JPS5940568A - Photoelectric transducer - Google Patents

Abstract

PURPOSE:To obtain elements most appropriate for facsimile read-out by a method wherein a plurality of photo receiving elements are arranged on a glass substrate, the group of common electrodes which electrically connect the elements by pluralities in a mass is arranged on one side of these elements, and discrete electrodes which electrically connect to each of the elements on the other side, resulting in the assembly thereof. CONSTITUTION:A piece of glass substrate 1 is adhered on a base 8, and a plurality of photo receiving elements are arranged thereon. Next, the terminals of the common electrodes connected to these elements are put together into the groups of terminals 12 and 13 divided into two, which are positioned on one side of the group of elements, and each of them is connected to film leads 14 and 15 of the same shape. The discrete wirings which electrically connect to each of the elements are put together into the group 16 of common wiring terminals on discrete side via a film lead 7 and then positioned on the other side of the group of elements, and a film lead 11 is connected thereto. Thus, the connection to an external circuit is performed only by the leads 11, 14, and 15.

Description

[Detailed description of the invention] The present invention relates to a photoelectric conversion system.

Conventionally, a self-scanning image sensor that integrates a -dimensional photodiode array and a scanning circuit (IC) has been used as a sensor for reading documents sent in facsimile machines, etc., but when the width of the documents to be sent is wide. It is necessary to increase the reduction ratio by the optical lens. This has the disadvantage that the distance between the transmitted document and the sensor becomes long, which increases the size of the device.

Recently, in order to miniaturize facsimile machines, a reading method has been proposed that uses a combination of a long contact type sensor and a Selfoc lens that corresponds 1:1 to a transmitted document.

If the original to be sent is A4 size, 216 columns of sensor length are required, and if the sensor density is 8 lines/ran, the number of sensors will be 1728.

Such long sensors are usually Cd5-CdSe, -
A thin film of CdSe, Se-As-Te, a-St, etc. is formed on a glass substrate by vapor deposition, sputtering, glow discharge, etc., and then formed into an island or strip by photoetching to form an electrode. It is produced by depositing it by a vapor deposition method or the like and forming it by photorin technology. In this case, since there are a large number of sensors, matrix wiring is usually performed on the same board to reduce the number of terminals connected to external circuits. For example, the number of sensors is 17
In the case of 28 sensors, divide the sensor into 54 blocks of 32 each, and connect one electrode in common for each block.
By connecting the corresponding individual electrodes of each block in common and performing 32x54 matrix wiring,
The number of external terminals can be reduced to 32+54=86.

FIG. 1 is an enlarged perspective view of a conventional example of a matrix wiring section of a contact type sensor. 1 is a glass substrate, 2 is a light receiving element, 3 is a common electrode, 4 is a terminal of the common electrode, 5 is an individual electrode, and 6 is a common film lead 7 for commonly connecting the individual electrodes corresponding to each block. Each block is connected to the terminal of the individual electrode by wiring.

FIGS. 2(a) and 2(b) show a conventional example of a method of connecting a matrix-connected contact type sensor to an external circuit.

Figure 2 (a) is an example of a configuration in which the common side terminal is connected to the external circuit using individual lead wires and connectors, and from the individual side using film leads. 1 is a glass substrate, and 7 is an individual electrode that is commonly used. 8 is a base, 9 is an individual lead wire, 10 is a connector, and 11 is a film lead on the individual side. FIG. 2(b) shows an example of a configuration in which the common side terminal is connected to an external circuit by a film lead, and 12 is the common side film lead.

In all of the above conventional configurations, the common side terminals are laid out on the end surface of the glass substrate without expanding or contracting the pitch. When performing matrix connection, the number of terminals on the common side is 54, and the pitch between terminals is 4.
Although it is easy to connect the lead wires or film lead terminals individually, it is difficult to connect them all at once, and mass production requires a lot of man-hours.

Although mass productivity is slightly better in the case of FIG. 2(b) than in the case of FIG. 2(al), there is a problem in terms of cost because a large film lead is required.

In order to eliminate the drawbacks of the above-mentioned conventional example, the present invention provides photoelectric conversion in which the common side terminals are wired in two locations by reducing the pitch between the terminals on the same substrate! , -t, and the present invention will be described in detail below with reference to the drawings.

FIGS. 3(a) and 3(b) are drawings showing an embodiment of the present invention. Corresponding parts in FIG. 1 and FIGS. 2a and 2b are given the same numbers. In Figure 3a, the terminals of the common electrode are divided into two on the same glass substrate 1''2 and separated into a terminal group 12 and a terminal group 13, and the pitch and number of terminals between the terminal groups are determined by the terminal group of the common wiring on the individual side. 16, and can be connected to an external circuit using film leads 11, 14, and 16 of the same shape.

For example, in the case of a 34-size, 8/8 sensor, the sensor length is 256 rum, and the number of sensors is 2048, which is 32
If you use X64 matrix wiring and divide the common side terminal into two, you will have 32 terminals each, the same as the number of individual side terminals, so if you make the pitch between the terminals the same, you can use the same shaped film leads for connection with the external circuit. Can be used. Common electrode terminal group 1
2.13 and the terminal group 16 of the individual wiring are made of a NiCr-Au vapor deposited film that has good adhesion to the glass substrate,
If the tip of the film lead is solder-plated, the film lead and the NiCr-Au on the glass substrate are bonded by thermocompression.
It becomes possible to connect the terminals at once.

In the case of an A4 size sensor with 8 wires/rrrm, the number of sensors is 1728, and if it is a 32 x 54 matrix, even if the common electrode terminal is divided into two, it will be 27, which cannot be the same as the number of terminals on the individual side. The same film lead can be used as long as the pinch between the terminals is the same. In this case, there will be a little extra terminal on the film lead side, but there is no problem.

Fig. 3(b) shows a method in which the connection with the external circuit is made using a conductive elastomer instead of a film gate, and the pitch between the terminals of the common wiring of the individual electrodes is expanded to the end surface of the glass substrate. ' and common terminals 12' and 13', which are made by dividing the terminals of the common electrode into two and putting them together so that the pitch is the same as that, and the pitch between the conductors is much smaller than the pitch between the above-mentioned terminals. The electrically conductive resistor 17 is used to connect to a printed circuit board incorporating an external circuit, and expensive film leads and bonding processes are not required, making it easy to replace the circuit board.

In this case, NiCr-Au thin films or transparent conductive thin films are suitable for the individual side and common side terminals because they have good adhesion to the glass substrate, are excellent in contact resistance, and can withstand long-term use.

As explained above, according to the photoelectric conversion system of the present invention, the connector for connecting the contact type sensor to the external circuit, which corresponds 1:1 to the transmitted original used for reading facsimile J, etc., can be installed thickly [1]. At the same time, the connector itself can be used at a low cost, so it has high industrial value. When a conductive elastomer is used in place of a film lead, the expensive film lead is not only unnecessary, but also the sensor can be inspected and replaced very easily.

[Brief explanation of the drawing]

FIG. 1 is an enlarged perspective view of the main parts of the light-receiving element and matrix wiring part of a conventional facsimile reading contact type sensor;
Figures 2 (a) and (b) are diagrams showing the connection configuration from the matrix wiring of the contact type sensor to an external circuit, respectively, and Figures 3 (a) and (b) are diagrams showing the connection configuration of the photoelectric converter + of the present invention, respectively. FIG. 3 is a diagram showing an example of a connection configuration with a circuit. 1... Glass substrate, 2... Light receiving element,
3... Common electrode, 4...- Common electrode terminal, 5... Individual electrode, 6... Common wiring, 7...・Film') -I', 11,1
4.15...--Film lead, 12.12',
13.13'...Terminal group taken out from the common electrode, 16.16'...Terminal group taken out from the individual electrodes, 17...Conductive elastomer. Name of agent: Patent attorney Toshio Nakao ＼1 person 3
2 Figure 2/Q @Figure 3 (α)

Claims (3)

[Claims] (1) A plurality of light-receiving elements are arranged on a substrate, a common electrode group for electrically connecting a plurality of the light-receiving elements together is arranged on one side of the light-receiving element, and a common electrode group is arranged on the other side of the light-receiving element. Individual electrodes electrically connected to each of the light receiving elements are arranged, a terminal group for connecting the common electrode group to an external circuit is divided into a plurality of terminal groups, and the same plurality of terminal groups are collected at different locations. A photoelectric conversion f-son characterized by: (2) Photoelectric conversion 1 according to claim 1, characterized in that the shape of the terminals and the pips between the terminals of the terminal group taken out from the common electrode and the terminal group taken out from the individual electrodes are made the same. -F-0 (3) Claim 2, characterized in that the terminal group taken out from the common electrode and the terminal group taken out from the individual electrodes are formed of a NiCr-Au thin film, and the connection with an external circuit is made by a film lead. Photoelectric converter + as described. (3) The terminal group taken out from the common electrode and each terminal group from the common wiring of the individual electrodes are formed with a NiCr-Au thin film or a transparent conductive thin film, and the connection with the external circuit is made with a conductive nidistomer. A photoelectric conversion system according to claim 2.