JPS5948060U - Hybrid integrated circuit for high frequency power amplification - Google Patents
Hybrid integrated circuit for high frequency power amplificationInfo
- Publication number
- JPS5948060U JPS5948060U JP14383382U JP14383382U JPS5948060U JP S5948060 U JPS5948060 U JP S5948060U JP 14383382 U JP14383382 U JP 14383382U JP 14383382 U JP14383382 U JP 14383382U JP S5948060 U JPS5948060 U JP S5948060U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- high frequency
- frequency power
- power amplification
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Microwave Amplifiers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の高周波電力増幅用混成集積回路の斜視図
、第２図は他の従来例を示す斜視図、第３図は本考案の
一実施例による高周波電力増幅用混成集積回路の斜視図
である。
１・・・金属製フランジ、８・・・リボン状金属製端子
。
補正 昭５８． ２． ３
実用新案登録請求の範囲を次のように補正する。
Ｏ実用新案登録請求の範囲
放熱用金属製フランジの両端に電気的に接続された接地
用のリボン状金属製端子を備えた′ことを特徴とする高
周波電力増幅用混成集積回路。Fig. 1 is a perspective view of a conventional hybrid integrated circuit for high frequency power amplification, Fig. 2 is a perspective view showing another conventional example, and Fig. 3 is a perspective view of a hybrid integrated circuit for high frequency power amplification according to an embodiment of the present invention. It is a diagram. 1... Metal flange, 8... Ribbon-shaped metal terminal. Amended 1984. 2. 3. The scope of claims for utility model registration shall be amended as follows. O Utility Model Registration Claims A hybrid integrated circuit for high frequency power amplification, characterized in that it is provided with ribbon-shaped metal terminals for grounding electrically connected to both ends of a metal flange for heat dissipation.
Claims (1)
ランジの各々に電気的に接続された接地用のリボン状金
属製端子とを備えたことを特徴とする高周波電力増幅用
混成集積回路。1. A hybrid integrated circuit for high frequency power amplification, comprising metal flanges for heat dissipation formed at both ends thereof, and ribbon-shaped metal terminals for grounding electrically connected to each of the flanges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14383382U JPS5948060U (en) | 1982-09-20 | 1982-09-20 | Hybrid integrated circuit for high frequency power amplification |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14383382U JPS5948060U (en) | 1982-09-20 | 1982-09-20 | Hybrid integrated circuit for high frequency power amplification |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5948060U true JPS5948060U (en) | 1984-03-30 |
Family
ID=30320932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14383382U Pending JPS5948060U (en) | 1982-09-20 | 1982-09-20 | Hybrid integrated circuit for high frequency power amplification |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948060U (en) |
-
1982
- 1982-09-20 JP JP14383382U patent/JPS5948060U/en active Pending
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