JPS594473U - Burn-in equipment - Google Patents

Burn-in equipment

Info

Publication number
JPS594473U
JPS594473U JP9886682U JP9886682U JPS594473U JP S594473 U JPS594473 U JP S594473U JP 9886682 U JP9886682 U JP 9886682U JP 9886682 U JP9886682 U JP 9886682U JP S594473 U JPS594473 U JP S594473U
Authority
JP
Japan
Prior art keywords
burn
equipment
carrier
semiconductor device
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9886682U
Other languages
Japanese (ja)
Inventor
健作 和田
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP9886682U priority Critical patent/JPS594473U/en
Publication of JPS594473U publication Critical patent/JPS594473U/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のバーンイン装置を示す斜視図、第2図は
本考案の一実施例である半導体パッケージを収容するキ
ャリヤを示す斜視図、第3図は本考案の一実施例である
マガジンを示す斜視図である。 図において、11は半導体装置、12はキャリア、13
は凹部、14はリード端子、15はリード溝、16は電
極、17は押え板、18はガイド孔、19は電源供給端
子、20はガイドピン、21はマガジン、22は開放側
面を示す。
Fig. 1 is a perspective view showing a conventional burn-in device, Fig. 2 is a perspective view showing a carrier accommodating a semiconductor package which is an embodiment of the present invention, and Fig. 3 is a perspective view showing a magazine which is an embodiment of the present invention. FIG. In the figure, 11 is a semiconductor device, 12 is a carrier, and 13 is a semiconductor device.
14 is a recessed portion, 14 is a lead terminal, 15 is a lead groove, 16 is an electrode, 17 is a holding plate, 18 is a guide hole, 19 is a power supply terminal, 20 is a guide pin, 21 is a magazine, and 22 is an open side surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラットパッケージ型半導体装置のリード端子収容部と
電気的に接続された電極突起部を上下両面に備えたキャ
リヤと、前記キャリヤを複数個積み重ねて収容するマガ
ジンとを備えてなることを特徴とするバーンイン装置。
A burn-in device comprising: a carrier having electrode protrusions electrically connected to a lead terminal accommodating portion of a flat package semiconductor device on both upper and lower surfaces; and a magazine storing a plurality of stacked carriers. Device.
JP9886682U 1982-06-30 1982-06-30 Burn-in equipment Pending JPS594473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9886682U JPS594473U (en) 1982-06-30 1982-06-30 Burn-in equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9886682U JPS594473U (en) 1982-06-30 1982-06-30 Burn-in equipment

Publications (1)

Publication Number Publication Date
JPS594473U true JPS594473U (en) 1984-01-12

Family

ID=30234544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9886682U Pending JPS594473U (en) 1982-06-30 1982-06-30 Burn-in equipment

Country Status (1)

Country Link
JP (1) JPS594473U (en)

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