JPS5952942B2 - Cu alloy with high heat resistance and high conductivity - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inexpensive Cu alloy that has high heat resistance and high conductivity.

Conventionally, Cu-Ag alloys have been widely used in the production of components that require high heat resistance and high conductivity, such as conductive materials for electronic components and electronic devices, commutator pieces, and coil windings. It is used. However, the current situation is that the scope of its use is gradually being restricted due to economic considerations due to the sharp increase in the price of Ag ingots in recent years. Therefore, the above Cu-Ag
Cu-S, which is inexpensive and has excellent heat resistance, replaces alloys based on Cu-S.
Attempts have been made to use n-based alloys and Cu-Fe-P-based alloys, but these Cu alloys have drawbacks in conductivity, so they cannot be a complete substitute for the Cu-Ag alloys mentioned above. It was hot.

From the above-mentioned viewpoint, the present inventors have proposed the above-mentioned conventional Cu
- As a result of conducting research to obtain a substitute material for Ag-based alloys without containing Ag, we found that B■0.0005 to 0.0
1%, Mg: 0.002-0.05%, and further contains P: 0.001-0.01%, In: 0.002-0.
Composition containing one or more of 0.03% and 0.001 to 0.06%, and the remainder consisting of Cu and unavoidable impurities (all percentages by weight are % by weight) Conventionally, Cu-Ag alloys with
They found that it not only has high electrical conductivity equivalent to that of alloys, but also has higher heat resistance than that.

This invention was made based on the above knowledge, and the reason why the component composition range was limited as described above will be explained below.

(a) B and Mg These components have the effect of improving the heat resistance of the alloy, but B: less than 0.0005% and Mg: 0.0%, respectively.
If B:0.01% and Mg:0, respectively, the desired high heat resistance cannot be secured.
．． Even if the content exceeds 0.05%, the effect of improving the heat resistance of the layer will not be seen, and on the contrary, the conductivity will decrease.
0.01%, θ Mg: 0.002 to 0.05%.

(b) P, In, and Te These components have an equal effect in coexisting with B and Mg to further improve the heat resistance of the alloy without impairing the high conductivity of Cu. However, P: less than 0.001%, In:
At less than 0.002% and less than 0.001%, the desired heat resistance improvement effect cannot be obtained;
0.01%, In: 0.03%, and Te: 0.06
Even if the content exceeds %, no further improvement in heat resistance will be obtained, but rather will lead to a decrease in conductivity and plastic workability, and will also increase costs.
P: 0.001-0.01%, In: 0.00, respectively
2-0.03%, and Te: 0.001-0.06%
It was determined that

In addition, P: 0.002 to 0.006%, In:
0.005-0.02%, and Te: 0.003-0
．． Even better properties can be obtained when the content is 0.3%. Next, the Cu alloy of the present invention will be explained using examples and comparing with comparative examples.

Example According to the usual melting method, oxygen-free copper is first melted, and then B and M are dissolved to have the final component composition shown in Table 1.
g, P, In, and Te are added and melted,
After casting into an ingot with dimensions of 60 mm in diameter x 160 mm in length, the ingot was subsequently hot extruded at a temperature of 850°C to form a rough wire with a diameter of 8 mm.
The Cu of the present invention was immediately cooled with water and further subjected to wire drawing processing to obtain a wire rod with a diameter of 2.6 mmφ.
Alloys 1 to 18, comparative Cu alloys 1 to 7, and conventional Cu-
Samples made of Ag alloy were each produced.

Note that Comparative Cu Alloys 1 to 7 all have compositions in which one of the alloy constituents (indicated by * in Table 1) is outside the scope of the present invention. Next, the minimum heating temperature at which a significant decrease in alloy strength occurs, that is, the softening temperature and electrical conductivity (H material), were measured for the various specimens obtained as a result, and the measurement results were combined with Table 1. Indicated.

From the results shown in Table 1, comparative Cu alloys 1 to 7 have either heat resistance or electrical conductivity (*
In contrast, Cu alloys 1 to 18 of the present invention have both high heat resistance and high conductivity, and in particular, in terms of conductivity, they are inferior to conventional Cu-Ag alloys.
It has excellent properties equivalent to or better than alloys,
Furthermore, in terms of heat resistance, it is clear that it has much better properties than conventional Cu-Ag alloys. As mentioned above, the Cu alloy of the present invention has high heat resistance and high conductivity, and since it does not contain Ag, it is relatively inexpensive. Not only can it be used as a substitute material for the Cu-Ag alloy that has been used, but it can also be used in a wide range of other applications, and when put into practical use, it exhibits excellent performance and is industrially useful. It has characteristics.

Claims (1)

[Claims] 1 B: 0.0005-0.01%, Mg: 0.002
Contains ~0.05%, and further includes P:0.001~0.0
1%, In: 0.002-0.03%, and Te: 0
．． Cu having high heat resistance and high conductivity, characterized in that it contains one or more of 0.001 to 0.06%, and the remainder is Cu and unavoidable impurities (weight %). alloy.