JPS593151B2 - Multi-nozzle head manufacturing method - Google Patents
Multi-nozzle head manufacturing methodInfo
- Publication number
- JPS593151B2 JPS593151B2 JP6706579A JP6706579A JPS593151B2 JP S593151 B2 JPS593151 B2 JP S593151B2 JP 6706579 A JP6706579 A JP 6706579A JP 6706579 A JP6706579 A JP 6706579A JP S593151 B2 JPS593151 B2 JP S593151B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- rod
- electroformed
- chips
- nozzle head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 238000005323 electroforming Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1625—Manufacturing processes electroforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Nozzles (AREA)
Description
【発明の詳細な説明】
本発明は、たとえばインクジェットプロッタに使用され
るマルチノズルヘッドの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a multi-nozzle head used, for example, in an inkjet plotter.
従来、たとえばその直径が３０μ前後の微細孔を形成す
る手段として、フォトエッチング、エレクトロフォーミ
ング、機械加工、レーザービーム、電子ビーム等が採用
されているが、いずれの加工方法も微細孔の真円度や円
筒度が低精度であり、多数を形成したときにはそれらの
同軸度も悪いと５ 言う欠点を有している。Conventionally, photo-etching, electroforming, machining, laser beams, electron beams, etc. have been used to form micro-holes with a diameter of around 30 μm, but all processing methods depend on the roundness of the micro-holes. It has the drawbacks of low accuracy in terms of cylindricity and cylindricity, and poor coaxiality when a large number of them are formed.
また、個々の製法によつて異なるが、イニシャルコスト
が高かつたり、工程が複雑であつたり、消耗品が高かつ
たりする種種の欠点を有する。本発明は、このような点
に鑑みなされたもので、１０孔径、真円度、円筒度、同
軸度が正確であり、これにより、個々の微細孔の液体の
噴射特性が一定であり、耐久性をも高めうるマルチノズ
ルヘッドを得ることができるマルチノズルヘッドの製造
方法を提供することを目的とする。In addition, although it differs depending on the individual manufacturing method, it has various drawbacks such as high initial cost, complicated process, and high cost of consumables. The present invention was made in view of these points, and the 10 hole diameter, roundness, cylindricity, and coaxiality are accurate, and as a result, the liquid jetting characteristics of each fine hole are constant, and the durability is improved. It is an object of the present invention to provide a method for manufacturing a multi-nozzle head that can obtain a multi-nozzle head that can also improve performance.
１５本発明の一実施例を図面とともに説明する。15 An embodiment of the present invention will be described with reference to the drawings.
まず、直径３０μの複数個の微細孔を得ようとするとき
には線径が３０μの線材１を準備する。この線材１の材
質は種々のものが用いられるが、たとえば、銅線が用い
られる。このような線材１を図ク０示しない電鋳用治具
に直線状に展張しつつ固定し、電鋳することによりその
線材１の周囲にかなり厚さの大きい電鋳層２を形成する
。このときの電鋳層にはスルファミン酸ニッケル浴、ワ
ット浴、ホウフッ化ニッケル浴、全塩化ニッケル浴等が
知らク５ れているが、本実施例においてはスルファミ
ン酸ニッケル浴を用いた。すなわち、スルファミン酸浴
組成としては、スルファミン酸ニッケル４００９／１１
、塩化ニッケル１０９／ｌ、ピット防止界面活性剤より
なるものであり処理条件としては９０４０〜６０℃の液
温で…は３．５〜４．５、２．５〜２０Ａ／ ｄ７７ｌ
″の電流密度が用いられて電鋳される。このようにして
中心に銅線よりなる線材１を含むニッケルによる電鋳層
２が形成された電鋳層３が得られる。この電鋳層３の仕
上がり状態において、’ｉ５線材１が必ずしも中心に位
置しているものとは限らないが、この線材１を中心とす
る外周面が必要とする寸法をはずれているときには前記
電鋳層３ク０−の両端面の前記線材１部分をセンターと
してスピンドル４をセツトし、旋削具５により外周加工
し、線材１が中心点に位置するように仕上げる。First, when attempting to obtain a plurality of micropores with a diameter of 30 μm, a wire 1 with a wire diameter of 30 μm is prepared. Although various materials can be used for the wire 1, for example, copper wire is used. Such a wire 1 is stretched and fixed in a straight line to an electroforming jig (not shown in the figure), and electroformed to form a considerably thick electroformed layer 2 around the wire 1. Although nickel sulfamate baths, Watt baths, nickel borofluoride baths, total nickel chloride baths, etc. are known for the electroformed layer at this time, in this example, a nickel sulfamate bath was used. That is, the sulfamic acid bath composition is nickel sulfamate 4009/11.
, 109/l of nickel chloride, and a pit-preventing surfactant.The processing conditions are 3.5-4.5, 2.5-20A/d77l at a liquid temperature of 9040-60℃.
'' is used for electroforming. In this way, an electroformed layer 3 is obtained in which an electroformed layer 2 of nickel containing a wire 1 made of a copper wire in the center is formed. This electroformed layer 3 In the finished state, the i5 wire 1 is not necessarily located at the center, but if the outer circumferential surface centered on the wire 1 is outside the required dimension, the electroformed layer 3 A spindle 4 is set with the wire rod 1 portions on both end faces of - as the center, and the outer periphery is machined using a turning tool 5 so that the wire rod 1 is positioned at the center point.
このときの外径は２ｊ！ｍとする。このようにして同心
加工を終了した電鋳棒３は切断刃６によりその厚さが０
．２７ｎのチツプ７にスライス加工される。The outer diameter at this time is 2j! Let it be m. The electroformed rod 3 that has been concentrically processed in this way has its thickness reduced to 0 by the cutting blade 6.
．． It is sliced into 27n chips 7.
そのため、一本の電鋳棒３からはきわめて多数のチツプ
７が形成される。このようなチツプ７はその一面に球状
凹部８が研摩により加工される。この球状凹部８はイッ
クジェットプロッタ用ヘツドとして使用する場合に必要
なものであり、このような使用をしないときには球状凹
部８を形成する必要はない。しかして、この球状凹部８
の曲率半径は０．７Ｒであり、線材１の残された部分の
厚さ寸法１は０．０３ｍ１である。このように線材１を
含むチツプ７が形成された後には、最終製品を形成する
ための工程の順序は下記のようにいずれかの順序が選択
的に採用される。まず、ステンレススチール板などによ
りヘツドプレートとなる平板状の補強板９が設けられる
が、この補強板９の一面には必要とするピツチをもつて
直径が２１１で深さが０．２１１！の凹部１０を複数個
形成する。Therefore, a very large number of chips 7 are formed from one electroformed rod 3. A spherical recess 8 is formed on one surface of the chip 7 by polishing. This spherical recess 8 is necessary when the head is used as a head for an instant jet plotter, and there is no need to form the spherical recess 8 when the head is not used in this manner. However, this spherical recess 8
The radius of curvature of is 0.7R, and the thickness dimension 1 of the remaining portion of the wire 1 is 0.03 m1. After the chip 7 including the wire rod 1 is formed in this manner, any one of the following orders of steps is selectively adopted for forming the final product. First, a flat reinforcing plate 9 made of a stainless steel plate or the like is provided as a head plate, and one side of this reinforcing plate 9 has the required pitch, a diameter of 211 mm and a depth of 0.211 mm! A plurality of recesses 10 are formed.
この凹部１０の中心にはそれぞれ貫通孔１１が形成され
ている。このような補強板９の前記凹部１０には前記球
状凹部８を内方にして前記チツプ７を嵌着し、接着ある
いは拡散接合により固着する。接着の場合にはエポキシ
樹脂系の接着剤の使用が望ましく、拡散接合の場合には
、電鋳層２がニツケルで補強板９がＳＵＳ３Ｏ４のと
．′き接合温度９５０℃、接合圧力７Ｋｇ／ＣＩＩＬ、
真空または不活性ガス中で接合時間は６０分間とする。
このようにしてチツプ７が固着された補強板９は、４０
〜５０℃のシアン化ナトリウム温溶液中に浸漬され、超
音波を併用することにより線材１ ′を溶解除去する。
これにより、線材１と同径で同形状の微細孔１２が形成
される。このようにして形成された微細孔１２はそれら
のピツチが凹部１０形成の機械加工の精度により定めら
れ、この加工精度を高めることにより精度維持が行なわ
れｉる。つぎに、他の工程順序について説明すると、補
強板９自体は前述のようにあらかじめ形成しておくもの
であるが、線材１を含むチツプ７を形成してから、その
チツプ７の段階で線材１を除去して微細孔１２を形成し
てしまう。A through hole 11 is formed at the center of each of the recesses 10 . The chip 7 is fitted into the recess 10 of such a reinforcing plate 9 with the spherical recess 8 facing inward, and fixed by adhesive or diffusion bonding. In the case of bonding, it is desirable to use an epoxy resin adhesive, and in the case of diffusion bonding, the electroformed layer 2 is made of nickel and the reinforcing plate 9 is made of SUS3O4.
．． 'Welding temperature: 950℃, welding pressure: 7Kg/CIIL,
The bonding time is 60 minutes in vacuum or inert gas.
The reinforcing plate 9 to which the chip 7 is fixed in this way has 40
The wire rod 1' is immersed in a hot sodium cyanide solution at ~50° C. and is dissolved and removed using ultrasonic waves.
As a result, micropores 12 having the same diameter and shape as the wire rod 1 are formed. The pitch of the fine holes 12 thus formed is determined by the accuracy of the machining process for forming the recess 10, and the accuracy is maintained by increasing the machining accuracy. Next, to explain the other process order, the reinforcing plate 9 itself is formed in advance as described above, but after forming the chip 7 including the wire rod 1, the wire rod 1 is formed at the stage of the chip 7. is removed to form micropores 12.
この線材１の除去手段は前述のように４０〜５０℃のシ
アン化ナトリウム温溶液中に浸漬させて超音波を併用す
ることにより行なわれる。このように微細孔１２が形成
されたチツプ７を凹部１０にそれぞれ嵌着して前述のよ
うに接着または拡散接合により固着する。こうして得ら
れたチツプ７が固着された補強板９は、マルチノズルヘ
ツドとして用いられ、インク供給部等に連結されてイッ
クジェットプロッタとして完成されるが、それぞれノズ
ルとなる微細孔１２の直径および形状は線材１と一致し
ているため、それらの孔径、真円度、円筒度、同軸度等
は均一で、各微細孔１２からのインク噴射特性は一致し
ている。本発明は、上述のように線材の周囲に電鋳層を
形成してからそれを切断してチツプを形成し、これらの
チツプを補強板に固着してから線材を除去することによ
り複数の微細孔を形成するか、チツプの状態で線材を除
去してから補強板に固着するかしたので、簡単な工程で
複数の微細孔を正確なピツチを持つヘツドプレートを形
成することができ、しかも、個々の微細孔は線材と一致
しているため、その孔径、真円度、円筒度が高精度であ
り、かつ、すべての微細孔について均一であり、これに
より、液体の噴射特性が一致しており、しかもチツプの
材質は電鋳層となるため、耐久性がきわめて高いものを
得ることができる等の効果を有するものである。The wire 1 is removed by immersing it in a hot sodium cyanide solution at 40 to 50 DEG C. and using ultrasonic waves as described above. The chips 7 in which the fine holes 12 have been formed are respectively fitted into the recesses 10 and fixed by adhesion or diffusion bonding as described above. The thus obtained reinforcing plate 9 to which the chips 7 are fixed is used as a multi-nozzle head and connected to an ink supply section etc. to complete the quick jet plotter. Since these correspond to the wire rod 1, their hole diameters, roundness, cylindricity, coaxiality, etc. are uniform, and the ink ejection characteristics from each fine hole 12 are the same. The present invention forms a plurality of fine particles by forming an electroformed layer around the wire as described above, cutting it to form chips, fixing these chips to a reinforcing plate, and then removing the wire. By forming the holes or by removing the wire in the chip state and then fixing it to the reinforcing plate, it is possible to form a head plate with multiple fine holes at an accurate pitch in a simple process. Since each micropore matches the wire, its diameter, roundness, and cylindricity are highly accurate and uniform for all micropores, which makes the liquid jetting characteristics consistent. Furthermore, since the material of the chip is an electroformed layer, it has the advantage of being extremely durable.
図面は本発明の一実施例を示すもので、第１図は電鋳棒
の側面図、第２図はその正面図、第３図はその外周加工
状態を示す側面図、第４図は電鋳棒切断状態の側面図、
第５図はチツプの斜視図、第６図はチツプの拡大断面図
、第７図は補強板の斜視図、第８図はチツプを固着した
補強板の拡大断面図、第９図は線材を除去した状態の拡
大断面図である。
１・・・・・・線材、２・・・・・・電鋳層、３・・・
・・・電鋳棒、７・・・・・・チツプ、９・・・・・・
補強板、１２・・・・・・微細孔。The drawings show one embodiment of the present invention, and FIG. 1 is a side view of an electroformed rod, FIG. 2 is a front view thereof, FIG. Side view of the cast rod in its cut state,
Figure 5 is a perspective view of the chip, Figure 6 is an enlarged sectional view of the chip, Figure 7 is a perspective view of the reinforcing plate, Figure 8 is an enlarged sectional view of the reinforcing plate to which the chip is fixed, and Figure 9 is an enlarged sectional view of the wire rod. FIG. 3 is an enlarged cross-sectional view of the removed state. 1...Wire rod, 2...Electroformed layer, 3...
... Electroformed rod, 7... Chip, 9...
Reinforcement plate, 12... fine holes.
Claims (1)
形成することにより中心に前記線材を含んだ電鋳棒を形
成し、この電鋳棒を前記線材と直交する方向に所定の厚
さに切断して複数個のチップを形成し、これらのチップ
を補強板に所定のピッチをもつて固定する工程または前
記チップの線材を除去する工程の順序を選択的に行なつ
て複数の微細孔を有するヘッドプレートを形成し、この
ヘッドプレートを用いてマルチノズルヘッドを形成する
ようにしたことを特徴とするマルチノズルヘッドの製造
方法。1. Electroforming a wire rod with the same diameter as the desired micropore diameter to form an electroformed layer forms an electroformed rod containing the wire rod in the center, and then inserts this electroformed rod in a direction perpendicular to the wire rod. The process of cutting to a predetermined thickness to form a plurality of chips, and fixing these chips to a reinforcing plate at a predetermined pitch, or the process of removing the wire rods of the chips, is selectively performed in the order. 1. A method for manufacturing a multi-nozzle head, comprising forming a head plate having a plurality of fine holes, and using this head plate to form a multi-nozzle head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6706579A JPS593151B2 (en) | 1979-05-30 | 1979-05-30 | Multi-nozzle head manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6706579A JPS593151B2 (en) | 1979-05-30 | 1979-05-30 | Multi-nozzle head manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55158982A JPS55158982A (en) | 1980-12-10 |
| JPS593151B2 true JPS593151B2 (en) | 1984-01-23 |
Family
ID=13334063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6706579A Expired JPS593151B2 (en) | 1979-05-30 | 1979-05-30 | Multi-nozzle head manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593151B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58108162A (en) * | 1981-12-23 | 1983-06-28 | Ricoh Co Ltd | Ink jet head |
| KR101153161B1 (en) * | 2005-04-01 | 2012-06-18 | 주성엔지니어링(주) | Gas injector and Apparatus including the same for fabricating Liquid Crystal Display Device |
-
1979
- 1979-05-30 JP JP6706579A patent/JPS593151B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55158982A (en) | 1980-12-10 |
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