JPS5938395A - Working method for formation of small diameter hole - Google Patents

Abstract

PURPOSE:To form a small diameter hole in a metallic base material with good efficiency, by extending an Al wire rod for a hole die of an extremely small diameter between supports, putting the same in an electroforming vessel, and electroforming the base material around the Al wire rod then dissolving away the wire rod. CONSTITUTION:An Al wire is drawn with high accuracy to manufacture a wire rod 5 of a small diameter for a hole die. Such wire rod 5 is extended tautly between the supports 6 consisting of an electrically insulated frame, under the tension applied thereto. The wire rod 5 together with the supports is put into an electroforming vessel, where Cn and Ni is electrodeposited around the rod 5 to form a base material 7. The material 7 is cut to a required length and is put in a soln. of an acid or alkalis such as hydrochloric acid and caustic soda whereby the Al wire rod is dissolved away and the straight fine hole of a circular shape having high accuracy is easily formed in the material 7.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a small-diameter drilling force method for drilling small-diameter holes in a base material.

For example, it is necessary to drill a small diameter hole with high precision in the ferrule of an optical connector in order to position the optical fiber.

In this case, conventionally, as shown in Fig. 1, a ceramic material 2 is fitted into a hole in a seven-hole rule body l made of stainless steel, the center is determined from the outside of the ferrule body 1, and the ceramic material 2 is drilled. The small diameter hole 3 was made by machining or laser beam machining.

However, with drilling, it is impossible to drill a small diameter hole of about 125 μmφ, such as in the ferrule of an optical connector, and there is a drawback that only a hole of about 4waφ can be drilled. In addition, laser beam machining has the disadvantage that the inner surface of the hole does not have a smooth circular shape.Furthermore, taking the ferrule of an optical connector as an example, the drilling accuracy (eccentricity with respect to the outer diameter, hole diameter) is 0.1~ It was necessary to reduce the thickness to about 1.0 μm, which had the drawback of making the processing cost very high.

Furthermore, in the past, since the length of the hole could only be obtained by machining a length of 4 mm or less, it was necessary to separately arrange a glass capillary tube 4 within the ferrule in order to increase the connection strength.

An object of the present invention is to provide a single-force method for drilling small diameter holes, which can drill small diameter holes to a required length with high precision and at low cost.

The small-diameter drilling force method according to the present invention includes a step of stretching a small-diameter wire rod for a hole mold between supports by applying tension, and a step of stretching the small-diameter wire rod for a hole mold by applying tension to the outer periphery of the fine-diameter wire rod for a hole mold in an electroforming tank. A device characterized by comprising the steps of electrodepositing the material, and placing the base material in a dissolving solution to dissolve the small diameter wire for hole molding inside and drilling a small hole in the base material. It is.

' Hereinafter, embodiments of the present invention will be explained in order of process with reference to FIG.

(4) Precisely draw aluminum wire to make small diameter wire material for hole mold 5
get.

(B) This fine-diameter wire material 5 for hole molding is stretched tightly between electrically insulated frame supports 6 by applying tension.

(C) This supporting body 6 and the small diameter wire material 5 for hole molding are placed in an electroforming bath, and a metal such as copper or nickel is electrodeposited on the outer periphery of the small diameter wire material 5 for hole molding to form a base material 7. do.

When electrodepositing copper, the electrolytic solution used is, for example, copper sulfate. When nickel is electrodeposited, the electrolytic solution used is, for example, sulfamine or nickel sulfate.

Φ) Cut the base material 7 to the required length.

(E) The cut base material 7 is placed in a solution such as acid or alkali, and the small diameter wire material 5 for hole molding in the base material 7 is dissolved to form a small hole in the base material 7. The dissolving solution used is one that does not dissolve the base material 7 but only dissolves the small diameter wire material 5 for hole molding. Such a solution has been established as a general technique for electroforming, and uses hydrochloric acid, caustic soda, etc., for example.

(No. Machine the outer shape of the base material 7 to the required dimensions based on the small diameter hole.

In addition, when the length of the base material 7 is long and it takes time to melt the small diameter wire material 5 for the hole mold, if a pipe-shaped material having a hole in the center is used as the small diameter wire material 5 for the hole mold, Since the dissolving liquid enters through this hole, the small diameter wire 5 for the hole mold can be quickly dissolved.

According to such a method, it is relatively easy to keep the outer diameter of the small diameter wire for hole molding, for example 125 μm, to about ±1 μm. In addition, the length of the fine diameter χ has a ratio of pore diameter to length of 3.
It is easy to make it 0 times or more. Therefore,
In the case of a 7-erule optical connector, a glass capillary tube becomes unnecessary.

As explained above, in the present invention, the base material is electrodeposited while the small-diameter wire rod for the hole mold is stretched under tension. Electrodeposition can be performed while maintaining the diameter wire in an optimal state, and therefore precision holes can be easily formed. Further, since the small diameter wire for hole molding is thin, a straight straight state can be easily obtained by applying tension. Furthermore, the length of the small diameter hole is not subject to any loose restrictions in processing, and a desired length can be easily obtained. Furthermore, since the present invention uses electroforming processing technology, it has the advantage of being able to be implemented at low cost.

[Brief explanation of drawings]

FIG. 1 is a longitudinal cross-sectional view of a ferrule for an optical connector, and FIG. 2 is a perspective view when electroforming is completed, showing an example of the implementation state of the method of the present invention. 5... Thin diameter wire rod for hole mold, 6... Support, 7... Base material. Procedural amendment (spontaneous) September 28, 1980 Kazuo Wakasugi, Commissioner of the Patent Office1, Indication of the case Patent Application No. 18, 1987-14722, Title of invention: Small diameter hole drilling method 3, Amendment Patent applicant (529) Koga Kamekikogyo Co., Ltd. 4, Agent 4-31 Shinbashi, Minato-ku, Tokyo 105
No. 6, Bunzan Building 6th Floor, Detailed Explanation Column 6 of the detailed description of the specification (1) Contents of the amendment (1) "There was a small diameter hole..." in lines 2 to 4 of page 2 of the specification. Correct the following statement.

Claims (1)

[Claims] A step of stretching the small diameter wire for the hole mold by applying tension between the supports, a step of electrodepositing a base material on the outer periphery of the small diameter wire for the hole mold in an electroforming tank, and a step of depositing the inside of the base material. A small diameter hole drilling method comprising the steps of: dissolving the small diameter wire rod for hole molding in a solution to form a small diameter hole in the base material.