JPS5935380Y2 - A substrate device made of a composite of synthetic resin plates - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a composite substrate device in which a plate-shaped synthetic resin body is strongly and precisely composited with a hard substrate.

A plate-shaped substrate device in which a plate-shaped synthetic resin body is combined with a hard substrate is used, for example, in the electrical equipment field, where a part of a metal chassis is an insulating plate, or in watches and instruments, where a part of the substrate is used as an insulating plate. It is widely used in various fields as a material with excellent properties.

Conventionally, such a composite substrate device has been used, such as one in which a metal plate and a synthetic resin plate are glued together, or one in which a metal plate and a synthetic resin plate are fixedly connected using screws or the like.

However, these were not easy to manufacture and also had insufficient accuracy.

On the other hand, recently, synthetic resin bases and
A method called outsert molding is attracting attention as a manufacturing method for devices in which functional parts such as columns are combined and locked.

In this method, a board with appropriate locking holes is mounted in a mold with a cavity that forms the functional part, and a synthetic resin is injection molded onto this board to perform composite integration during molding. It is.

According to this method, devices having multiple functional parts on the same substrate can be easily manufactured by -times of molding operations, and are becoming widely used. (See pages 52-53)
.

This outsert molding method can also be applied to composites of synthetic resin plates and hard substrates such as metal.

In such a composite board device, a synthetic resin component consisting only of a plate-shaped part is rare, and the plate-shaped synthetic resin body is often provided with holes such as bearings or has various functional parts added thereto.

The outsert bottom type has the advantage that these parts can also be processed integrally with the hard substrate when the plate-shaped synthetic resin body is combined.

However, it has been found that the plate-like composites manufactured by the conventional outsert molding method have insufficient precision.

Examples of composite substrates manufactured by the conventional outsert molding method are shown in FIGS. 1 to 5.

In the composite substrate device shown in FIGS. 1 and 2, the synthetic resin plate 2 has locking holes 4 and holes 5 and 5' provided in the substrate.
sl+, 5111, and is locked to the hard substrate 1.

The hole 3 is a hole provided in the synthetic resin plate 2 to form a functional part at the bottom of the tank.

In the composite substrate shown in Figs. 1 and 2, shrinkage force is generated near the center of the synthetic resin plate due to molding shrinkage, but due to the plurality of locking holes 5, 51, 5I+, 5nT, the H law is satisfied. Because it is locked, it cannot be freely deformed.

Therefore, if the hard substrate 1 has a relatively high hardness, a large strain will remain in the synthetic resin plate, which may cause breakage during use.

Moreover, in the case of a relatively weak plate, complicated deformation of the substrate 1 occurs.

Furthermore, in such a composite substrate device, relative positional accuracy between the functional parts on the synthetic resin plate such as the holes 3 and other functional parts on the hard substrate 1 is usually required, but as in this example, they can be freely contracted and deformed. If this is not possible, the actual center of contraction will not be constant, and the positional accuracy between a specific point on the synthetic resin plate and a specific point on the hard substrate will be significantly reduced.

On the other hand, in the composite substrate device shown in FIGS. 3 and 4, the synthetic resin plate 6 is locked by one locking hole 7 provided in the hard substrate 1.

In the case of a single locking hole, the synthetic resin plate 6 can be freely contracted, and damage, deformation, and deterioration in precision caused by multiple holes are eliminated.

However, as shown in the plan view of FIG. 5, the synthetic resin initially filled in contact with the substrate locking hole 7 solidifies as indicated by the dotted line 9 as a result of molding shrinkage.

Therefore, a gap is created between the two, and within that range, the relative position between the hard substrate and the synthetic resin plate (particularly the hole 8 constituting the functional part) becomes unstable, causing wobbling and causing a significant drop in accuracy.

The inventors of the present invention came up with the present invention as a result of their studies aimed at eliminating the looseness of the synthetic resin body after shrinkage and solving the poor accuracy of conventional methods in a composite substrate device that enables such free contraction. It is something.

That is, the present invention provides a composite substrate in which a plate-shaped synthetic resin body is physically locked together with a hard substrate having a locking hole through the synthetic resin that is filled into the locking hole during molding of the synthetic resin body. In the device, the locking hole is made up of 7V square outside locking holes, and a hole adjacent to one side of the locking hole is provided in the substrate, so that the locking hole and the hole are connected to each other. The present invention relates to a composite substrate device characterized in that a contact point is the center of contraction of a plate-shaped synthetic resin body.

Next, an embodiment of the present invention shown in the drawings will be explained.
The present invention is not limited to these embodiments.

The composite substrate device shown in FIGS. 6 and 7 is an improvement on the conventional example shown in FIGS. It consists of a locking hole, and a notch 11° 11' having a shape that widens toward the end and shares a common vertex is provided around the locking hole.

Therefore, the synthetic resin plate can be freely contracted, and the apex O of the shape that widens toward the end is specified as the contraction center with respect to the hard substrate.

Therefore, there is no distortion of the molded product, and it is highly accurate.

There may be one end-widening portion, or there may be a plurality of portions that substantially share the apex.

FIG. 8 shows another example of the shape and arrangement of notches in a composite substrate device similar to that shown in FIG. 6.

That is, elongated notches 12 and 12' sharing a plurality of intersection points are provided around the locking hole 7.

In this case, the intersection of the virtual long axes of the notches 12 and 12' becomes the center of contraction, but since the width of the notches is small, the backlash width is extremely small, and a highly accurate composite substrate device can be obtained.

FIG. 9 shows an example of the present invention in which one hole 14 is provided in contact with one side of the rectangular locking hole 7 in a composite board device similar to that shown in FIG. 6.

In this composite substrate device, the contraction center of the plate-shaped synthetic resin body 10 is near the contact point between the locking hole 7 and the hole 14, and the plate-shaped synthetic resin body 10 can almost freely contract around this contraction center, so there is no distortion of the molded product and the height is high. A precision composite substrate device can be obtained.

Although the illustration was also done with a diagram consisting mainly of straight lines,
It may have a curved shape as long as it does not significantly impair the effects of the present invention, and a shape mainly composed of curves is particularly preferable in the sense of reducing damage caused by notches.

Although a simple device shape was used in the explanation to facilitate understanding, an actual device may have a complex shape depending on the purpose.

The material of the hard substrate is not limited to metal, but may also be synthetic resin molded into an appropriate shape in advance, or may be formed by overlapping a metal plate and a mica plate, and then combining a synthetic resin plate by an outsert molding method. It may be an aspect.

[Brief explanation of the drawing]

Figure 1 is a top perspective view of an example of a conventional device, and Figure 2 is a top perspective view of an example of a conventional device.
3 is a top perspective view of the other side of the conventional device, FIG. 4 is a sectional view taken along B-B in FIG. 3, and FIG. 5 is a C-C in FIG. 4. 6 is a top perspective view of the device improved from the conventional device shown in FIGS. 1 to 5, FIG. 7 is a sectional view taken along line D-D in FIG. 6, and FIG. FIG. 9 is a top perspective view of a synthetic resin plate showing an example of the shape of a locking hole provided in the substrate of a composite substrate device similar to the above, and FIG. 9 is similar to FIG. 8 showing an example of the shape of the locking hole of the composite substrate device of the present invention. This is a diagram. 1... Hard substrate, 2. 6.10...
Synthetic resin plate, 3.8...Functional hole, 7...
・Lock hole, 11.11', +2゜12'...
Notch, 14... hole.

Claims (1)

[Scope of utility model registration request] In a composite substrate device in which a plate-shaped synthetic resin body is physically locked together with a hard substrate having a locking hole through a synthetic resin that is filled into the locking hole during molding of the synthetic resin body, The locking hole consists of one square locking hole, and a hole is provided in the substrate adjacent to one side of the locking hole, and the contact point between the locking hole and the hole is formed in the plate-shaped synthetic resin body. A composite substrate device characterized by having a contraction center.