JPS5935455A - Packing case for semiconductor element - Google Patents

Abstract

PURPOSE:To make the packing case suitable for automating element encasing work by constituting the case for the semiconductor element using a ceramic package by a case proper, a bottom-wall central section thereof is projected to the inside extending over the full length of a cylindrical axis, a plurality of saw-teeth sections fitted detachably in the proper and an upper plug, a nose projecting form thereof takes a plane or a semicircle. CONSTITUTION:The packing case proper 1 is constituted by a cylindrical body, which is made of a synthetic resin and a transverse section form thereof takes approximately a rectangle, and a projecting section 3, a transverse section form thereof projecting to the inside extending over the full length of the cylindrical axis takes a U-shape, is formed at the center of the lower bottom wall 2 of the cylindrical body. The inner surface of the proper 1 is coated previously with a conductive film 4 at that time, and the upper plugs 5, which also function as shock absorbing materials and can be fitted freely, are inserted to both end surfaces of the proper 1. With the upper plug 5, it is prepared by the synthetic resin, the whole is constituted by a plurality of the saw-teeth-shaped sections 7, and an external projecting section 6 is formed previously to a section projecting outside the proper 1 and a plane-shaped or semicircular nose projecting section 11 to a section intruding into the proper 1. According to such constitution, a plurality of the semiconductor elements 9 are pushed onto the projecting section 3, and they are held by the upper plugs 5.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a packaging case for semiconductor devices, and more particularly to a packaging case for semiconductor devices using a ceramic package.

Packaging cases for semiconductor devices are often made of synthetic resin. The Shintsu packaging case has an elongated shape, and semiconductor devices are stored in the case sequentially in the length direction, and the semiconductor devices are inserted and removed from one open end of the packaging case. , so that it slides on the surface of the packaging case and is sent to the inner voice.

In conventional packaging cases, semiconductor devices housed in packaging cases collide with each other due to vibration during transportation, which can cause chipping, cracking, or cracking of the package, especially in semiconductor devices using ceramic packages. This can easily lead to open defects and fc.

In addition, a stopcock, for example, was inserted from the end, but this had a disadvantage in that it had almost no protruding part outside the main body, making removal work inefficient.

The present invention aims to provide a packaging case for semiconductor devices which has all the above-mentioned drawbacks improved. That is, more specifically, the present invention includes a case body made of, for example, a cylinder made of synthetic resin and having a substantially rectangular cross-sectional shape, and a center portion of the bottom wall of the case body formed to protrude inward over the entire length of the cylinder axis. A convex portion t1 having a U-shaped cross section; a plurality of saw blade-like portions that removably fit into the case body; and an upper plug having a flat or semicircular tip protruding shape; A packaging case for a semiconductor device is characterized in that a foamed resin having a substantially rectangular surface shape is used as a full impact cushioning material.

The ritual rituals and sequences of the present invention will be explained below with reference to FIG. 1.

As shown in Figures 1 and 2, the case body 1 of the packaging case
is made of synthetic resin and has a cylindrical body with a rectangular cross-sectional shape. Further, the lower bottom wall 2 of the case body as shown in the drawing has a convex portion 3 having a U-shaped cross section that protrudes into the interior of the cylinder over the entire length of the cylinder shaft. A conductive coating 4 may be formed on the inner surface of the case main body 1 configured in this manner, thereby imparting conductivity. In order to form a film here, the conductive paint may be applied entirely, or the film may be formed by plating. Further, upper plugs 5 each having a plurality of saw blade-shaped portions 7 made of synthetic resin are provided at both ends of the case body 10 and are removably fitted thereto. This upper plug 5 connects the external protrusion 6 to the case body 1.
A plurality of saw blade-shaped portions 7t protrude outward - the convex portion 3 and the top! 8 and is press-fitted between the two. Since the stopper 5 has a serrated portion 7 as shown in FIG. 2, it can be easily stored.

It has a structure that makes it difficult to move in the direction X. The shape of the protruding end portion 11 of the stopper is preferably planar because of the contact area with the side surface of the package of the semiconductor element, and even a semicircular shape has the same holding effect as shown in FIG. 3(a).

(b) > e Furthermore, the distance d2 between the top wall 8 of the packaging case l and the U-shaped convex portion 3 is slightly smaller than the thickness d3 of the semiconductor element to be accommodated.
．． It is only about 2 to 2.0 mIn more.

In the packaging case of the present invention as described above, open failures due to chipping, cracking, and cracking of ceramic packages, which conventionally tend to occur due to vibration during transportation, and multiple external electrode lubricants can be avoided.
It is possible to prevent the occurrence of scratches, bends, etc. on the O, and it is possible to safely transport semiconductor devices.

In the above embodiment, the serrated portion 7 of the stopcock 5 has 21 upper and lower parts.
11! Although these are provided, three each for the upper and lower sides may be used as shown in FIG.

Next, if the length of the packaging case is one type, the number of four cow elements that can be stored is, for example, DIP (Dual 1n-
In the case of the 1ine package) type, the pitch between the external electrodes is the same, so it varies depending on the number of external electrodes. Along with this, if only one type of stopcock is used,
Gaps are created between the semiconductor elements or between the top plug and the semiconductor elements, and collisions between the semiconductor elements due to vibration during transportation pose a problem. In order to solve the above problem, several types of top plugs with different lengths l' as shown in FIG. It is also possible to fill in the gaps.

Furthermore, the upper stopper uses only one type of stopper T-1 as shown in Fig. 3(a), (b) or Fig. 4, and is used for semiconductor devices housed in a packaging case or semiconductor devices and stopper. In order to fill the gap with the tip protrusion 1, a foamed resin having a substantially rectangular cross-sectional shape as shown in Fig. 6g6 may be used as a shock absorbing material. Since the shock absorbing material is made of foamed resin, it can be easily cut in the cross-sectional direction, has a sufficient effect as a shock absorbing material, and can be easily used even when rolled. For example, even when only one semiconductor element is housed in a packaging case, the length of the spacer can be freely selected, so that the gap can be easily filled (FIG. 7).

As described above, in the packaging case of the present invention, the length of the case body L and the type of the top plug 5 are only one type, and the entire shock absorbing material 12 made of foamed resin is used, so that the work of storing the semiconductor elements 9 can be automated. , this work can be made extremely easy. Furthermore, since the entire packaging case body 1 shown in Fig. 1 is used, it is possible to prevent opening failures due to chipping or cracking of the ceramic package, and to prevent scratches or bending of the plurality of external electrodes 10, thereby ensuring safe transportation of semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing one embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of FIG. 1, and FIGS. The perspective view and FIG. 5 show that the length of the upper stopper is as shown in FIG.
), FIG. 6 is a perspective view of the shock absorbing material, and FIG. 7 is a longitudinal sectional view showing an embodiment of the present invention. In the figure, 1... Packaging case body, 2... Bottom wall of case body, 3... U-shaped convex portion, 4...
... Conductive coating, 5 ... Top plug body, 6 ...
...External protrusion, 7...Saw blade part, 8...
...Top wall of the case body, 9...Semiconductor element,
10...External electrode, 11...Tip projection of stopper, 'i, z'...Length of stopper, d
z... Distance between 3 and 8, da... Thickness of semiconductor element, 12... Shock cushioning material. rash 4 area diagram 5

Claims (1)

[Claims] A case body whose bottom wall central portion protrudes inward over the entire length of the cylindrical shaft, a plurality of saw blade-shaped parts that are removably fitted into the case body, and an upper plug whose tip protrudes in the shape of a ten-faced kayatake semicircle. 1. A packaging case for semiconductor devices, characterized in that a foamed resin having a substantially rectangular cross-sectional shape is used as a shock-absorbing material.