JPS5952845A - Shifter for substrate - Google Patents

Abstract

PURPOSE:To vary the arrangement of the substrates, to shift them in a carrier and to improve efficiency, reliability and stability by attracting the substrate to an arm, turning the substrate over by an overturning mechanism and shifting it. CONSTITUTION:The shaft 4 of the overturning arm 2 and a motor shaft are connected by a driving belt 6 in an overturning drive system, and the overturning arm is turned in a 180-degree arc by the revolution of a motor 5, and returned by a reversal. Pairing cylinders 7 are disposed on the same line crossing at right angles with an air bearing 9 and driven simultaneously on an overturning and the substrates 10 are positioned at predetermined positions by positioning pins 8, 8' as cylinder arms in a cylinder system. The substrates 10 are held by a vacuum chuck 3 set up at the nose of the overturning arm2, and shifted on the air bearing 9 by the overturning of the overturning arm 2. The surfaces and backs of the substrates 10 are disposed alternately in the arrangement of the substrates in the carrier 12', that is, a back-to-back is formed by overturning the substrates 10 on every other substrate, and the substrates can be fed to a CVD device through a vapor growth method.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to automatic feeding of semiconductor wafers, and more particularly to a substrate transfer machine equipped with a reversing mechanism for reversing substrates.

(b) Background of the Technology The production process for semiconductor devices is generally to form a large number of semiconductor elements incorporating elements and circuit patterns in a conductor wafer, and to divide these semiconductor elements into individual pieces. Various treatments applied to wafers improve productivity,
For reasons such as reducing variations in the characteristics of semiconductor elements, multiple semiconductor wafers are housed in a carrier and processed simultaneously. -Male conductor evaporators undergo highly advanced electrochemical processing under strict control conditions. Moreover, since it is microfabricated, particularly high reliability is required. In order to maintain high quality, an in-line system that fully automates and connects each processing device is required.

(c) Prior art and problems In the in-line type semiconductor Kuehakaloe device, for example, the gate electrode, the absolute M1. A CVD device is used to form films, etc., and devices for resist film coating, exposure transfer, development, etching, etc. are installed under optimal conditions to form circuit patterns, and each device r#11 is connected to a belt or air bearing. Connected by Gin, fully automatic transfer of semiconductor wafers. A plurality of semiconductor wafers are stored in an L carrier, and depending on the processing equipment, they are introduced into a preliminary chamber, preheated or depressurized, and then supplied to the equipment. In this case, ideally, the semiconductor wafers should be set in each processing device while being housed in the same carrier, but due to differences in processing methods, it may be necessary to transfer to a dedicated carrier or change the arrangement of the semiconductor wafers. Queha's ρ* with link operation
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Azv transfer is required. Such transfer operations reduce the efficiency of the equipment and adversely affect wafer characteristics.

(d) Purpose of the Invention In view of the above-mentioned drawbacks, the present invention aims to provide a substrate transfer machine having a reversing function that allows a semiconductor substrate accommodated in a carrier to be accommodated in another carrier by changing the substrate arrangement. .

(Pin Structure of the Invention According to the present invention, the above object is to attract the substrate to the arm,
A board transfer machine characterized by reversing and transferring the board by using a reversing mechanism in which the arm is reversed by motor drive. I will explain in detail.

FIG. 1 is a configuration diagram showing a board transfer machine which is an embodiment of the present invention, and FIG. 2 is a top view showing a reversing arm part which is an embodiment of the present invention. The carrier 12 is placed on the carrier 12, and the substrates 10 in the carrier 12 are sequentially delivered onto the belt or air bearing 9. The sent-out substrate 10 is inverted when necessary by a substrate transfer machine 1 having a reversing mechanism, and is accommodated in another dedicated carrier 12'.

The substrate transfer machine 1 includes a reversal drive system consisting of a reversal arm 2 equipped with a vacuum chuck 3 that holds the substrate 10 by suction, a motor 5 that drives the reversal arm 2, and a reversal drive system that holds the substrate 10 in a predetermined position using positioning pins 8. It consists of a cylinder system that fixes it in position. In the reversing drive system, reversing arm 20 rotation axis 4
and a motor shaft are connected by a drive belt 6, and the rotation of the motor 5 rotates the reversing arm 180 degrees, and the reverse rotation causes it to return to the original position. On the other hand, in the cylinder system, a pair of cylinders 7 are arranged on the same line orthogonal to the air bearing 9, and when the cylinders are reversed, they are simultaneously driven and the υ board 10 is positioned at a predetermined position by positioning pins 8 and 8' forming cylinder arms. . The substrate 10 positioned in this manner is held by a parking chuck 3 provided at the tip of the reversing arm 2, and the parking chuck 3 is transferred onto the shear bearing 9 by reversing the reversing arm 2. It is held or released by the vacuum supply path 13 provided in the reversing arm 2. Released board 1
0 is accommodated in another carrier 12'. This operation is 11
As will be repeated next, for example, by inverting every other substrate 1o, the substrate arrangement of the carrier 12' is such that the front and back sides of the substrates 10 are alternately arranged, so that the so-called back-to-back arrangement is achieved. supply is possible. In another example, metal oxide treatment of gold, nickel, or the like is applied as the back surface treatment of the substrate 10.

The connection between the reversing arm 2 and the motor 5 is as shown in FIG.
5 and the motor 5 are mechanically coupled via the drive belt 6, the rotation of the motor 5 causes the reversing arm 2 to reverse the reversing motion. The vacuum supply path 13 is evacuated through an exhaust valve 14 provided at the tip of the shaft 15 to absorb 10 yen of vacuum from the vacuum chamber 3F1 substrate. Further, a substrate guide 16 is provided on the air bearing 9 to prevent the substrate 10 from falling. The use of a substrate transfer system equipped with such a reversing mechanism has a significant advantage in that conventional batch processing can be automated.

@ Effects of the Invention As explained in detail above, by using the board transfer machine of the present invention, it is possible to change the board arrangement and transfer it into the carrier, eliminating the need for conventional manual operations and increasing efficiency. This has the effect of improving reliability and stability.

[Brief explanation of the drawing]

Claims (1)

[Claims] 1. A substrate transfer machine, characterized in that a substrate is attracted to an arm, and the arm is driven by a motor to reverse the substrate, thereby inverting the substrate and transferring the substrate.