respectively.
Provide a seal. Additionally, reference numeral 68
shows a knockout pin which is held at one end of the plunger 70 and is used to take out the molded product from the movable mold 82.
前述した実施例から明らかなように、本考案に
よれば、移動ダイプレートの長手方向両端部に突
出部材を設けると共にこれら突出部材に給水通路
と排水通路とをそれぞれ設け、一方金型の両面に
ブラケツト部を設け、これらのブラケツト部に給
水ガイドと排水ガイドとを設けると共にこれら両
ガイドを前記金型内部に設けた通水路とそれぞれ
連通し、前記各突出部材の各通水路開口端部と前
記各ブラケツト部の各ガイド開口端部とをシール
部材を介して突き合わせ密着するものであるか
ら、従来困難とされた型締装置における金型の自
動装着を容易に達成することができる。
As is clear from the embodiments described above, according to the present invention, protruding members are provided at both ends of the moving die plate in the longitudinal direction, and water supply passages and drainage passages are provided on these protruding members, respectively. A bracket portion is provided, and a water supply guide and a drainage guide are provided in these bracket portions, and these guides are respectively communicated with a water passage provided inside the mold, and the opening end of each water passage of each of the protruding members and the water passage guide are provided in the bracket portion. Since the respective guide opening ends of each bracket are brought into close contact with each other through the sealing member, automatic mounting of the mold in a mold clamping device, which has been difficult in the past, can be easily achieved.
特に、移動ダイプレートは、通水路を設けない
ためにその加工が容易となるばかりでなく、金型
の装着を行う機能のみを有すればよいので、その
取扱いが容易となる。従つて、金型は突出部材と
の間で通水回路の接続を行うため、移動ダイプレ
ートへの金型の装着と同時に突出部材との突き合
わせを行つて簡便かつ確実に通水回路を構成し、
直ちに通水作業を開始することができる。 In particular, the movable die plate is not only easy to process because it does not have a passageway, but also easy to handle because it only needs to have the function of mounting a mold. Therefore, in order to connect the water passage circuit between the mold and the protruding member, the mold is attached to the movable die plate and matched with the protruding member at the same time, thereby easily and reliably constructing the water passage circuit. ,
Water flow work can be started immediately.
また、本考案装置においては、突出部材と金型
との突き合わせによつて通水回路を構成するた
め、金型の通水路開口端部にシール部材を設け
て、確実なシールを達成できると共に該シール部
材の交換も容易であり、前述した移動ダイプレー
トへの金型の自動装着と共に金型温度調節装置の
全自動化に寄与する効果は極めて大きい。 In addition, in the device of the present invention, since the water passage circuit is constructed by butting the protruding member and the mold, it is possible to provide a sealing member at the opening end of the water passage of the mold and achieve reliable sealing. The sealing member is easy to replace, and the effect of contributing to the automatic attachment of the mold to the movable die plate described above and the full automation of the mold temperature control device is extremely large.
第1図および第2図は従来の金型温度調節装置
のそれぞれ概略説明図、第3図は本考案に係る金
型温度調節装置の一実施例を示す要部断面図であ
る。
46……固定ダイプレート、50……給水通
路、54……排水通路、56……移動金型、58
……固定金型、62……波形通水路、64,66
……シール部材、68……ノツクアウトピン、7
0……プランジヤ、72……移動ダイプレート、
74,76……突出部材、78……給水通路、8
0……排水通路、82……移動金型、84,86
……ブラケツト部、88……給水ガイド、90…
…排水ガイド、92……波形通水路。
FIGS. 1 and 2 are schematic explanatory views of a conventional mold temperature control device, and FIG. 3 is a sectional view of essential parts showing an embodiment of the mold temperature control device according to the present invention. 46...Fixed die plate, 50...Water supply passage, 54...Drainage passage, 56...Moving mold, 58
... Fixed mold, 62 ... Corrugated water passage, 64, 66
... Seal member, 68 ... Knockout pin, 7
0... Plunger, 72... Moving die plate,
74, 76...Protruding member, 78...Water supply passage, 8
0... Drain passage, 82... Moving mold, 84, 86
... Bracket section, 88 ... Water supply guide, 90 ...
...Drainage guide, 92...Corrugated waterway.
Claims (1)
ぞれ着脱自在に装着される一対の金型内部にそれ
ぞれ通水路を設け、これらの金型を前記各ダイプ
レートに装着することにより金型温度調節のため
の通水回路を構成してなる金型温度調節装置にお
いて、 移動ダイプレートの長手方向両端部に突出部材
を設けると共にこれら突出部材に給水通路と排水
通路とをそれぞれ設け、一方金型の両面にブラケ
ツト部を設け、これらのブラケツト部に給水ガイ
ドと排水ガイドとを設けると共にこれら両ガイド
を前記金型内部に設けた通水路とそれぞれ連通
し、前記各突出部材の各通水路開口端部と前記各
ブラケツト部の各ガイド開口端部とをシール部材
を介して突き合わせ密着することを特徴とする金
型温度調節装置。[Claims for Utility Model Registration] A passageway is provided inside each of a pair of molds that are detachably attached to a pair of die plates constituting a mold clamping device, and these molds are attached to each of the die plates. In a mold temperature control device which constitutes a water flow circuit for controlling mold temperature, projecting members are provided at both longitudinal ends of the movable die plate, and water supply passages and drainage passages are provided in these projecting members, respectively. On the other hand, bracket portions are provided on both sides of the mold, and a water supply guide and a drainage guide are provided in these bracket portions, and these guides are respectively communicated with water passages provided inside the mold, so that each of the protruding members A mold temperature control device characterized in that each water passage opening end and each guide opening end of each of the brackets are butted and brought into close contact with each other via a sealing member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14797482U JPS5953908U (en) | 1982-10-01 | 1982-10-01 | Mold temperature control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14797482U JPS5953908U (en) | 1982-10-01 | 1982-10-01 | Mold temperature control device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5953908U JPS5953908U (en) | 1984-04-09 |
JPH033380Y2 true JPH033380Y2 (en) | 1991-01-29 |
Family
ID=30328910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14797482U Granted JPS5953908U (en) | 1982-10-01 | 1982-10-01 | Mold temperature control device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5953908U (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60166462U (en) * | 1984-04-10 | 1985-11-05 | 本田技研工業株式会社 | casting mold |
JPH0527248Y2 (en) * | 1990-09-13 | 1993-07-12 | ||
JP2581116Y2 (en) * | 1993-04-28 | 1998-09-21 | 株式会社アサヒ | Plastic bathtub mold |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5023365U (en) * | 1973-06-27 | 1975-03-15 |
-
1982
- 1982-10-01 JP JP14797482U patent/JPS5953908U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5953908U (en) | 1984-04-09 |
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