JPS5936474A - Connecting device of electronic apparatus - Google Patents

Abstract

PURPOSE:To bond easily plural electronic apparatus with high accuracy, by constituting a supporting board constituted in one body with a board of the electronic apparatus shorter than the board of the electronic apparatus at its end, and fitting the electronic apparatus and the support board on a common holding board. CONSTITUTION:Thermal head units 1a, 1b are constituted of many heat resistive elements arranged on a prescribed board 2. The board 2 is supported with supporting boards 3a, 3b. The boards 3a, 3b have almost similar shape as the board 2, and the right end of the board 3a is coincident with the right end of the thermal head 1a. Further, the left end of the other supporting board 3b is formed a little shorter than the thermal head 1b. The thermal heads 1a, 1b are fitted to the common holding board 4. Since the supporting board 3b is formed shorter than the left end of the board 2 of the thermal head 1b, the thermal heads 1a, 1b are bonded with high accuracy by utilizing a gap delta.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides electric power for thermal heads, image sensors, etc.
The present invention relates to a device for connecting devices.

When configuring a long thermal head,
A large number of heating resistor elements, several thin boards arranged in rows,
The substrates were bonded on a common holding plate so as to be aligned in the longitudinal direction of the substrate. Therefore, it is difficult to increase the accuracy at the bonding points of each board, and if one of the multiple boards is defective or poorly installed, the entire long thermal head will be defective. The disadvantage was that it was extremely uneconomical.

This invention has been made to eliminate the above-mentioned drawbacks, and when manufacturing long thermal heads and image sensors, it is possible to join each element unit with high precision, and also to connect each electronic device to each other with high precision. It is an object of the present invention to provide a connecting device for electronic devices, which allows for easy alignment of individual electronic devices, and allows defective electronic devices to be replaced easily and at low cost.

An embodiment of the present invention will be described below with reference to the drawings.

In the figure, reference numerals la and Ib indicate a thermal head unit, in which a large number of heating element resistance elements (not shown) are arranged on the upper surface of a predetermined substrate 2 in the longitudinal direction of the substrate by a known method.

3a and 3b are supporting plates made of an appropriate insulating material that support the substrate #122, and have almost the same shape as the substrate 2, and the right end of the one substrate 3a coincides with the right end of the thermal head 1a. ing. In addition, the left ends of the many support plates 3b are configured to be slightly shorter than the thermal head 1b. In other words, the left end of the thermal head 11), that is, the joint part with the thermal head 1a, protrudes beyond the support plate 3b by δ. It is composed of Each board 2 and a corresponding support plate 3
A or 3b are bonded to each other with a suitable adhesive.

Reference numeral 4 denotes a joint holding plate to which each thermal head 1a, 1b is attached.

5 is an adjustment screw for adjusting the height of the support plates 3a, 3b, which is screwed into a screw hole 6 provided at an appropriate position on the retainer plate 4;
And its upper end is connected to the 1-series joint (
(not shown).

With the above configuration, when the thermal heads are arranged side by side to form a long thermal head, the support plate 3a on the left side in the figure and the thermal head 1a are fixed at a predetermined position on the holding plate 4, for example.

Next, the support plate 3b and the thermal head 1b are fixed on the holding plate 4 so that the left end of the substrate 2 of the thermal head 1b is tightly joined to the right end of the thermal head 1a.

Furthermore, another thermal head is fixed on the holding plate in the same manner as above so as to be aligned in the longitudinal direction of the thermal head.

In the above case, the support plate 3b supports the thermal head 1b.
Since it is configured to be shorter than the left end of the board, if there is a gap between the bonding surfaces of the thermal heads 1a and 1b,
By moving the support plate 3b to the left, the thermal head 1b can be moved toward the thermal head la side using the gap δ, and therefore, the thermal heads la and 1b can be fitted together with high accuracy without any gaps. . In addition, if there is a step between the upper surfaces of the thermal heads 1a and 1b, the height of one or both of the thermal heads la, lb can be adjusted by turning the adjustment screw 5 (814). la.

It is also possible to match the heights of the top surfaces of 1b.

Furthermore, if some of the thermal heads are defective as a result of constructing a long thermal head, the thermal head and support plate (for example, 1b, 3b) may be replaced with good ones.

Note that a horizontal adjustment screw having the same configuration as the adjustment screw 5 may be provided at an appropriate position on the holding plate 4.

Note that the present invention can also be applied to image sensors and other electronic devices in which a large number of elements are arranged on a substrate.

As described in detail below, the present invention provides a support plate that is integrally formed with the substrate of an electronic device such as a thermal head or an image sensor, and has an end portion shorter than the substrate of the electronic device. The electronic device and support plate configured as above,
Since they are each mounted on a common holding plate,
Even if a gap occurs between the bonding surfaces of individual electronic devices, the gap can be easily eliminated, and as a result, a plurality of electronic devices can be easily bonded with high precision. In addition, since a support plate is provided for each individual electronic device and the electronic device is temporarily attached to a common holding plate through the support plate, it is now possible to remove a defective electronic device from the holding plate. Defective products can be replaced at lower prices.

[Brief explanation of drawings]

The drawing is a sectional view showing an embodiment of the present invention. la, lb...Thermal head, 2...Substrate, 3a
, 3b... Support plate, 4... Holding plate. Patent applicant: Lico Co., Ltd., attorney, and patent attorney Seishi, Seishi, and two others.

Claims (1)

[Claims] B) Electron 9j5 formed by arranging many elements in a row on a substrate
Jt is mounted on its own support plate, and one end of the substrate of the electronic device is configured to protrude from the corresponding end of the support plate, and the substrate of each electronic device is connected to the substrate through the support plate. A connecting device for C-child devices, characterized in that the devices are arranged in a row on a common holding plate so as to be joined to each other at the ends in the longitudinal direction.