JPS5935037Y2 - housing - Google Patents

Description

[Detailed description of the invention] The present invention has the following advantages: - When the pattern-shaped child devices are vertically stacked in layers and mounted in a metal case with a door, the fan provided at the top of the case is removed. The present invention relates to a housing that enhances thermal effects, prevents accidents caused by overheating, and achieves high mounting efficiency.

Conventionally, the structure of a housing in which a pattern-shaped child device group is mounted has an appearance shown in FIGS. 1 and 2.

In Figures 1 and 2, the housing 1 includes a frame 1a, a front door 1b, a rear door 1c, a ceiling plate 1d, and an exhaust hole 1e.
, and an intake hole 1fs1g (see FIG. 3).

FIG. 3 is an explanatory view showing a longitudinal section of the housing 1, with the XX section shown in FIG. 4 and the Z-Z section shown in FIG. 5.

In FIG. 3, a fan case 3 in which a fan 2 is installed is fixed to the ceiling plate 1d with screws.

The fan case 3 has an intake hole 3a on the surface where the fan 2 is provided, and an exhaust hole 1e on the back side of the case,
The other side has a shielded box shape.

In the case 1, four groups of electronic devices are mounted vertically in layers, and the cooling air A for heat dissipation by the fan 2 is supplied from the intake holes 1f button and 1g at the bottom and back of the case. the housing 1 without being inhaled and circulating inside the electronic device 4.
The air flows through the gaps 5, 6, and 7 between the fan and the electronic device, and only the inside of the electronic device 4a located directly below the fan is cooled.

From the above explanation, the cooling air A does not directly flow into the electronic devices 4 mounted in the middle and lower tiers, except for the electronic devices 4a in the upper tier, so the cooling effect is reduced, and the cooling effect is reduced compared to the electronic devices 4a located in the upper tier. However, this caused an inconvenience in that the internal temperature rose abnormally, causing an accident.

As a result, it has been found that even if the air volume is greatly improved, the above-mentioned disadvantages cannot be resolved.

The reason for the above-mentioned inconvenience is that the air resistance of the cooling air A is larger than that of the air gaps 5, 6, and 7 compared to the inside of the electronic device 4, so the air resistance of the cooling air A is larger than that of the air gaps 5, 6, and 7.
This is for ventilation, and as the amount of air increases, the air resistance increases, and the air flows more and more only through the gap.

The present invention has been devised to eliminate the above-mentioned disadvantages.

FIG. 6 shows a longitudinal cross-sectional view of a housing 1' according to the present invention, a horizontal cross-section of the housing 1' is shown in FIG. 7, and a cross-section of the housing 1' is shown in FIG.

In FIG. 8, the left and right side frames 2a of the housing 1' have orifice-shaped shielding plates 8 at the middle and lower parts in the height direction, and the front door 2b and the rear door 2c are It has a structure having orifice-shaped shielding plates 9 and 10 similar to the above.

FIG. 9 shows a perspective view showing the structure.

The cooling air A by the fan 2 is supplied to the intake hole 2f of the flat part of the casing.
, button and 2g, and the orifice-shaped shielding plate 8
, 9 and 10 and the electronic device 4.
, 12 and 13 are made narrower, the air resistance of the flow path increases, and as a result, the air flow resistance of the air flow path is small, and the air flow through the inside of the electronic device 4 is reduced. Moreover, the internal temperature of the electronic device 4 is the same regardless of whether it is in the upper or lower tier! Air cooling can be uniformly and effectively performed.

As a result of the above, the cooling effect of the fan has been enhanced and it has become possible to mount highly efficient electronic devices. However, this was easily resolved by adding a simple function.

When the present invention is not used, it is often assumed that the air volume is insufficient, but increasing the air volume increases the wind speed and air resistance, making it increasingly difficult for cooling air to flow through the electronic equipment, making it ineffective.

[Brief explanation of drawings]

Fig. 1 is a front perspective view of a conventional housing, Fig. 2 is a rear perspective view of the same, Fig. 3 is a longitudinal sectional view of a conventional device mounting diagram, and Fig. 4 is a line taken along the line X-X in Fig. 3. The arrow sectional view, FIG. 5, is the Z of FIG.
6 is a vertical sectional view showing the structure of the casing according to the present invention; FIG. 7 is a sectional view taken in the Z direction of FIG. 6;
FIG. 8 is a sectional view taken along arrow 7'-Z' in FIG. 6, and FIG.
FIG. 2 is a perspective view showing the structure of the casing according to the present invention. In the figure, 1... Housing, 2... Fan, 3... Fan case, 4... Electronic equipment, 5, 6, 7... ...Void, 8, 9, 10...
...orifice-shaped shielding plate.

Claims (1)

[Scope of utility model registration request] In a case in which electronic devices are stacked and mounted in multiple layers, a ventilation fan provided at the top of the case, a shielding plate provided in a gap between the electronic device and the case that is created when the electronic device is mounted; A casing comprising: an intake hole provided in the casing for taking in cooling air.