JPS5944859A - Basic cell - Google Patents

Basic cell

Info

Publication number
JPS5944859A
JPS5944859A JP15551482A JP15551482A JPS5944859A JP S5944859 A JPS5944859 A JP S5944859A JP 15551482 A JP15551482 A JP 15551482A JP 15551482 A JP15551482 A JP 15551482A JP S5944859 A JPS5944859 A JP S5944859A
Authority
JP
Japan
Prior art keywords
basic cell
transistors
group
semiconductor device
basic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15551482A
Other languages
Japanese (ja)
Inventor
Yasuyoshi Kodama
児玉 康義
Makoto Endo
誠 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15551482A priority Critical patent/JPS5944859A/en
Publication of JPS5944859A publication Critical patent/JPS5944859A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits
    • H01L27/11803Masterslice integrated circuits using field effect technology
    • H01L27/11807CMOS gate arrays

Abstract

PURPOSE:To reduce the restriction of the size of systems by the size of master chips by a method wherein the group of transistors is so formed as to become symmetric left and right with the line crossing over the source region, gate electrode and drain region as the center. CONSTITUTION:P-channel MOS type transistors 141 and 142 form the group of transistors becoming symmetric left and right with the line A crossing over the source region, gate electrode and drain region as the center. N-channel MOS type transistors 161 and 162 form the group of transistors becoming symmetric left and right with the line B crossing the source region, gate region and drain region. The first basic cell composed of the transistors 141 and 142 and the second basic cell composed of the transistors 161 and 162 are successively disposed in arrays respectively in the direction of rows.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、ダートアレイを有するマスター・スライス方
式の半導体装置を構成する基本セルに関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a basic cell constituting a master-slice type semiconductor device having a dirt array.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

従来、ダートアレイを有するマスター・スライス方式の
半導体装置としては第1図に示すものが知られている。
2. Description of the Related Art Conventionally, as a master slice type semiconductor device having a dirt array, the one shown in FIG. 1 is known.

図中の1はマスターチップである。このマスターチップ
1上には、Logic作成部としての検数の基本セル列
2・・・が該基本セル列2.2間の接続のだめの配線を
形成する配線領域3を狭んで行、方ば横方向)に設けら
れている。この基本セル列2は、第2図(a)に示す如
く、PチャネルのMO8型トランジスタ41p4mから
なる第1のトランジスタ対とNチャネルのMO8型トラ
ンジスタ51p52からなる第2のトランジスタ対を対
とした基本セル6を列方向(縦方向)に−列に並べたも
のである。
1 in the figure is a master chip. On this master chip 1, basic cell columns 2 for counting as a Logic creation section are arranged in rows and squares narrowing the wiring area 3 that forms the connection wiring between the basic cell columns 2.2. horizontal direction). As shown in FIG. 2(a), this basic cell row 2 consists of a first transistor pair consisting of a P-channel MO8 type transistor 41p4m and a second transistor pair consisting of an N-channel MO8 type transistor 51p52. The basic cells 6 are arranged in negative columns in the column direction (vertical direction).

なお、第2図(a) 、 (b)において、7は1層目
のAl配線を、81  p82  t83は2層目のA
l配線を、9は1層目のM配線7のコンタクトを、10
は1層目のAn配線7と2層目のAl配線81  $8
2  ta3とのコンタクトを示し、第1、第2のトラ
ンジスタ対中のトランジス$41 p 51 の夫々の
多結晶シリコンからなるダート電極は共通となっている
。そして、前記基本セル6は、例えば第2図(b)に示
す如く2人力のNAND回路を構成している。
In Fig. 2(a) and (b), 7 indicates the first layer Al wiring, and 81 p82 t83 indicates the second layer A.
9 is the contact of the first layer M wiring 7, 10 is the l wiring,
are the first layer An wiring 7 and the second layer Al wiring 81 $8
The dirt electrodes made of polycrystalline silicon of each of the transistors in the first and second transistor pairs are common. The basic cell 6 constitutes a two-man NAND circuit as shown in FIG. 2(b), for example.

しかしガから、前述した構造の半導体装置は以下に示す
欠点をもっていた。
However, the semiconductor device having the above-mentioned structure has the following drawbacks.

■ 基本セル6においては、PチャネルのMO8型トラ
ンジスタ41y42からなる第1のトランジスタ対とN
チャネルのMO8型トランジスタ51,5.からなる第
2のトランジスタ対が対となっている。したがって、 
NOR、NAND等の論理Qateは基本セル6・・・
からなる基本セル列2内でしか構成できず、各々の基本
セル列2・・・間の接続には配線領域3を必要とする。
■ In the basic cell 6, a first transistor pair consisting of P channel MO8 type transistors 41y42 and an N
Channel MO8 type transistors 51, 5 . A second transistor pair consisting of the following transistors is a pair. therefore,
Logic Qate such as NOR and NAND is the basic cell 6...
It can be configured only within the basic cell rows 2 consisting of the following, and requires a wiring area 3 for connection between each basic cell row 2.

しかして、この配線領域3における配線のチャネル数は
、多数の配線を必要とすることを考慮して決定している
ため、一般に大きな面積を必要とする。このようなこと
がら、第1図示の半導体装置の状態から製品開発を行な
うと、配線領域3に実際に使用に寄与されない無駄な領
域が多くできる。
However, the number of wiring channels in this wiring region 3 is determined taking into account the need for a large number of wiring lines, and therefore generally requires a large area. For these reasons, if a product is developed from the state of the semiconductor device shown in FIG. 1, there will be a lot of wasted area in the wiring area 3 that is not actually used.

■ 基本セル列2・・・及び基本セル列2内の基本セル
6・・・の数は予め決まっているから、物理的に実現し
得ないシステムが発生することがある。また、この問題
点を解消するためにマスフチラグ1の領域を大きくして
基本セル6の数を増やす方法が考えられるが、こうした
場合、基本セル6から構成される基本セル列2・・・間
の配線領域3の面積も大きくなってマスターチップ1が
第1図図示の場合と比べて著しく大きくなるという欠点
がある。
(2) Since the numbers of basic cell rows 2, . . . and basic cells 6, etc. in the basic cell row 2 are determined in advance, a system that cannot be physically realized may occur. In addition, in order to solve this problem, it is possible to increase the number of basic cells 6 by enlarging the area of the mass border lag 1, but in this case, between the basic cell rows 2 consisting of basic cells 6... There is a drawback that the area of the wiring region 3 also increases, and the master chip 1 becomes significantly larger than that shown in FIG.

〔発明の目的〕[Purpose of the invention]

本発明は上記事情に鑑みてなされたもので、マスターチ
ップを平面的に大きくすることなく、該マスターチップ
に従来よシ多くの基本セルを設けることができ、かつ実
現し得るシステムの大きさがマスターチップの大きさに
よって決定されるのを最少に押えたマスター・スライス
方式の半導体装置を構成する基本セルを提供することを
目的とするものである。
The present invention has been made in view of the above circumstances, and it is possible to provide a larger number of basic cells on the master chip than before without increasing the size of the master chip, and to increase the size of the system that can be realized. It is an object of the present invention to provide a basic cell constituting a master-slice type semiconductor device in which the size of the master chip is minimized.

〔発明の概要〕[Summary of the invention]

現在、ダートアレーの製品を開発するに当シ、ニーf−
に対してはマスターチップとこのマスターチップによっ
て決定されるNAND 、 NδR等のLogic (
Library )を用意している。しかし、従来の基
本セルを使用する場合は、常に基本セルの左側にPチャ
ネル、右側にNチャネルを置いた場合でのLibrar
yの使用法しかない。そこで、本発明者は、マスター・
スライス方式の半導体装置を構成する基本セルにおいて
、互にダート電極が分離された第1導電型のトランジス
タ群と第2導電型のトランジスタ群を形成し、かつ各ト
ランジスタ群をソース領域、ダート電極及びドレイン領
域を横切る線を中心にして左右対称の形状をなす構造と
することによシ、第1導電型のトランジスタ群、第2導
電型のトランジスタ群が左右どちらになっても使用可能
(例えば左右反対の場合は、Library data
を裏返しに使用する)となるようにして、Pチャネル、
Nチャネルを有する従来の基本セルのWピッチで配線領
域を可変すると共にLog1c作成部となる基本セル列
も可変にし、マスター設計によシ実現し得るシステムが
決定されるのを最小に押えることを図った。
Currently, we are developing products for dirt alley.
For the master chip and Logic (such as NAND and NδR) determined by this master chip
Library) is available. However, when using a conventional basic cell, Libra is always placed on the left side of the basic cell and the N channel on the right side.
There is only one way to use y. Therefore, the inventor of the present invention
In a basic cell constituting a slice-type semiconductor device, a first conductivity type transistor group and a second conductivity type transistor group are formed whose dirt electrodes are separated from each other, and each transistor group is connected to a source region, a dirt electrode and a second conductivity type transistor group. By creating a structure that is symmetrical with respect to a line that crosses the drain region, it is possible to use the transistor group of the first conductivity type and the transistor group of the second conductivity type on either the left or right side (for example, on the left or right side). In the opposite case, Library data
), P channel,
The wiring area is varied by the W pitch of a conventional basic cell having N channels, and the basic cell row that becomes the Log1c generation section is also made variable, in order to minimize the possibility of determining a system that can be realized by master design. planned.

〔発明の実施例〕[Embodiments of the invention]

本発明の基本セルをマスター・スライス方式の半導体装
置に適用した場合について第3図を参照して説明する。
A case in which the basic cell of the present invention is applied to a master slice type semiconductor device will be described with reference to FIG.

図中の11はマスターチップである。このマスターチッ
プの周縁部には、一部がLogic (論理Qate 
)作成部(斜線部分)12・・・となる第1の基本セル
列131・・・及び第2の基本セル列132・・・が順
次交互に間断なく並設されている。
11 in the figure is a master chip. A portion of the periphery of this master chip contains Logic (Logic Qate).
) The first basic cell rows 131 . . . and the second basic cell rows 132 .

前記第1の基本セル列131は、第4図(a)に示す如
く、ソース領域、ダート電極及びドレイン領域を横切る
線Aを中心にして左右対称となるトランジスタ群を形成
するPチャネルのMO8型トランジスタ141、.14
2からなる第1の基本セル15.・・・を列方向(縦方
向)に順次並設したものである。また、第2の基本セル
列132は、第5図(b)に示す如くソース領域、ダー
ト電極及びドレイン領域を横切る線Bを中心にして左右
対称となるトランジスタ対を形成するNチャネルのMO
8型トランジスタ161,162からなる第2の基本セ
ル152・・・を列方向(縦方向)に順次並設したもの
である。なお、PチャネルのMO8型トランジスタ14
1,142からなるトランジスタ群と、NチャネルのM
O8型トランジスタ161.162からなるトランジス
タ群の夫々のダート電極は分離されている。また、前記
マスターチップ1の左からX番目の第1の基本セル列1
3x  y (x+1)番目(世し、Xは自然数)の第
2の基本セル列13□中のマスターチップ1の上から同
数番目の各基本セル151.152は対になって基本セ
ル対を構成している。
As shown in FIG. 4(a), the first basic cell row 131 is a P-channel MO8 type transistor that forms a group of transistors that are symmetrical about a line A that crosses the source region, dirt electrode, and drain region. Transistors 141, . 14
A first basic cell 15 consisting of 2. ... are sequentially arranged in parallel in the column direction (vertical direction). In addition, the second basic cell row 132 includes N-channel MO transistors forming transistor pairs that are symmetrical about a line B that crosses the source region, dirt electrode, and drain region, as shown in FIG. 5(b).
A second basic cell 152 consisting of 8-type transistors 161 and 162 is sequentially arranged in parallel in the column direction (vertical direction). Note that the P-channel MO8 type transistor 14
A transistor group consisting of 1,142 transistors and an N-channel M
The respective dirt electrodes of the transistor group consisting of O8 type transistors 161 and 162 are separated. Also, the X-th first basic cell column 1 from the left of the master chip 1
The same number of basic cells 151 and 152 from the top of the master chip 1 in the 3x y (x+1)th (number, X is a natural number) second basic cell column 13□ form a pair to form a basic cell pair. are doing.

しかして、前述した構造の半導体装置によれば、従来の
同面積のマスターチップ11の周縁部を除く部分に第1
の基本セル131 と第2の基本セル1.92からなる
複数の基本セル対をもれなく形成し、論理Gateは第
1、第2の基本セル列131,1.92の組み合わせで
容易に作成できるとともに、配線領域には論理Gate
作成部12・・・以外の全ての領域を使用できかつ配線
領域を第1、第2の基本セル列J 、91.1 、?2
のいずれか1個分で可変にできる。従って、従来と比べ
非常に高い素子集積度が得られ、マスターチップの大き
さによシ実現し得るシステムの大きさが決定されるのを
一層低減できる。寸だ、同様な考え方によシ、従来のよ
うにシステムの大きさに対応する目的でマスターチップ
の形状を大きくする必要もない。
According to the semiconductor device having the above-described structure, the first part is located in the area other than the peripheral part of the master chip 11 having the same area as the conventional one.
A plurality of basic cell pairs consisting of the basic cell 131 and the second basic cell 1.92 are formed without exception, and the logic gate can be easily created by combining the first and second basic cell columns 131 and 1.92. , there is a logic gate in the wiring area.
All areas other than the creation unit 12 can be used and the wiring area can be used for the first and second basic cell rows J, 91.1, ? 2
It can be made variable by any one of the following. Therefore, a much higher degree of element integration can be obtained than in the past, and it is possible to further reduce the fact that the size of the system that can be realized is determined by the size of the master chip. Based on the same idea, there is no need to increase the size of the master chip to accommodate the size of the system, as was the case in the past.

なお、本発明の基本セルを適用した半導体装置は第3図
示のものに限らず、例えば第5図に示す構造のものでも
よい。即ぢ、この半導体装置においては、第1の基本セ
ル列171がPチャネルのMO8型トランジスタ対(第
1の基本セル)lax とNチャネルのMO8型トラン
ジスタ対(第2の基本セル)182を列方向に順に並べ
た構造となっておシ、前記第1の基本セル列171に隣
シ合う第2の基本セル列172が第2の基本セル182
と第1の基本セル17.を列方向に順に並べた構造とな
っている。かかる構造の半導体装置も第3図図示のもの
と同様な効果が期待できる。
Note that the semiconductor device to which the basic cell of the present invention is applied is not limited to the one shown in FIG. 3, but may have the structure shown in FIG. 5, for example. That is, in this semiconductor device, a first basic cell row 171 has a P-channel MO8 transistor pair (first basic cell) lax and an N-channel MO8 transistor pair (second basic cell) 182 in a row. The second basic cell row 172 adjacent to the first basic cell row 171 is the second basic cell 182.
and the first basic cell 17. The structure is such that they are arranged in order in the column direction. A semiconductor device having such a structure can also be expected to have the same effects as the one shown in FIG.

〔発明の効果〕〔Effect of the invention〕

以上詳述した如く本発明によれば、素子の高集積化を図
って実現し得るシステムの大きさがマスターチップの大
きさによシ限定されるのを低減化した基本セルを提供で
きるものである。
As described in detail above, according to the present invention, it is possible to provide a basic cell in which the size of the system that can be realized by increasing the integration of elements is reduced from being limited by the size of the master chip. be.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の半導体装置の平面図、第2図(&)は第
1図図示の半導体装置の基本セル列を構成する基本セル
の平面図、同図(b)は同図(a)の回路図、第3図は
本発明の基本セルをマスターチ、fK設けた半導体装置
の平面図、第4図(、)は第3図図示の半導体装置の第
1の基本セル列を構成するPチャネルのMO8型トラン
ジスタ群(第1の基本セル)の平面図、同図(b)は同
半導体装置の第2の基本セル列を構成するNチャネルの
MO8型トランジスタ群(第2の基本セル)の平面図、
第5図は本発明の他の実施例を示す半導体装置の平面図
である。 1ノ・・・マスターチップ、12・・・Logic作成
部、13□ w132 e171 1172・・・基本
セル列、141  v 142  p 1612162
・・・MO8型トランジスタ、151 .152 .1
81 .182・・・基本セル。 出願人代理人  弁理士 鈴 江 武 彦第11g1 3 第2図(a) Voo                 GND第3
図 第4図 第5m 256一
FIG. 1 is a plan view of a conventional semiconductor device, FIG. 2 (&) is a plan view of basic cells constituting the basic cell array of the semiconductor device shown in FIG. 1, and FIG. FIG. 3 is a plan view of a semiconductor device provided with basic cells of the present invention in a master chain and fK, and FIG. A plan view of a channel MO8-type transistor group (first basic cell); FIG. plan view of
FIG. 5 is a plan view of a semiconductor device showing another embodiment of the present invention. 1 No... Master chip, 12... Logic creation section, 13□ w132 e171 1172... Basic cell row, 141 v 142 p 1612162
...MO8 type transistor, 151. 152. 1
81. 182...Basic cell. Applicant's agent Patent attorney Suzue Takehiko No. 11g1 3 Figure 2 (a) Voo GND No. 3
Figure 4 Figure 5m 256-

Claims (1)

【特許請求の範囲】[Claims] ゲートアレイを有するマスター・スライス方式の半導体
装置を構成する基本セルにおいて、互にダート電極が分
離された第1導電型のへ108トランジスタ群と第2導
電型のMOS )ランジスタ群から形成され、各トラン
ジスタ群がンース領域、ダート電極及びドレイン領域を
横切る線を中心にして左右対称の形状をなすことを特徴
とする基本セル。
A basic cell constituting a master slice type semiconductor device having a gate array is formed of a first conductivity type transistor group and a second conductivity type MOS transistor group, each having a dart electrode separated from the other. A basic cell characterized in that a group of transistors has a shape that is symmetrical about a line that crosses a base region, a dirt electrode, and a drain region.
JP15551482A 1982-09-07 1982-09-07 Basic cell Pending JPS5944859A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15551482A JPS5944859A (en) 1982-09-07 1982-09-07 Basic cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15551482A JPS5944859A (en) 1982-09-07 1982-09-07 Basic cell

Publications (1)

Publication Number Publication Date
JPS5944859A true JPS5944859A (en) 1984-03-13

Family

ID=15607714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15551482A Pending JPS5944859A (en) 1982-09-07 1982-09-07 Basic cell

Country Status (1)

Country Link
JP (1) JPS5944859A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55133690A (en) * 1979-04-05 1980-10-17 Mitsubishi Electric Corp Start controller for motor
JPS6047440A (en) * 1983-08-26 1985-03-14 Fujitsu Ltd Semiconductor integrated circuit
JPS6184030A (en) * 1984-10-02 1986-04-28 Fujitsu Ltd Gate array master slice integrated circuit device
JPS61100947A (en) * 1984-10-22 1986-05-19 Toshiba Corp Semiconductor integrated circuit device
US4884118A (en) * 1986-05-19 1989-11-28 Lsi Logic Corporation Double metal HCMOS compacted array

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55133690A (en) * 1979-04-05 1980-10-17 Mitsubishi Electric Corp Start controller for motor
JPS6047440A (en) * 1983-08-26 1985-03-14 Fujitsu Ltd Semiconductor integrated circuit
JPS6184030A (en) * 1984-10-02 1986-04-28 Fujitsu Ltd Gate array master slice integrated circuit device
JPH0531310B2 (en) * 1984-10-02 1993-05-12 Fujitsu Ltd
JPS61100947A (en) * 1984-10-22 1986-05-19 Toshiba Corp Semiconductor integrated circuit device
US4884118A (en) * 1986-05-19 1989-11-28 Lsi Logic Corporation Double metal HCMOS compacted array

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