JPS5937759B2 - Mixing tank for plating bath replenisher - Google Patents

Mixing tank for plating bath replenisher

Info

Publication number
JPS5937759B2
JPS5937759B2 JP8995880A JP8995880A JPS5937759B2 JP S5937759 B2 JPS5937759 B2 JP S5937759B2 JP 8995880 A JP8995880 A JP 8995880A JP 8995880 A JP8995880 A JP 8995880A JP S5937759 B2 JPS5937759 B2 JP S5937759B2
Authority
JP
Japan
Prior art keywords
replenisher
pipe
plating bath
plating
mixing tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8995880A
Other languages
Japanese (ja)
Other versions
JPS5716200A (en
Inventor
政治 本間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi Condenser Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Condenser Co Ltd filed Critical Hitachi Condenser Co Ltd
Priority to JP8995880A priority Critical patent/JPS5937759B2/en
Publication of JPS5716200A publication Critical patent/JPS5716200A/en
Publication of JPS5937759B2 publication Critical patent/JPS5937759B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明はメッキ処理槽内の液組成を制御調整するために
メッキ浴が循環パイプにより循環している途中で、補充
液を供給補充する混合槽に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mixing tank that supplies and replenishes a replenishing solution while a plating bath is being circulated through a circulation pipe in order to control and adjust the liquid composition within the plating processing tank.

印刷配線板は回路パターン部及びスルーホール部に電気
的導通を施すためにメッキ処理が行われている。この場
合メッキ浴の液組成の濃度が所定範囲内で制御されない
と印刷配線板上に析出すべき金属の接着力が弱かつたり
、班ら或いは不均一なメッキが形成されてしまう。良好
なるメッキ層を得ようとすれば、使用されるメッキ浴の
溶液の各濃度を厳格に管理しなければならない。ところ
で、印刷配線基板はメッキ浴中に長時間浸漬され、ほぼ
比例関係で銅メッキが基板上に析出するので、メッキ処
理槽内の溶液は消費され、液組成は変化していく、この
変化していく状況をメッキ浴内に投入したセンサーから
の信号により、制御盤で集中管理し、不足した溶液を補
充するよう信号が発せられ、補充液の自動供給がなされ
る。
Printed wiring boards are plated to provide electrical continuity to circuit pattern portions and through hole portions. In this case, if the concentration of the liquid composition of the plating bath is not controlled within a predetermined range, the adhesion of the metal to be deposited on the printed wiring board may be weak, or spots or uneven plating may be formed. In order to obtain a good plating layer, the concentration of each solution in the plating bath used must be strictly controlled. By the way, printed wiring boards are immersed in a plating bath for a long time, and copper plating is deposited on the board in an almost proportional relationship, so the solution in the plating bath is consumed and the liquid composition changes. The situation is centrally managed on a control panel based on signals from sensors placed in the plating bath, which sends signals to replenish any insufficient solution and automatically supplies replenishing solution.

第1図は従来の装置を示す図面であつて、1がメッキ処
理槽であり、この処理槽1内にメッキを付着させようと
する印刷配線板2がラックに詰込まれ浸漬される。メッ
キ浴の溶液3は槽1内から循環パイプ4により循環され
ている。このメッキ浴の循環液5は熱交換機6により温
度調整がなされ、ポンプ7により加圧されてメッキ槽1
内に戻されている。8が補充液であつて、タンク9内に
貯蔵されている。
FIG. 1 is a diagram showing a conventional apparatus, in which numeral 1 is a plating tank, in which printed wiring boards 2 to be plated are packed in a rack and immersed. A solution 3 of the plating bath is circulated from inside the tank 1 through a circulation pipe 4. The temperature of the circulating liquid 5 in this plating bath is adjusted by a heat exchanger 6, and the circulating liquid 5 is pressurized by a pump 7.
It has been brought back inside. A replenisher 8 is stored in a tank 9.

補充液8は例えば、水溶性銅塩、銅塩を錯化するための
銅錯化用塩、浴のPHを調整する水酸化アルカリ金属、
及び水等が用いられている。10が自動制御装置であつ
て、メッキ浴3の各溶液濃度をセンサー13が実測し、
濃度が設定範囲内において維持されるよう自動的に制御
されている。
The replenisher 8 includes, for example, a water-soluble copper salt, a copper complexing salt for complexing the copper salt, an alkali metal hydroxide for adjusting the pH of the bath,
and water are used. 10 is an automatic control device in which a sensor 13 actually measures the concentration of each solution in the plating bath 3;
The concentration is automatically controlled to be maintained within a set range.

もし、ある溶液の不足が生じれば信号が発せられ、その
補充液のタンク9下方に設けられた電磁弁11を作動す
ると、補充液8は循環パイプ4に補充液供給管12を通
し補充される。循環パイプ4と補充液の供給管12との
接続は従来第2図の如くなされていた。ところで、管内
を流れる流体は管壁において抵抗が大きく、流速が遅い
ので、主流たる循環液5に対しての補充液8は混合する
のに時間を要し、完全に混合されないまゝにメッキ槽1
内に戻される場合があつた。この場合にはメッキ浴3の
液組成が不均一になり、メッキにバラツキが生じること
があつた。本発明は、かゝる問題を解決しようとするた
めのもので、本発明はメッキ浴補充液が均一に混合しう
る混合槽を循環パイプの途中に設ける。
If a shortage of a certain solution occurs, a signal is issued, and when the solenoid valve 11 provided below the replenisher tank 9 is actuated, the replenisher 8 is refilled through the replenisher supply pipe 12 to the circulation pipe 4. Ru. Conventionally, the circulation pipe 4 and the replenisher supply pipe 12 were connected as shown in FIG. By the way, since the fluid flowing inside the pipe has a large resistance on the pipe wall and a slow flow rate, it takes time for the replenisher fluid 8 to mix with the circulating fluid 5, which is the main flow, and the plating tank is filled without being completely mixed. 1
In some cases, they were brought back inside. In this case, the liquid composition of the plating bath 3 became non-uniform, resulting in variations in plating. The present invention is an attempt to solve such a problem, and the present invention provides a mixing tank in the middle of the circulation pipe in which the plating bath replenisher can be uniformly mixed.

本発明の実施例を図面に基づき説明すると、本発明の混
合槽19は竪形に外管20と内管23とが同心円上に配
設されている。外管20は上下の両端部21,22が密
閉され密閉容器を構成している。なお、端部はフランジ
部を設けパツキングを介して接手により密閉構造にして
もかまわない。循環パイプ4の途中を混合槽19への入
口管26として外管20の下方側面部に接続し、補充液
タンク9からの補充液8の混合槽19への吐出管30は
外管20の上方側面部に接続している。内管23は外管
の下端板22に溶着され、上端部24は外管20内に開
口し、下端部はメツキ槽1内にフイードバツクされる循
環パイプの出口管25に接続されている。次に本発明の
作用について説明すると、メツキ処理槽1から排出した
メツキ浴の循環液5は循環パイプの入口管26から混合
槽19内へ送液される。
An embodiment of the present invention will be described based on the drawings. The mixing tank 19 of the present invention has a vertical outer tube 20 and an inner tube 23 arranged concentrically. The outer tube 20 has upper and lower ends 21 and 22 sealed to form a closed container. Note that the end portion may be provided with a flange portion and made into a sealed structure with a joint via packing. The middle of the circulation pipe 4 is connected to the lower side of the outer pipe 20 as an inlet pipe 26 to the mixing tank 19, and the discharge pipe 30 for replenishing liquid 8 from the replenisher tank 9 to the mixing tank 19 is connected to the upper part of the outer pipe 20. Connected to the side part. The inner tube 23 is welded to the lower end plate 22 of the outer tube, its upper end 24 opens into the outer tube 20, and its lower end is connected to an outlet pipe 25 of a circulation pipe fed back into the plating tank 1. Next, the operation of the present invention will be described. The circulating liquid 5 of the plating bath discharged from the plating treatment tank 1 is sent into the mixing tank 19 from the inlet pipe 26 of the circulation pipe.

入口管26は外管20の下方側壁に接続されているから
、循環液5は、外管20と内管23で形成された溶液通
路27を螺旋状に上昇していき、内管23の上端開口部
24から内管23に入り出口管25から排出してメツキ
槽1内に戻される。補充液8は補充液の吐出管30が外
管20の上方側面部に接続されており、吐出管の先端部
31は溶液通路27の中央部まで突出していて、ノズル
32を第5図に示す如く、循環液5の流れ方向の背面部
に設けておけば、循環液5が螺旋状に流れている途中で
過流が形成されたところへ補充液8が吐出されるから素
早く混合される。本発明は以上の構成の混合槽を用いる
ことにより、メツキ浴液に対し補充液が極めて早く、か
つ均一に混合されるようになつたので、メツキ浴はメツ
キ槽内で均一化がはかられ、従つてメツキ槽内に浸漬し
たどの箇所の印刷配線板も均一なるメツキの付着がえら
れるようになつた。
Since the inlet pipe 26 is connected to the lower side wall of the outer pipe 20, the circulating fluid 5 spirally ascends through the solution passage 27 formed by the outer pipe 20 and the inner pipe 23, and reaches the upper end of the inner pipe 23. It enters the inner pipe 23 through the opening 24 and is discharged from the outlet pipe 25 and returned to the plating tank 1. The replenisher 8 has a replenisher discharge pipe 30 connected to the upper side surface of the outer tube 20, and the distal end 31 of the discharge pipe protrudes to the center of the solution passage 27, with a nozzle 32 shown in FIG. If the replenisher 8 is provided on the back side in the flow direction of the circulating fluid 5, the replenisher 8 will be discharged to a place where an excess flow is formed while the circulating fluid 5 is flowing in a spiral manner, so that the replenishing fluid 8 can be quickly mixed. By using the mixing tank of the above configuration, the present invention allows the replenisher to be mixed extremely quickly and uniformly with the plating bath solution, so that the plating bath can be made uniform within the plating tank. Therefore, uniform plating can be obtained on any part of the printed wiring board immersed in the plating tank.

また、本発明の混合槽は竪形に配設しているからコンパ
クトにとりまとめられスペースをとらずレイアウトが容
易になつた。
Further, since the mixing tank of the present invention is arranged in a vertical shape, it is compact and does not take up much space, making the layout easy.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のメツキ処理槽の概略を示す正面図、第2
図は補充液吐出管の接続を示す断面図、第3図は本発明
の混合槽を示す正面断面図、第4図は同平面断面図、第
5図は補充液吐出管の断面図である。 図面において、1はメツキ処理槽、4は循環パイプ、5
はメツキ浴の循環液、8は補充液、9は補充液タンク、
19は混合槽、20は外管、21,22は外管の上下両
端部、23は内管、24は内管の開口部、25は出口管
、26は入口管、30は補充液の吐出管、32はノズル
Figure 1 is a front view schematically showing a conventional plating treatment tank;
3 is a front sectional view showing the mixing tank of the present invention, FIG. 4 is a sectional view of the same plane, and FIG. 5 is a sectional view of the replenisher discharge pipe. . In the drawing, 1 is a plating treatment tank, 4 is a circulation pipe, and 5 is a plating treatment tank.
is the circulating fluid of the metal bath, 8 is the replenisher, 9 is the replenisher tank,
19 is a mixing tank, 20 is an outer tube, 21 and 22 are both upper and lower ends of the outer tube, 23 is an inner tube, 24 is an opening of the inner tube, 25 is an outlet tube, 26 is an inlet tube, and 30 is a discharge of replenisher liquid. tube, 32 is a nozzle.

Claims (1)

【特許請求の範囲】[Claims] 1 メッキ処理槽内の溶液が循環パイプにより循環され
る途中で補充液が補充され混合するものの混合槽におい
て、竪形に外管と内管とが同心円上に配設され、この外
管の上下両両端部を密閉し、かつ、外管の下方側面部に
循環パイプの入口管を接続し、外管の上方側面部に補充
液の吐出管を接続し、前記内管は外管に溶着され上端部
は開口し下端部は循環パイプの出口管に接続されている
ことを特徴とするメッキ浴補充液の混合槽。
1 In a mixing tank in which the solution in the plating treatment tank is refilled and mixed with replenisher while it is being circulated through a circulation pipe, a vertical outer tube and an inner tube are arranged concentrically, and the top and bottom of the outer tube Both ends are sealed, and the inlet pipe of the circulation pipe is connected to the lower side of the outer tube, and the discharge pipe of the replenisher is connected to the upper side of the outer tube, and the inner tube is welded to the outer tube. A mixing tank for plating bath replenisher, characterized in that the upper end is open and the lower end is connected to an outlet pipe of a circulation pipe.
JP8995880A 1980-07-03 1980-07-03 Mixing tank for plating bath replenisher Expired JPS5937759B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8995880A JPS5937759B2 (en) 1980-07-03 1980-07-03 Mixing tank for plating bath replenisher

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8995880A JPS5937759B2 (en) 1980-07-03 1980-07-03 Mixing tank for plating bath replenisher

Publications (2)

Publication Number Publication Date
JPS5716200A JPS5716200A (en) 1982-01-27
JPS5937759B2 true JPS5937759B2 (en) 1984-09-11

Family

ID=13985191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8995880A Expired JPS5937759B2 (en) 1980-07-03 1980-07-03 Mixing tank for plating bath replenisher

Country Status (1)

Country Link
JP (1) JPS5937759B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63172169U (en) * 1987-04-28 1988-11-09

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096794A (en) * 1983-10-31 1985-05-30 Nissan Motor Co Ltd Method and apparatus for electrodeposition coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63172169U (en) * 1987-04-28 1988-11-09

Also Published As

Publication number Publication date
JPS5716200A (en) 1982-01-27

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