JPS59454U - Continuous melt plating equipment - Google Patents
Continuous melt plating equipmentInfo
- Publication number
- JPS59454U JPS59454U JP9341182U JP9341182U JPS59454U JP S59454 U JPS59454 U JP S59454U JP 9341182 U JP9341182 U JP 9341182U JP 9341182 U JP9341182 U JP 9341182U JP S59454 U JPS59454 U JP S59454U
- Authority
- JP
- Japan
- Prior art keywords
- copper strip
- hot
- dip
- continuous
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Coating With Molten Metal (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の実施例を示す配置図、第２図、第３図
、第４図はそれぞれ本考案の他の実施例を示す配置図、
−第５図は吹拭ノズルの先端形状を示す断面説明図、第
６図はめ一つき金属付着量を示すグラフ、第７図はスナ
ップロールの例を示す側面 −説明図、第８図はマ
グネットの配置態様を例示する平面図、第９図は従来装
置の配置図である。
２：前処理炉、４：めっき浴、５：シンクｄ−ル、１０
：ホットプライドルロール、１１：吹拭ノズル、１２．
１３ニスナツプロール、１４：マグネット、１５：補助
ノズル、１６：補助ノズル位置制御駆動装置。FIG. 1 is a layout diagram showing an embodiment of the present invention, FIGS. 2, 3, and 4 are layout diagrams showing other embodiments of the invention, respectively.
- Fig. 5 is a cross-sectional explanatory diagram showing the tip shape of the blow-wiping nozzle, Fig. 6 is a graph showing the amount of attached metal, Fig. 7 is a side view showing an example of a snap roll - Fig. 8 is an explanatory diagram, and Fig. 8 is a magnet FIG. 9 is a plan view illustrating the arrangement of the conventional device. 2: Pretreatment furnace, 4: Plating bath, 5: Sink d-hole, 10
: Hot pry doll roll, 11: Blowing nozzle, 12.
13 varnish nut roll, 14: magnet, 15: auxiliary nozzle, 16: auxiliary nozzle position control drive device.
Claims (1)
金属浴４に送通させ、ジンクロール５を介して垂直上方
に引上げたのち、浴上方に配置された吹拭ノズル１１に
て鋼格表面に噴射ガスを吹付けて溶融めっき金属の日付
量を制御する銅帯の連続溶融めっき装置において、 吹拭ノズル１１が、先端前壁部肉厚ａ３７ａ以下、前壁
部から連続する傾斜面ｂ゛と噴射ガス流方向のなす角度
ａ３０〜６０°の形状を有するものそあり、かつ前処理
炉２の出側にプライドルロール１０を設けて銅帯の前処
理炉側と吹拭ノズル側の張力を分離独立させるとともに
、吹拭ノーズル１１の下方に銅帯を両面から押圧挾持す
る一対のロール１２を配設したことを特徴とする連続溶
融めっき装置。 ゛（２）吹拭ノズル１１の上方に、銅帯を両面から押′
圧挟持する一対のロール１３を設けたとを特徴とする
上記第（１）項に記載の連続溶融めつき装置。 （３） 吹拭ノズル１１の上方に、位置制御駆動装置
に連結されたマグネット１４を鋼帯エッヂの側部に配設
したことを特徴とする上記第（１）項に記載の連続溶融
めっき装置。 （４）吹拭ノズル１１の直上に、位置制御駆動装置に連
結された補助ノズル１５を配設したことを特徴とする上
記第（１）項記ないし第（３）項のいづれ ゛ −か１
つに記載の連続溶融めっき装置。[Scope of Claim for Utility Model Registration] (1) The copper strip taken out from the copper strip pretreatment furnace 2 is passed through the hot-dip metal bath 4, pulled up vertically through the zinc roll 5, and then placed above the bath. In a continuous hot-dip coating device for copper strips, which controls the amount of hot-dip plated metal by spraying a jet gas onto the surface of the steel plate with a blow-wiping nozzle 11 arranged, Hereinafter, there is a configuration in which the angle a formed between the slope b' continuous from the front wall part and the direction of the jet gas flow is 30 to 60 degrees, and a priddle roll 10 is provided on the outlet side of the pretreatment furnace 2 to form a copper strip. A continuous hot-dip plating apparatus characterized in that the tension on the pretreatment furnace side and the blowing nozzle side are separated and independent, and a pair of rolls 12 are disposed below the blowing nozzle 11 to press and clamp the copper strip from both sides. (2) Press the copper strip from both sides above the wiping nozzle 11.
The continuous melt gluing apparatus according to item (1) above, further comprising a pair of rolls 13 for clamping. (3) The continuous hot-dip plating apparatus according to item (1) above, characterized in that a magnet 14 connected to a position control drive device is disposed above the wiping nozzle 11 on the side of the steel strip edge. . (4) Any of the above items (1) to (3), characterized in that an auxiliary nozzle 15 connected to a position control drive device is disposed directly above the wiping nozzle 11.
Continuous hot-dip plating equipment described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9341182U JPS59454U (en) | 1982-06-21 | 1982-06-21 | Continuous melt plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9341182U JPS59454U (en) | 1982-06-21 | 1982-06-21 | Continuous melt plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59454U true JPS59454U (en) | 1984-01-05 |
| JPH0114677Y2 JPH0114677Y2 (en) | 1989-04-28 |
Family
ID=30224215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9341182U Granted JPS59454U (en) | 1982-06-21 | 1982-06-21 | Continuous melt plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59454U (en) |
-
1982
- 1982-06-21 JP JP9341182U patent/JPS59454U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0114677Y2 (en) | 1989-04-28 |
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