JPS5932343U - Material bump detection device - Google Patents
Material bump detection deviceInfo
- Publication number
- JPS5932343U JPS5932343U JP12744682U JP12744682U JPS5932343U JP S5932343 U JPS5932343 U JP S5932343U JP 12744682 U JP12744682 U JP 12744682U JP 12744682 U JP12744682 U JP 12744682U JP S5932343 U JPS5932343 U JP S5932343U
- Authority
- JP
- Japan
- Prior art keywords
- detection device
- contact
- pressurized
- bump detection
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Machine Tool Sensing Apparatuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はこの考案の実施例、第2図は加圧導電ゴムの圧
力に対する抵抗の変化特性図を示す。
(図面の主要な部分を表わす符号の説明)、1・・・・
・・突当て、5・・・・・・第1の電極、7・・・・・
・第2の電極、9・・・・・・加圧導電ゴム。FIG. 1 shows an embodiment of this invention, and FIG. 2 shows a characteristic diagram of the change in resistance of the pressurized conductive rubber against pressure. (Explanation of symbols representing main parts of the drawing), 1...
...Abutting, 5...First electrode, 7...
- Second electrode, 9... Pressurized conductive rubber.
Claims (1)
に当接したことを検出する装置にして、加圧されると導
電状態となる加圧導電体を前記突当体に被加工物が当接
した時の加圧力を検知する如く設け、前記加圧導電体が
導電状態になったことを検出して出力する当接検出手段
を設けたことを特徴とする材料突当検出装置。The device detects when the workpiece has come into contact with the abutting body of the processing device, which serves as a reference for setting the machining position, and the pressurized conductor, which becomes conductive when pressurized, is attached to the abutment body. A material abutment detection device, characterized in that it is provided with a contact detection means that is provided to detect the pressing force when an object comes into contact with it, and that detects and outputs that the pressurizing conductor is in a conductive state. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12744682U JPS5932343U (en) | 1982-08-25 | 1982-08-25 | Material bump detection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12744682U JPS5932343U (en) | 1982-08-25 | 1982-08-25 | Material bump detection device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5932343U true JPS5932343U (en) | 1984-02-28 |
JPH0344440Y2 JPH0344440Y2 (en) | 1991-09-18 |
Family
ID=30289452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12744682U Granted JPS5932343U (en) | 1982-08-25 | 1982-08-25 | Material bump detection device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5932343U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0236335U (en) * | 1988-08-31 | 1990-03-09 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4932376U (en) * | 1972-06-26 | 1974-03-20 | ||
JPS5758256A (en) * | 1981-07-27 | 1982-04-07 | Sony Corp | Shutoff mechanism of reproducing device |
-
1982
- 1982-08-25 JP JP12744682U patent/JPS5932343U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4932376U (en) * | 1972-06-26 | 1974-03-20 | ||
JPS5758256A (en) * | 1981-07-27 | 1982-04-07 | Sony Corp | Shutoff mechanism of reproducing device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0236335U (en) * | 1988-08-31 | 1990-03-09 | ||
JPH0535715Y2 (en) * | 1988-08-31 | 1993-09-09 |
Also Published As
Publication number | Publication date |
---|---|
JPH0344440Y2 (en) | 1991-09-18 |
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