JPS5931171A - Preparation of thermal head - Google Patents

Abstract

PURPOSE:To exclude the use of a conductive paste or the like, by a method wherein electroplating of a conductor is applied onto the film of a heat generating resistance body formed on the surface of an insulating substrate and, thereafter, etching is performed in such a state that the final conductive pattern and the film of the heat generating resistance body are left. CONSTITUTION:After a resistance film being a heat generating reistance body 3 comprising Ta2N or the like is formed on the surface of a substrate 1 comprising ceramics or the like by sputtering or the like, electroplating of a conductor such as Au or the like is applied to those surfaces. Subsequently, etching of Au and Ta2N is directly performed so as to leave final patterns such as electrodes 2, 4, 5 and the heat generating resistance body 3. In addition, after electroless plating of Au or the like is performed to the final conductive pattern, a diode array 7 and a connecting conductor 9 having an insulating film 9 are connected to obtain in a completed product. By this method, a high quality thermal head can be inexpensively prepared.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a thermal head used in a thermal printer, thermal facsimile, etc.

Such a thermal head generally consists of a plurality of heat generating resistors arranged in a straight line and a conductive pattern through which a current for heating is passed between the heat generating resistors, but the resistance value of the conductive pattern is If it is non-uniform, the value of the current passing through the heating resistor will not be uniform, and the amount of heat generated by the heating resistor will be non-uniform, resulting in uneven recording on thermal paper.

For this reason, in general ηI! The pattern is fully plated twice to reduce the resistance value of the conductive pattern as much as possible.The conventional method of manufacturing a thermal head is often as described below.

That is, a resistor B'Ak such as Ta*N (tantalum nitride) as a heating resistor is formed on the surface of a substrate having insulating properties and heat resistance such as ceramics by sputtering, and then primary electrolytic plating is applied. Au (gold) is applied to the surface of the resistive film by
The conductors shown in FIG. 1 were plated, and then the heating resistor was exposed through first etching, and a conductive pattern was formed, thereby obtaining the material shown in FIG.

In this case, 1 in Fig. 1 is the substrate, 2 (' is the individual electrode,
3 is a heating resistor, 4 is a common electrode, and 5 is a lead electrode.

After obtaining the one shown in Fig. 1, a resist film is formed on the surface of the heating resistor 3, and secondary electrolytic plating with Au or the like is performed on the 6-electrode 412, 4°5. , 4, and 5, and then the diode array mounting portion 6 is removed by second etching.
After obtaining what is shown in FIG. 2, as shown in FIG. 3, the connection of the diode array 7 is mounted and the common connection is made by the connection conductor 9 having the insulating film 8 on the end of the individual isotope 2, A matrix-like connection ttM is formed to create a completed product.

However, in the conventional method described above, electrolytic plating is performed twice, so in preparation for the second 1-hole plating,
In the first etching, the final conductive pattern shown in FIG. 2 cannot be obtained, and it is necessary to perform the etching twice. The current density decreases, the adhesion of Au etc. becomes uneven, and if the conductive patterns are independent, it is necessary to connect the conductive patterns with conductive paste, etc. 'l
, it dissolves into the solution and causes a static defect that negatively affects the plating condition.

The purpose of the present invention is to fundamentally eliminate such drawbacks of the conventional methods, and by skillfully combining electrolytic plating and electroless M plating, a final pattern can be formed in one etching process, and conductive The present invention provides an extremely effective method for manufacturing a thermal head that eliminates the use of paste or the like.

Hereinafter, the present invention will be explained in detail with reference to FIG. 2 and Part 3.

That is, first, as in the conventional case, a heat generating resistor 3 such as TamN is formed on the surface of a substrate 1 made of ceramic or the like by sputtering or the like. After the entire structure is formed, the surface thereof is electrolytically plated with a conductor such as Au.

Immediately, leaving the final conductive pattern of each electrode 2, 4, 5, etc. and the heating resistor 3, Au, J: and T, etc.
After performing N etching to obtain what is shown in Figure 2, the final conductive pattern was electrolessly plated with Au or the like, and the diode array 7 was connected to this as shown in Figure 3, and the I corner edge kA8f was formed. The connecting conductor 9 is then connected to form a completed product.

During electroless plating, the heating resistor 3 is coated with a resist film to completely prevent Au, etc. from adhering thereto.

Therefore, the final conductive pattern shown in FIG. 2 can be obtained by one etching process, and the A
The adhesion state of u, etc. becomes uniform, the resistance value deviation of the electrodes 2, 4, and 5, especially the hollow electrode 2, is reduced, the use of conductive paste, etc. is eliminated, and the process is shortened. In particular, high quality thermal heads can be manufactured at low cost.

However, the shape of each electric cedar 2゜4.5 etc. in Figures 1 to 3 is such that A>J = depending on the situation, and the material of the resistive film and the material of the conductor to be plated. The present invention can be modified in various ways, such as by determining it according to the dispute.

As is clear from the above description, according to the present invention, a thermal head of average quality can be manufactured at low cost, and remarkable effects can be obtained in manufacturing thermal heads for various uses.

[Brief explanation of the drawing]

1 to 3 are plan views showing the manufacturing process of the thermal head. 1...Substrate, 2...Individual F,', 3: Hayashi, 3.
... Heat generating resistor, 4... Common electrical connection, 5... - extraction electrode, 6 - diode array mounting part, 7 - am
・Diode array, 8・e・Insulating film, 9・・・・
Connecting conductor. Patent applicant: LF Co., Ltd. Mura Electric Manufacturing. Agent Yamakawa Masaiso 1 (1 person) Procedural amendment (self-control, indication of case 1982 Patent Application No. 141207 2, name of invention Method for manufacturing thermal head 3, person making amendment case) Relationship with Patent Applicant name (name)
(363) Tamura Electric Manufacturing Co., Ltd. - Amendment = The number of inventions will increase due to... (1) The scope of claims in the specification will be amended as shown in the attached sheet. (2) The word “conduct,” in line 15 of page 2 of the Ministry is amended as follows. ``After this, a protective film is formed on the surface of the heating resistor.'' (3) Add ``, 10 is a protective film'' next to ``pole'' in line 19 of the same page of the same book. (4) Delete [heating resistor...] on the 20th line of the same page of the same book to ``...once formed'' on the 1st line of the 3rd page. (5) "Electrolytic plating..." to 4th line of page 5 of the same book, line 2
Correct the line "combine" as shown below. "Adopts non-electronic w + silver plating" (6) [#i] on line 14 of the same page of the same hotel. -1 is corrected as follows. ``After patterning, form a protective film 10'' (8) ``After patterning, form a protective film 10'' (8) Ibid. "Heating resistor..." in the second line of page 5 to "...closed..." in the fourth line are corrected by 1 degree as follows: "The retention film 10 is an electrical insulator. Therefore, heating resistor 3
Au etc. tend to adhere to the surface. (9) In the same book, on the 7th line of the same page, ``tameno'' is amended to ``tame''. (lO) Add the following to the next line of line 16 on the same page. ``In the above, an example is shown in which electrolytic M plating is used for the initial formation of the conductor film, but the same effect may be applied to the formation of the conductor film using various means such as vacuum evaporation.'' (Old) Ibid. “Connection conductor” on page 6, line 8 “, 10
...Protective film 3. ” to join. (121 Figures 1 to 3 are corrected as shown in the attached sheet. up,
Manufacture of a thermal head characterized in that the final conductive pattern and the heating resistor are etched, and the final conductive pattern is electrolessly plated with the conductor, and then the final conductive pattern and parts are connected. Method. "that's all

Claims (1)

[Claims] After forming a resistive film as a heating resistor on the surface of an insulating substrate, electrolytically plating a conductor on the surface of the resistive film, and etching the final conductive pattern and the heating resistor, leaving the final conductive pattern and the heating resistor; A method for manufacturing a thermal head, characterized in that after electroless plating of the conductor is applied to the final conductive pattern, parts are connected to the final conductive pattern.