JPS5940575A - Photo driven type semiconductor device - Google Patents

Abstract

PURPOSE:To avoid the break, etc. of a guide without fixing the guide directly on a chip by a method wherein a locating member which transmits and shields light is arranged on the junction, and the guide is passed through the center thereof, when the optical guide is made to oppose to the P-N junction provided in the semiconductor chip. CONSTITUTION:An Si rubber layer 1c is adhered on the semiconductor chip 1 wherein the P-N junction is provided, an aperture is opened by corresponding to the junction, and an optical guide 3 is made opposed thereto. In this constitution, a first locating member 11a in disc form having a fan shaped cut 11c of the center angle at 90 deg.C in order to transmit and shield the light and the second locating member 11b having a fan shaped part 11d which blocks the cut part 11c at the time of rotation are prepared, and the first member 11a is arranged on the rubber layer 1c. Thereafter, the optical guide 3 having an Si rubber 8 at the top end is passed through the centers of the first and second locating members 11a and 11b, and then the transmission and shielding of the light are performed by making the top end rubber 8 abut against the junction surface and thus rotating the member 11b.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a light-driven semiconductor device, and more particularly to a structure of a light-driven semiconductor device using a highly efficient and reliable optical transmission method.

[Technical background of the invention]

In recent years, optically driven semiconductor devices such as optically triggered twinristors that perform optical driving using optical signals as a control medium have become widely used. - An example optically triggered thyristor has the structure shown in FIG. That is, (1) in the figure is an optically driven semiconductor chip (hereinafter abbreviated as chip), which has a cathode electrode layer (IC) formed on both main surfaces thereof, and a cathode electrode (2C) that is in pressure contact with the anode electrode layer (1a), respectively. , the cathode and anode are led out by the anode electrode (2a), and the thyristor is triggered by applying No. 4Q light to the light irradiation area (1g) at the center of ff on the main surface on the cathode side. An optical fiber is used as the light guide (3) for applying the signal light, and one end surface (3a) of the light guide (3) has a light irradiation area (1g
), a part of the side surface of the light guide near this end face is fixed to the chip with adhesive (4), and then the light guide is attached to the electrode 4 along (2g) parallel to the main surface of the chip. provided toward the envelope side wall (5), and said g
The other main surface (3b) passes through a tubular body (6) inserted through the t11 wall and faces the light receiving window (7).

The light guide, the main part of which is shown in Figure 2, is in contact with the light-receiving area of the chip (1) at one end surface (3a), and the light guide 1 extends upward perpendicularly to the main surface of the chip. There is a structure that penetrates the canned electrode (2c). , and an example of stretchable silicone rubber (having a refractive index almost equal to that of the light guide) is placed on the end surface (3a) of the light guide.
8) and is formed into a hemispherical shape on the end face by applying the surface tension of the hard and viscous liquid silicone to >r++.

[Problems with background technology]

According to the above-mentioned conventional technology, it is extremely difficult to accurately attach one end surface of the light guide to the narrow light receiving area of the chip. The light transmission area is shown in (A), but if this is shifted, part of the end face of the light guide will be at the attachment position shown by the broken line in the figure, and a part of it will ride on the electrode film on the surface, reducing the light transmission area. (A') l/j, which has the serious drawback that the light transmission efficiency is lower than that of (A) in the case of the desired attachment position 1N.

Next, in the case where the light guide is firmly attached using an adhesive, the light guide may crack or break due to thermal stress or mechanical stress as the Zyristor main body operates. This is based on the difference in thermal expansion coefficient between copper and glass, which serve as the main electrode and pole, and the thermal strain calculated for a light guide with a length of 50 mm is as follows.

Thermal expansion coefficient of copper... 17 x 10 (deg
) Coefficient of thermal expansion of glass...0.5 x 10 (d
eg)dl=βJ! , dT (β is the coefficient of thermal expansion) to d
1dl=(17xlO-0,5xlO)x50xlo at T=1001).

= 0.0825mm As is clear from the reduction on the slope, the amount of distortion is large.

[Purpose of the invention]

The present invention provides an improved structure of a light-driven semiconductor device, which has been made in view of the problems of the background art described above.

[Summary of the invention]

The present invention relates to a light-driven semiconductor device, and includes a package that airtightly holds a chip, a light transmitting window for introducing signal light non-perpendicularly to the main surface of the semiconductor element, and a light-receiving area on the main surface of the semiconductor element. a pair of light guides that are bent and connected to each other; a stretchable light-transmitting member attached to the end surface of the light guide; and a fitting surface and a hole that holds the light guide in a part of the light guide. a positioning member, and a positioning member fixing means for positioning and attaching one of the positioning members to the chip;
and a stretchable light-transmitting member layer adhered to the light-receiving region, and the light-transmitting member on the chip-side end surface of the light guide is connected to the light-receiving region via the light-transmitting member layer. do.

[Embodiments of the invention]

Hereinafter, with reference to the drawings, the present invention will be explained in detail with reference to the drawings regarding one embodiment of the light-driven squirrel.

4 to 6 show a fixing method using a positioning member.

First, the localization member Ql) consists of a first localization member (lla) and a second localization member (llb). The first localization member is a disk having a sector-shaped large portion (llc) with a central angle of 90°, and the second localization member (], llb fills the large portion (lie) of the first localization member. It has a fan-shaped part ((lid)) and an annular part (lie) that fits on the outer periphery of the disc part of the first localization member. Notches (llf') and (llf'') forming holes (llf) are provided.

The diagonal positioning member is attached to the first positioning member (ll) on the surface of the chip.
a) is bonded with an adhesive layer (]O1 as shown in Fig. 5,
During this bonding, the opening (llf) is made to directly face the light receiving area.

Next, one end of the light guide (3), to which a stretchable transparent member such as silicone rubber (6) has been attached in advance, is inserted into the opening [-1 second localization member (llb)]. The state in which the light guide is inserted into the light guide and fitted close together is the sixth state.
Also shown in the figure.

Furthermore, the present invention provides a stretchable light-transmitting member having an equal refractive index, in which the silicone rubber (8) on the end face of the light guide is adhered to the surface of the light-receiving area at the portion in contact with the light-receiving area. They are connected via a rubber layer DI.

Since the silicone rubber on the diagonal is in the form of mucus when it is applied, its surface tension can be used to form a hemispherical shape as shown in the figure, but it may also be molded into any desired shape.

Note that the present invention can also be applied to a type in which the light guide penetrates the envelope perpendicularly to the light receiving area (principal surface) K of the chip. Further, the light-transmitting member is not limited to silicone rubber, and may be appropriately selected in consideration of the refractive index and the like. Furthermore, it can be applied to a wide range of semiconductor devices, not limited to optical trigger transistors and phototransistors.

〔Effect of the invention〕

According to this invention, since the light guide is not fixed to the chip, there is a remarkable effect of preventing the light guide from cracking or bending caused by the difference in thermal expansion coefficients between copper and glass.

Next, since the end of the light guide is evenly brought into contact with the light-receiving area due to the positioning mechanism, electron-hole pairs are generated evenly under the light-receiving area, resulting in a narrow initial ignition area and critical on-current. A decrease in the rate of increase (maximum allowable rate of increase in on-state current that does not cause thermal breakdown due to the steep current rise at turn-on, d i /d is the withstand amount) is prevented.

Furthermore, the use of diagonal positioning units continues to satisfy the high demands for miniaturization of chip structures and improvement of chip characteristics.
Therefore, by applying a silicone rubber layer to the photosensitive area, even if there is a slight deviation in the attachment of the light guide, as shown in Section 7, it is generally possible to
As shown in FIG. 8, the photoconductive efficiency is significantly reduced by X. ) As shown by the broken line arrow in the figure, the refractive index of the silicone rubber extends the entire light receiving area, and the entire area (A) becomes effective. Therefore, since the entire light receiving area is ignited uniformly without reducing the optical trigger sensitivity, there is a remarkable advantage that the di/dt tolerance does not decrease.

I'm hooked. Even if a silicone rubber layer is applied to the light-receiving area, it has almost no effect on the light transmission efficiency, and it also has the effect of cushioning against the longitudinal stress caused by the connection with the light guide end.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of the optical trigger zyristor, Fig. 2 is a cross-sectional view of the main part of Fig. 1, Fig. 3 is a cross-sectional view showing the conventional drawbacks, and Figs. 4 to 6 are one example of this embodiment. 4 is a perspective view, FIG. 5 is a cross-sectional view, and FIG. 6 is a top view,
FIG. 7 is a cross-sectional view for explaining one embodiment, and FIG. 8 is a diagram showing the correlation between the bias of the highlight guide and the light transmission efficiency. 1 Chip 2, 'l, 2C, 5 package 3 Light guide 8 Silicone rubber 11a First localization member 11b Second localization part 18 Silicone rubber layer agent Patent attorney Inoue 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] A package that airtightly holds an optically driven semiconductor element, and a light transmitting window that introduces non-perpendicular M VC signal light into the main surface of the semiconductor element into the package and a light receiving area of the semiconductor element main surface are bent. a pair of light guides connected together, a stretchable light-transmitting member attached to an end face of the light guide, and a pair of fitting surfaces and -g(S) of the fitting surfaces having an opening for holding the light guide. a positioning member; a positioning member fixing means for positioning and fixing one of the positioning members to a semiconductor element;
a stretchable light-transmitting member layer deposited on the light-receiving area;
1. A light-driven semiconductor device, wherein a light-transmitting portion side of an end face of the light guide on the semiconductor element side is connected to a light-receiving region via the light-transmitting member layer.