JPS5944171A - Picture reader - Google Patents

Abstract

PURPOSE:To improve the resolving power and to attain mass-production, by arranging CCD linear image sensor chips in zigzag form and providing a rod lens array having a zigzag opening opposing to them. CONSTITUTION:An original screen 2 is lighted with a light source 1 and its image is read with a contact type linear image sensor, in which plural CCD linear image sensor chips 13a, 14a... are provided on a long dimension board 12 in the manner that the lengthwise direction of the sensor plane is arranged alternately on two straight lines, so-called in a zigzag form, and the rod lens array 16 is provided on the board 12 via a spacer in opposition to the sensor plane, and the board 12, the spacer and the rod lens array 16 seal the CCD chips 13a, 14a....

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a document reading device, and particularly to a facsimile, OCR, or , relating to improvements in original reading devices for copying machines and the like.

[Technical background of the invention]

Facsimile and office automation equipment 1'''
Conventionally, image reading apparatuses in 2000 and 2000 generally image a document image on a linear image sensor surface through a spherical lens optical system and perform image reading. However, when using such an optical system, for example, A4 width (approximately 20
? In order to scan and read a document image (transfer), an optical distance of about 30 cIn is required, which leads to an increase in the size of the device. Also, when realizing such an optical system,
Manuscript, lens.

It was necessary to align the optical axes of the linear image sensors, and assembly and maintenance required skilled techniques.

Therefore, in recent years, contact type linear image sensors have been proposed to compensate for these drawbacks (as shown in FIGS. 1 and 2). This close-contact linear image sensor uses a rod lens array in its optical system to image an original image in the same size as the original image, and forms two optical sensor array plane crystals formed in the same size as the original image. This is used to read images, and the imaging distance of the rod lens array (
The objective is to reduce the size of the C1 device by making use of the scales, which allow the distance between object images to be as small as 15 to 202 revolutions.

That is, FIG. 1 shows an image of an original (2) illuminated by a light source ([) such as a fluorescent lamp, transmitted through a rod lens array (3) to an optical sensor array formed on a substrate (1). Part (5)
This is for inputting two images. Optical sensor array section (5
) 1'', a photoconductive type using a light guiding thin film such as CdSe or CdS, a charge storage type using diode photovoltaic force such as an amorphous 5 inch PIN junction or a Schottky barrier, etc. have already been proposed. Also the second
Figure 1 = What is shown is a CCD in the optical sensor array section (5)
This is an example in which a desired document width can be obtained by providing two or more IJ near image sensor chips in a straight line. Figure 1: The structure shown in Figure 1 is a photoconductor with photoresponse characteristics of several m8 to several IQ.
ms, it is used for low-speed machines, and in the charge storage type, the operating speed is defined as several ms due to the stray capacitance of the electrode wiring around the element, so it is used for medium-speed machines. On the other hand, the structure shown in FIG. 2 is capable of high-speed operation of usually 1 ms or less due to the characteristics of the CCL (linear image sensor) chip, and is therefore used for high-speed models.

Problems with the Background Art] However, as long as the ``CCUCCD linearage sensor chip relies on a normal silicon semiconductor manufacturing process, it is difficult to make the length of the sensor part the same as the width of the document. For example, manufacturing a CCD linear image sensor chip with a length of about 216>m [A4 manuscript 1] requires the supply of a defect-free single crystal substrate of such length, the manufacturing process, the mechanical strength of the chip, and the mounting method. From both points of view, production at present is nearly impossible. For these reasons,
Inevitably, the structure is such that a plurality of CCD linear image sensors are arranged in a straight line on the substrate. Historically, when obtaining a resolution of 8 pixels/order, for example, adjacent CCD, linear,
The distance between the sensor parts between the image sensors must be 125 .mu.m or less, otherwise the dicing width of the chip cannot be adequately estimated. Furthermore, the resolution has been increased to 12 pixels/+a,
When L6 pixels/shoulder are used, the situation becomes even more serious. For this reason, as shown in FIG.
The structure is such that the D linear image sensor chips are preferably arranged in a staggered manner with respect to each other. In this case, the second step to obtain an image signal corresponding to a straight line on the original image is:
- It was necessary to form an image on the optical sensor section of each CCD linear image sensor arranged in a staggered manner, and at least two rod lens arrays were required. Also, as shown in Figure 2, it is necessary for the two contact sensors to read each other in a straight line of the original image. is. That is, in the above case, the work of arranging the CCD linear image center chip on the first and second boards in a straight line with the desired precision, and the work of placing the second and second mutual contact sensors in a straight line of the original image. It is unavoidable that precision work must be performed twice to obtain the relative positional accuracy of the reader.

[Purpose of the invention]

The present invention was made in consideration of such circumstances, and
The aim is to have the above-mentioned device characteristics of high resolution and high-speed operation, and
It is an object of the present invention to provide an image reading device that reduces precision positioning work in the contact sensor manufacturing process 62, has high mass productivity, and also leads to cost reduction.

[Summary of the Invention] The present invention provides a method in which a plurality of CCD IJ near image sensor chips are arranged alternately on three straight lines in the longitudinal direction of the sensor length on a long substrate in such a manner that adjacent optical sensor parts complement each other. do. A so-called staggered device is used, and a rod lens array having a staggered lens opening is arranged on the substrate, facing the sensor surface number two of these CCD linear image sensor chips. Close-contact image of a covered structure.
The sensor has its own characteristics.

Therefore, according to the present invention, since the contact type image sensor has a structure in which a rod/lens array and a CCD chip are integrated and the CCD chip is sealed, handling thereof is very easy. . In addition, compared to the conventional method, which required a staggered array of CCD chips (corresponding to 12 rod lens arrays) and relied on mechanical precision to determine the relative positional relationship of the sensors in close contact with each other. An embodiment of the invention in which everything is integrated in the present invention] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 3 is a perspective view showing the main parts of the embodiment device, and Fig. 4 is a cross-sectional view schematically showing the arrangement structure.The manuscript screen (2) is illuminated by a light source (1) such as a fluorescent lamp, and the images A and B are opposite to the manuscript screen (2). It is designed to be read by a close-contact linear image sensor 011 arranged.The close-contact linear image sensor αD has a plurality of CCU IJ near- Image sensor chip (13
a), (13b)-(13m), (14a).

(14b) to (14n) are arranged in a so-called staggered manner, with the longitudinal direction of the sensor surface (15) arranged alternately on three straight lines. (161 is installed on the substrate (I2)-H through the spacer (17), and the CCD chip is attached to the substrate a'IJ, the spacer and the rod lens array 0.6J + 2, (13a).・, (i4a)−=−
It has a sealed structure.

CCD linear image sensor chip (13a).

...(14a) ... is operated by receiving a driving power supply and driving pulses through a conductor signal line U barrel formed on a printed circuit board, and outputs the received light output in time series. be.

Such a CCD linear image sensor chip (
13a), ... (14a), ... substrate Oz
As shown in Fig. 6 (1), a black anti-reflection treated spacer Uη is aligned and tightly fixed as shown in Figure 6 (1), and a rod lens array is attached to this spacer 07). Align - C is tightly fixed.

This rod lens array (I6) is connected to the CCD chips (13a)...(14a) by the spacer aη.
) is regulated, and the focal position of one of them is CC
The sensor surface of the D chip (13a), (14a),...
It is set to 1 so that it is set to 1. As a result, the light image introduced through the rod lens array (16) is imaged on the CCD chip sensor (plane ω).

Here, since the CCD chips are arranged in a staggered manner, the original image A is obtained.

In order for B to form an image on the photosensor surface 05), the lens apertures of the one-rod lens array must be provided in a staggered manner corresponding to the placement positions of the CCD chips.

This lever depends on the characteristics of the rod lens array.
This is because the MTF on the image plane is highest at the center and decreases toward the periphery, so it is desirable to use it at the center of the image plane.

Each CCD chip (13a), ... (14a) ... is arranged at an interval equal to or less than the effective length l in the longitudinal direction of its optical sensor surface (L51). As shown in Figure 2, their relative positions are mutually shifted so that the areas where the optical sensor surface 09 is interrupted are mutually supplemented.In other words, any part of images A and H of the original image (2) The position is 1 so that it always faces one of the optical sensor surfaces 05) of the CCD chips 13 and 14. Also, as shown in FIG. 5, CCD chip (13a)...(1
4a) The mutual distance W in the short direction matches the row interval W of the rod lens array, and the lens aperture is
The optical sensor surface (15) of the CD chip is arranged in a staggered manner to match the effective length l in the longitudinal direction. This structure allows the manuscript screen (2
) is located at any position on the three straight lines A and H on the CCD chip (1
3a)...

(14a) The optical sensor surfaces α51+2 of . . . come to face each other.

According to the image reading device configured using the contact type linear image sensor surface configured as described above, since the sensor αυ itself is compact, installation 1: one can be easily installed, and the entire device can be easily installed. It can be made more compact. Moreover, since the image sensor U has an integrated structure, there is no need for complicated positioning of the optical system, and simple assembly is possible, and maintenance is also simple. Moreover, CCI) chips (13a)...(14a)
The operating characteristics of ... and the characteristics of the rod lens combine to enable high-resolution image reading of 16 pixels/ring by high-speed operation of, for example, 1 tnsec/line.

Specifically, 42 has a CCI (CCI) linear image sensor (manufactured by Toshiba: TCD102e-1) with 2048 pixels mounted on an 8-chip board (I = 12), and a rod lens array (manufactured by Nippon Sheet Glass: Sl, A). -20) and -C
When we fabricated an integrated structured close-contact type linear image sensor field and assembled a device using it, we were able to obtain an image signal with a resolution of 8 line pairs/rm, which depends on the resolution of the rod lens. I was able to read it. In this case, in order to make the rod lens array staggered, Kiji 5
As shown in the figure, by using a rod lens array having a 3-tary lens array and alternating part of its lens apertures at intervals of the sensor surface effective length l, two rows of lens arrays can be created. It has a staggered structure. This is MTI
This is because two rows have better characteristics than three rows in terms of light intensity unevenness.Furthermore, the original image (2) is read in a staggered manner, but this can be resolved by performing appropriate signal processing. .

As explained above, according to the present invention, the conventional CC
D. It is possible to easily downsize the device, which is a problem in image reading devices having a structure using a linear image sensor and a spherical lens system. Moreover, it enables high-resolution image reading due to high-speed operation, which could not be expected with the conventional sensor having the structure shown in FIG. In addition, positioning that depends on mechanical precision in the sensor structure shown in Fig. 2 Kiji can be omitted, and the rod, lens,
Only one array is required, which leads to cost reduction.

Note that the present invention is not limited to the above embodiments.

For example, it is possible to use a two-color filter with a COD chip surface number of 2 to extract the color signal, and the number of times the CCU chip is used can be determined appropriately according to the document size, and as a light source,
Of course, it is also possible to use an LBI (LBI) array or the like. In short, the present invention can be modified and implemented in various ways without departing from the gist thereof.

[Brief explanation of the drawing]

1 and 2 are respectively schematic configurations and components of a conventional contact type linear image sensor, FIG. 3 is a perspective view showing the main parts of an embodiment of the present invention, and FIG. 4 is a A sectional view of this embodiment, FIG. 5 is a diagram showing the arrangement structure in the same embodiment, and FIG. 6 is a diagram showing the assembly [structure] in the same embodiment. 1 [...Contact linear image sensor [2...
Substrate 13a l 13b・=l t3m+ 148 l 1
4b I・-+ 14n, -CCD linear image・
Sensor chip 16...Rod lens array'' 7...Spacer (7317) Agent: Patent attorney Noriyuki Chika (
1 other person) Figure 1, Figure 2, Figure 3, Figure 4?

Claims (1)

[Scope of Claims] A substrate formed by arranging C and two sensor surfaces of the CCD linear image sensor chip facing each other [the substrate and the CCI provided with two holes] l) near・Seal the image sensor chip and make a C lot lens・
A contact image sensor with an array and an adjacent front 1ii-' CCU
The spacing in the horizontal direction of the sensor surface of the linear image sensor killer 7 matches the row spacing of the lot lens array, and the lot lens array is the sensor surface of the CCD linear image sensor chip. The document image surface illuminated by the light source has a zigzag opening corresponding to each C.
CI) An image reading device characterized by being arranged to form an image on an IJ near image sensor surface.