JPS5932911B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JPS5932911B2 JPS5932911B2 JP6757681A JP6757681A JPS5932911B2 JP S5932911 B2 JPS5932911 B2 JP S5932911B2 JP 6757681 A JP6757681 A JP 6757681A JP 6757681 A JP6757681 A JP 6757681A JP S5932911 B2 JPS5932911 B2 JP S5932911B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- manufacturing
- dry film
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 本発明はプリント配線板の製造方法の改良に関する。[Detailed description of the invention] The present invention relates to improvements in a method for manufacturing printed wiring boards.
従来より電子計算装置、通信機等の電子機器には、その
組立の合理化のために、部品の搭載とそれら部品間の配
線を同時に行なうことができる機能を有するプリント配
線板が用いられている。2. Description of the Related Art Printed wiring boards have been used in electronic devices such as electronic computing devices and communication devices in order to rationalize their assembly, and have a function of simultaneously mounting components and wiring between those components.
このプリント配線板の製造方法は、絶縁板の上に銅箔を
はり付けた銅張積層板を用い、先ずその表面にホトレジ
ストとなるドライフィルムを貼布し、その上にホトマス
クを密着させて露光し、現像、水洗したのちエッチング
して配線パターンを形成するのである。このような製造
工程においてドライフィルムの現像後の水洗は未露光部
分を除去するのであるが、この際完全に未露光部分が除
去されず銅表面に渣が残ることがあり、これがエッチン
グ時に銅残りを生じパターン間の短絡の原因となる。本
発明はこの欠点を解消するために案出されたものである
。このため本発明においては、銅張積層板の表面にドラ
イフィルムを貼布し、その上にホトマスクを密着して露
光したのち、ドライフィルムを現像及び水洗し、次いで
エッチングして配線パターンを形成するプリント配線板
の製造方法において、ドライフィルムの現像後の水洗は
、銅をエッチングする薬品を含む水溶液にてソフトエッ
チングすることを特徴とするものである。The manufacturing method of this printed wiring board uses a copper-clad laminate with copper foil pasted on an insulating board. First, a dry film serving as a photoresist is applied to the surface of the board, and then a photomask is placed on top of the dry film and exposed. The film is then developed, washed with water, and then etched to form a wiring pattern. In this manufacturing process, the unexposed areas are removed by washing with water after the dry film is developed, but at this time the unexposed areas may not be completely removed and residue may remain on the copper surface. This may cause a short circuit between the patterns. The present invention has been devised to overcome this drawback. For this reason, in the present invention, a dry film is pasted on the surface of a copper-clad laminate, a photomask is closely attached to the dry film and exposed, the dry film is developed and washed with water, and then etched to form a wiring pattern. In the method for manufacturing a printed wiring board, washing with water after developing the dry film is characterized by performing soft etching with an aqueous solution containing a chemical that etches copper.
以下添付図面に基づいて本発明方法を詳細に説明する。The method of the present invention will be explained in detail below based on the accompanying drawings.
図に本発明方法を行なうための現像・水洗装置を示す。The figure shows a developing/washing apparatus for carrying out the method of the present invention.
図について説明すると符号１、２、３は現像液槽、４、
４’、５、５’、６、６’は現像液スプレーノズル、□
は現像液蒸溜装置、８は水洗槽、９、９’はそのスプレ
ーノズル、１０は乾燥・器である。そして現像液槽はオ
ーバーフロー式になつており、現像液は槽３から順次２
、１へと流れ、蒸溜装置Ｔを経てスプレーノズル６から
槽３へ循環するようになつている。本発明方法はこのよ
うな現像水洗装置を用い、・現像液には例えばクロロセ
ン有機溶剤を用い、水洗水には銅のエッチング作用のあ
る例えば硫酸アンモニウム、塩化銅、塩化鉄等の薬品類
を水に溶解した液を用いる。To explain the diagram, numerals 1, 2, and 3 are developer tanks; 4;
4', 5, 5', 6, 6' are developer spray nozzles, □
8 is a developer distillation device, 8 is a washing tank, 9 and 9' are spray nozzles thereof, and 10 is a dryer. The developer tank is an overflow type, and the developer is supplied sequentially from tank 3 to tank 2.
, 1, and circulates through the distillation device T from the spray nozzle 6 to the tank 3. The method of the present invention uses such a developing and rinsing device; ・For example, a chlorocene organic solvent is used as the developer, and chemicals that have a copper etching effect, such as ammonium sulfate, copper chloride, and iron chloride, are added to the water for the rinsing water. Use the dissolved solution.
そしてプリント配線板１１は矢印Ｐ方向に搬送され、現
像液のスプレーノズルＪ４、４’、５、５’、６、６’
の間を通り現像され、水洗用スプレーノズル９、９’に
より水洗される。この水洗では銅表面が前記薬品類によ
りソフトエッチングされるため、ドライフィルムの残渣
は除去される。なお水洗を終つたプリント配線板１１・
は乾燥器１０によつて乾燥され、さらにエッチング工
程を経て配線パターンが形成され完成品となるのである
。以上説明した本発明のプリント配線板の製造方法はド
ライフイルムの現像後の残渣をソフトエツチングするこ
とにより除去し、エツチング時の銅残りを防止してプリ
ント配線板の品質向上を可能としたものである。The printed wiring board 11 is then transported in the direction of arrow P, and the developer spray nozzles J4, 4', 5, 5', 6, 6'
The film is developed by passing through the film, and is washed with water by the washing spray nozzles 9, 9'. In this water washing, the copper surface is soft-etched by the chemicals, so the residue of the dry film is removed. The printed wiring board 11 after washing with water
is dried in a dryer 10, and then subjected to an etching process to form a wiring pattern, resulting in a finished product. The method of manufacturing a printed wiring board of the present invention as described above removes the residue after development of the dry film by soft etching, and prevents copper residue during etching, thereby making it possible to improve the quality of the printed wiring board. be.
図は本発明のプリント配線板の製造方法に用いるドライ
フイルム現像・水洗装置の概略説明図である。
１，２，３・・・・・・現像液槽、４，４′，５，５′
，６，６′・・・・・・現像液スプレイノズル、７・・
・・・・現像液蒸溜装置、８・・・・・・水洗槽、９，
９″・・・・・・水洗用スプレイノズル、１０・・・・
・・乾燥器、１１・・・・・・プリント配線板。The figure is a schematic explanatory diagram of a dry film developing/washing device used in the printed wiring board manufacturing method of the present invention. 1, 2, 3...Developer tank, 4, 4', 5, 5'
, 6, 6'... Developer spray nozzle, 7...
...Developer distillation device, 8...Washing tank, 9,
9″... Spray nozzle for washing, 10...
...Dryer, 11...Printed wiring board.
Claims (1)
上にホトマスクを密着して露光したのち、ドライフィル
ムを現像及び水洗し、次いでエッチングして配線パター
ンを形成するプリント配線板の製造方法において、ドラ
イフィルムの現像後の水洗は、銅をエッチングする薬品
を含む水溶液にてソフトエッチングすることを特徴とす
るプリント配線板の製造方法。1 Manufacture of a printed wiring board by applying a dry film to the surface of a copper-clad laminate, exposing it to light by closely applying a photomask, developing the dry film, washing with water, and then etching to form a wiring pattern. A method for manufacturing a printed wiring board, characterized in that washing the dry film with water after development is performed by performing soft etching with an aqueous solution containing a chemical that etches copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6757681A JPS5932911B2 (en) | 1981-05-07 | 1981-05-07 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6757681A JPS5932911B2 (en) | 1981-05-07 | 1981-05-07 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57183095A JPS57183095A (en) | 1982-11-11 |
| JPS5932911B2 true JPS5932911B2 (en) | 1984-08-11 |
Family
ID=13348895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6757681A Expired JPS5932911B2 (en) | 1981-05-07 | 1981-05-07 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5932911B2 (en) |
-
1981
- 1981-05-07 JP JP6757681A patent/JPS5932911B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57183095A (en) | 1982-11-11 |
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