JPS59500890A

JPS59500890A - Method and device for automatically attaching multiple lead wire elements to a circuit board

Info

Publication number: JPS59500890A
Application number: JP50180083A
Authority: JP
Inventors: ホフマン・ブリアン・デイヴイツド; ワイスマン・バリ−
Original assignee: ウエスタ−ン　エレクトリツク　カムパニ−，インコ−ポレ−テツド
Priority date: 1982-05-26
Filing date: 1983-05-11
Publication date: 1984-05-17

Abstract

(57)【要約】本公報は電子出願前の出願データであるため要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】回路基板に複数リート線素子を自動的に装Ｍ　Ｊる方法及びその装置技術分野本発明は、回路基板の一２ｔ：産、より詳細には回路基板に複数リート、！ｉ！素子を自動的に二装陪する方法及び装置に関−する。[Detailed description of the invention] Multiple wire elements are automatically installed on the circuit board. Dynamic mounting method and device Technical field The present invention can be applied to one or more circuit boards, more specifically, to two or more circuit boards! i! The present invention relates to a method and apparatus for automatically combining two elements.

発明の背景電気及び？ｂ゛子回、路の生産においては、各回路基板に複数のリート線電気素子ケ装着することがしばしば要求されまず。通常、このような装ｙ、”作業：は、各複数リード線素子のリート線を手によって回路基板の対応する穴に挿入して行ないまず。、−のような方法では、生産量（心はおの寸と限界があり、長時間を璧し、労働集約的と２（ります。さらに、半導体集積回路（ＩＣ）パラゲージなどのような電気索子の寸法がまずま１゛小さくなり、また高パッケージ密度食達成するため行ＩＣパッケージのリード線（ｆ）数がます土ず増加するの（Ｃ伴って作業者の疲労の問題も大きな間頴とｔｌｃＸってきている現状です１゜複数リード線素子の手作業に、しるこび〕ような欠点ケ・自動（１″、によって解決しようとする試りは過去にも〜　特衣昭５９−５１Ｅ８９（１（２）いくつかあります。プリント配線基板（ＰＷＢ）に複数リード素子又はＩＣパンケージを・自動的に装置しようと１゛る領域では、もっばらプリント配線基板の穴に対し［コホツ１〜の腕又は自動マニピュレータ孕いかに」ト確に位ｔ６決めするかに重点が置かわできましＰ。ロボット腕の設語及び制御面においてこのような高い精度及び公差７達成するためには、対応する穴に対してリート線又目端イを正確に位置決めするだめの複雑で高価′ｔＩ「自動装置か必要となりまｔ。Background of the invention Electricity and? In the production of circuits, each circuit board has multiple wire electrical elements. Child-wearing is often required. Normally, this type of equipment is used. , manually insert the lead wires of each multi-lead wire element into the corresponding holes on the circuit board. First thing to do. Methods like In addition, semiconductor integrated circuit (IC) The dimensions of electric cords such as In order to achieve this, the number of lead wires (F) in row IC packages will increase (C). The current situation is that the problem of worker fatigue is becoming a big problem. Problems such as those caused by hand work on lead wire elements can be resolved by automatic (1") There have been several attempts in the past to I will. Multi-lead elements or IC package on printed wiring board (PWB) In the area where automatic equipment is to be installed, the hole in the printed wiring board is often [ How to accurately determine the position of the arm or automatic manipulator is important. The dot was placed next to P. Such high precision has been achieved in the design and control aspects of the robot arm. In order to achieve a degree and tolerance of 7, it is necessary to accurately align the Riet line or eye edge for the corresponding hole. Complicated and expensive automated equipment is required for positioning.

また、このようｙ、（腕の位置決めに対する厳重な要求は挿入すべき素子の外側容器とり−１（線との間に存在“するｉｉ＋ｊ＋定ずれを・補ＩＶするものでも又補正できるも前述の問題は、この発明の一実施例にて解決できますか、ここて基板に複数リード線素子を自動的に装着する方法は、素子の各リート線が基板の対応する孔に接近するように基板に複数リート線素子を位置決めする二に：杓゛と、及び基板に振動運動ケ力え才子の各リート線を基板の対応する孔じこ挿入するＬ程とを含んでいる。そのような方法の好ましい実施態様では、位ｔＷ決め下栓は複数リード線累子呑・保持するｋめプログラム式マニビュレータケ制御−する−「程と素子を基＆−にの予しめ選択された同位の位を６冒で位置さ１七る１〃１”とケ含む３゜本発明の′、ＩＳ、施例に従う基板上に複数リート線素子を自動的にのせる装？べば、基イ反を支す侍する手段と；基、板上〇予しめ定められた位置に複数リート線素子所位置させる選択的１．］］侮り能三丁段と；基板支持手段数−結合さＪ１基板を・振動させる手段とを含んでいる。In addition, in this way, (strict requirements for arm positioning are outside the element to be inserted) Container-1 Also, although it can be corrected, can the above-mentioned problem be solved by an embodiment of this invention? The method for automatically attaching a multi-lead wire element to a board is to attach each lead wire of the element to the board. Second, position the multiple wire elements on the substrate so that they are close to the corresponding holes: Insert each lead wire of the vibrating motion force into the board into the corresponding hole of the board. It includes L degree. In a preferred embodiment of such a method, the position tW determination The stopper has multiple lead wires and is controlled by a programmable manibulator that swallows and holds the child. - "Based on the degree and element &-, the pre-selected equivalent position of 6 and 7 is located 1 〃1” and 3゜ including ke A system for automatically mounting a plurality of Riet wire elements on a substrate according to the IS embodiment of the present invention? First, a means to support the board; multiple leads at predetermined positions on the board. Selective positioning of the line element 1. ]]Sumari no three-cho stage; number of board support means - combined and means for vibrating the J1 board.

、＝の装置１１の好ましい実施、態様においては、その選択的１ト１ｊ御装置は複数リート線素ｆを保易し；ｊ−、’ｆＣ素−了を゛基板の選択した座標位置に一〇−置決めするブロクラム＋（マニビュ１ノータケ含んでいる。,= In a preferred embodiment of the device 11, the selective control device 1j is Store the multiple-leat line element f;j-,'fC-end at the selected coordinate position of the board 10-Positioning brocrum + (contains Manibu 1 Notake).

この発明の効果の一つけ、プログラム式マニピュレークに対する厳密な設と１要求を削減できる。二と−Ｃす。One of the advantages of this invention is the strict design and requirements for the programmable manipulator. can reduce demand. Two and -C.

この発明のもう一つの効果は、素子の夕Ｌ　９：１容器の測定変化と無関係に基板に複数リート線素子令：自動的に装着てきることです。Another effect of this invention is that the element temperature is based on 9:1 regardless of the measured change in the container. Multiple wire elements on the board: Automatically installed.

この発明の更にもう一つの効果は、作業員の補助なしに同一の基板い二いくつかのタイプの複数リード線」ｊｆ合装７１’７できるととてす。Yet another advantage of this invention is that two or more identical substrates can be manufactured without the assistance of an operator. It is said that the type of multiple lead wire "JF combination 71'7" can be used.

この発明のこれらお。１：び他の諸効果は、添付図面とμｍもげ以下の実３、発明の詳細な説明ンｒ検ＮＪすることによって一層明らかとなるものです。These of this invention. 1: and other effects are shown in the attached drawing and the actual product below μm peeling 3. This will become even clearer after a detailed explanation and examination.

図面の簡−Ｑ、’ｊ　ｑ説明第１図は、この発明の方法及び装置の一実施例ｆ使用する基板（・で某ｔ６−される典型的な複数り−１・線素子の斜視図、及び第２図は、この発明の一実施態様の８！、了１゛の斜視図である。Brief explanation of drawings FIG. 1 shows an embodiment of the method and apparatus of the present invention. a perspective view of a typical multi-line element; and FIG. 2 shows 8! of one embodiment of this invention. , is a perspective view of 1.

ｄＹ卸Ｉな説明第１図には素−了１０が図汀ｆされてい］、すか、ζノ′Ｆはこの素子１０の片仙ｊ５つまり表面１：；上のパターン１２に徒って配置又（Ｊ位置合せさｔ’Ｌ　７’Ｃ八・数のり−１・線１１苓−有する。素子］、　０　＋Ｊ、図７Ｊ−＜の如く概わ平行六ｔｒｉｉ体治−した伺側容”Ｉｇ　１．４を有−する。ム−だ（７、」−ソ、下１で述べる弁１明の概念は円筒、立方体、あるいはその他いかなる形状を・ＰＪつ素子にも適用でき」、１ｏさら灯リート線１１は、円形、長刀形、正方形あるいはその他のいかなる幾イ【１」学的配夕１］のパターン１２ｔＣも配ＩＮ′１′Ｊることがてき土ず。さ１らにこの発明的概念及び示唆は、基板に装着さノする複数リード線素子か電気装置、電−１回路、ないしその他の物、あるいし１これ１）の結合物を持つ場合でも適用可能てす。dY wholesale explanation In FIG. 1, element 10 is shown, and element 10 is shown as Senj5, that is, surface 1: ; Placed misaligned with the upper pattern 12 or (J aligned t'L 7'C 8, number number - 1, line 11 - has. element], 0 +J, Figure 7J-< He has an Ig of 1.4, which is roughly the same as a parallel six trii body. (7, "-So, the concept of the valve 1 light described in 1 below is a cylinder, a cube, or something else. The shape can also be applied to PJ elements. Sword-shaped, square or any other geometric pattern 12 tC can also be arranged IN'1'J. Furthermore, this inventive concept and suggestion: Multi-lead elements or electrical devices, electrical circuits, or other electrical equipment mounted on a board It can also be applied to cases where there is a thing or a combination of 1 and 1).

第２図には、この発明の実施例を・達成する装置を・７Ｊ、Ｌ　ｊ署Ｊ゛。複数の穴、あるいは孔２ｊをイ〕１゛るシｊ（エラ２０を、複数の（？；載木休体３Ｕ（−よつ−０台２２０′こ取りイ」　（す　４ンず−９容器　２７　に　〕ｔ、５　かフｔ、、　ｆ（、−ｆ中　々　の　月形ユ１）之　２．１　。FIG. 2 shows an apparatus for accomplishing an embodiment of the invention at stations 7J and Lj. multiple hole or hole 2j] 1゛j゛j゛j゛j U (-Yotsu-0 units 220') (Su 4-9 containers 27) ,5　kaft,,　f(,-f inside etc　　moon-shaped Yu1)》2.1》.

２５＋　２６を−１−＋１つ複数の仲故す−ド線素子か、基板２０に搭載さフＬるものである。複数り−１〜跳５素子の各々のリート線は、基板２０の所定の孔２１に挿入されるものである。孔２１は、孔２１に取シ伺けるべき素子のリード線に対応するパターン状に配置されている。第２図に図解されるごとく、基板２０は基板に所定の周波数及び振動動作を与えることのできる機構２８にて台２２にさらに結合されまず。好ましくは基板と同一平面内のこのような振動運動は、→Ｈｈ−１竿旨例えば基板２０に取り付けた偏心軸３０をもつモータ２９によって行なわれます。25 + 26 -1 - + one or more faulty - wire elements or a flat L mounted on the board 20 It is something that Multiple ri-1~jump 5 Each leait wire of the element is inserted into a predetermined hole 21 of the substrate 20. hole 21 are arranged in a pattern corresponding to the lead wires of the elements that should be inserted into the holes 21. It is. As illustrated in FIG. 2, the substrate 20 has a predetermined frequency and vibration. It is further coupled to the platform 22 by a mechanism 28 capable of imparting motion. preferably This vibrational movement in the same plane as the substrate is caused by the →Hh-1 rod, for example, on the substrate 20. This is done by a motor 29 with an attached eccentric shaft 30.

ただし、この発明では、基板の平面に対しほぼ垂直の方向に振動運動も本発明の範囲内であります。振動の周波数及び振幅は固定することもできます。又、素子の装着の間、不連続あるいは連続的に、振動の周波数及び振幅全選択的に変化させることもできます。However, in the present invention, vibration motion in a direction substantially perpendicular to the plane of the substrate is also included in the present invention. It is within the range. The frequency and amplitude of vibration can also be fixed. Also, Motoko During the installation, the frequency and amplitude of the vibrations are selectively changed, discontinuously or continuously. You can also

一実施例では、台２２は振動台とし、基板２０を搭載本体２３によって固定します。第２図に示す別の実施例では台２２は固定し、基板に取り付けられた搭載本体２３はシ、・〈ふんしなやかな状態にします。In one embodiment, the table 22 is a vibration table, and the substrate 20 is fixed by a mounting body 23. vinegar. In another embodiment, shown in FIG. Make the body 23 supple.

このようなしな−やかな結合は、その一端を台２２に固定し、他端全基板に固定したバネを持つ脚によって達成します。また、搭載本体２３に、一端を基板に結合し、他端を台の一定の位置に固定した懸垂バネ（不図示）を使用することもできる。Such a flexible connection is such that one end is fixed to the base 22 and the other end is fixed to the entire board. This is achieved by legs with springs. Also, one end is connected to the board on the mounting main body 23. You can also use a suspension spring (not shown) with the other end fixed at a fixed position on the platform. Wear.

第２図に示す実施例の動作において、基板２０に装着すべき複数リード線素子、例えば、２４を素子２４の各リード線が基板の対応する孔２１に近接するように配置します。つぎに、振動様５構２８に通電して基板２０に振動運動を与えることによって、リード線をそれらの対応する穴にパ落下″させる。In the operation of the embodiment shown in FIG. For example, 24 may be arranged such that each lead wire of element 24 is close to the corresponding hole 21 of the substrate. Place. Next, electricity is applied to the vibration structure 28 to give vibration motion to the board 20. and drop the lead wires into their corresponding holes.

複数リード線素子２４、基板２０への位置決めは手によって行なうこともできます。また、ロボット腕３２を使用して、素子２４．．２．５または２６を容器２７から取り出し、コンピュータ制御端子３３によって、これら素子を所定の座標位置に取り付けることもできます。ロボット腕３２及びコンピュータ制御端子３３は、一般に知られている物、例えば、ユニマチオン社（ＵＮＩＭＡＴＩＯＮ　ＴＮＣ，（Ｄａｎｂｕｒｙ。The positioning of the multiple lead wire element 24 and the board 20 can also be done by hand. vinegar. Also, using the robot arm 32, the elements 24. ．． 2.5 or 26 in container 2 7 and set these elements at predetermined coordinates using the computer control terminal 33. It can also be mounted in position. Robot arm 32 and computer control terminal 3 3 is a generally known product, for example, UNIMATION Co., Ltd. TNC, (Danbury.

Ｃｏｎｎｅｃｔ　１ｃｕｉ　）　製のＭｏｄｅｌ　＃　２６０　ｋ使用することもできます。Connect 1cui) Model #260k must be used. You can also.

基板に複数リート線素子を装着するまえに、リード線が曲っていたり変形しでいたりしないようにする必要がある。したがってよく知られた種類のリード線伸し作業台３４が基板支持台２２に隣接して置く。このリード線伸し作業台３４は、素子２４．２５及び２６のリード線パターンに適合した種々の孔パターン３５．３６及び３７がら構成します。この場合、基板の素子を取り付ける前に、これら素子のす一ト線を・リート線伸し作業台３４の対応する孔パターン挿入し、その後そこから取り出す。Before mounting multiple lead wire elements on a board, make sure that the lead wires are bent or deformed. It is necessary to make sure that it does not occur. Therefore, the well-known type of lead wire stretching A workbench 34 is placed adjacent to the substrate support 22. This lead wire stretching workbench 34 is Various hole patterns 35. matched to lead patterns of elements 24, 25 and 26. It consists of 36 and 37. In this case, before installing the board elements, Insert the wire of the element into the corresponding hole pattern of the wire drawing workbench 34, and Then take it out from there.

−Ｆ記の実施例は単にこの発明を説明するためのもので、多くの変更および修正をこの発明の精神と範囲にそむくことなく実行できることは当業者にとって了承されるところです。- The embodiments in section F are merely illustrative of the invention and are subject to many variations and modifications. It will be recognized by those skilled in the art that this can be done without departing from the spirit and scope of this invention. It's about to be done.

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Claims

[Claims] 1. A base with multiple holes arranged in a pattern corresponding to the lead wire pattern of the element. In a method of mounting a multi-lead electrical element on a board, A multi-lead element (1o) is attached to the substrate (20), with each lead wire of the element connected to a corresponding one of the substrate. positioning the hole (21) so as to be adjacent to the hole (21); A vibrating motion is applied to the board (by 28), so that each lead of the element corresponds to the entire board. A mounting method characterized by including the step of inserting into a hole. 2 The positioning process uses a programmable manipulator to hold multiple lead wire elements. The process of controlling the data (32)', r and the preselected coordinate position of the substrate (20) Claim 1, further comprising the step of arranging the element (10)'e on the How to install it. 3. First, use the programmable manipulator (32,)'t lead wire extension workbench (34) ) K direction process, and the process of directing the element (10) held by the manipulator to the glued wire (11 ) into the lead wire stretching device (35-37); The process includes a step of taking out the lead wire stretching device handle from the stretched lead wire (1), 2. The mounting method according to claim 1, characterized in that: Automatically attach multiple lead wire elements to a board by the method described in paragraphs 1 to 3 of the scope of Section 41. In the device mounted on the support stand (22); multiple leads are placed at selected positions on the substrate (20). A selection control manipulator (32) for positioning all the wire elements; and vibrating means (28-30) coupled to the support (22) for vibrating the substrate; A mounting device comprising: 5. A claim characterized in that it further includes a lead wire stretching workbench (34)'. 4. The mounting device according to item 4. 6. Programmable manipulator is controlled by robot arm (32) and computer 5. A mounting device according to claim 4, characterized in that it includes a terminal (33)k. J