JPS5929498A - Device for mounting heat sink plate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Industrial applications The present invention relates to a device for attaching a heat sink to a printed circuit board.

Conventional structure and its problems Conventionally, an aluminum heat sink that cannot be soldered has been attached to a printed circuit board by integrally providing a plurality of mounting legs 2 on a heat sink 1, as shown in Fig. 1. Tapping screws 4 were screwed into the pilot holes of the legs 2 from the back side of the printed circuit board 3 for fixation. However, this method has disadvantages in that it uses a self-tapping screw, has poor workability, and is expensive.

Another conventional method is to attach a terminal fitting that can be soldered to a heat sink using self-tapping screws, insert this terminal fitting into a printed circuit board, and apply solder to the copper foil on the back side. However, in this case, although the object is different, tapping screws are still used, resulting in poor workability and high cost.

OBJECTS OF THE INVENTION An object of the present invention is to attach a heat sink to a printed circuit board easily, reliably, and inexpensively without using screws.

Structure of the Invention The present invention provides a mounting piece perpendicularly to an aluminum heat sink that cannot be soldered, and a mounting hole is provided in this mounting piece, while a terminal fitting that can be soldered is provided, and the heat sink, the terminal By providing a protrusion on one side of the metal fitting and a hole into which the protrusion fits into the other side, and fitting the protrusion into this hole, and inserting the terminal metal fitting into the mounting hole of one piece, the terminal metal fitting becomes more like a heat dissipation plate. The terminal fitting is attached to the heat sink in a pressure-contact manner, and the tip of the terminal fitting is soldered to the printed circuit board to attach the heat sink to the printed circuit board.

DESCRIPTION OF EMBODIMENTS One embodiment will be described below with reference to FIGS. 2 to 4. In FIG. 2, these are heat sinks made of aluminum, and a mounting piece 6 is integrally provided at the bottom end in a vertical direction. Further, this mounting piece 6 is provided with a small hole 7. In addition, 8 has a curved part made by applying solder (= drawing in the center with a terminal metal fitting that can be soldered), and a hole 10 into which a protrusion 9 provided on the side of the heat sink is fitted is provided in this curved part. , due to the above curved part,
When the tip of the terminal fitting 8 is inserted into the small hole 7 so that the protrusion 9 fits into the hole 10, the upper end of the terminal fitting 8 receives a force in the direction of the arrow in FIG. 3 and comes into pressure contact with the heat sink 5. There are several examples of heat dissipation plates 5. In this state, the tip of the terminal metal fitting 8 protruding from the back surface of the sushi piece 6 is inserted into the hole 12 of the printed circuit board 11 and soldered to the copper foil portion (not shown) on the back surface.

According to this configuration, by simply inserting the terminal fitting 8 into the pore 7 of the heat sink plate 5, the terminal fitting 8 can be damaged in some cases to the heat sink plate 5, making the work easier. In addition, it is cheaper than shoe pin screws, and together with workability, it is possible to reduce costs by a large amount. Furthermore, by providing a curved portion in the center of the terminal fitting 8, it is possible to ensure that the terminal fitting 8 is not damaged in some cases by the heat sink 6, and this curved portion also increases the distance between the upper end of the terminal fitting 8 and the heat sink 5. If possible, the work of inserting the terminal fitting 8 into the heat sink 6 can be done smoothly.

Further, in order to ensure that the terminal fitting 8 can be pushed forward by the heat sink 5, an angle may be provided on the tip side of the curved portion of the terminal fitting d, as shown in FIG. Further, in the embodiment, the terminal fitting 8 is provided with a hole and the heat sink plate 6 is provided with a protrusion, but this relationship may be reversed. In addition, in FIG. 2, 13 is a heat sink 6
The printed circuit board 11 is provided with a positioning hole 14 corresponding to the projection.

Effects of the Invention As described in 2, according to the present invention, when attaching a heat sink to a printed circuit board that cannot be soldered, the terminal fitting can be installed by simply inserting a soldering chair into the heat sink. It can be attached to a heat sink, improves workability, and can be constructed at low cost.

[Brief explanation of drawings]

Figure 1 is an exploded perspective view of a conventional heat sink mounting device;
FIG. 2 is an exploded perspective view of a heat sink mounting device according to an embodiment of the present invention, FIG. 3 is a sectional view showing the attached state, and FIG. 4 is a side view of a terminal fitting according to another embodiment of the present invention. . 5... Heat sink, 6... Mounting piece, 7...
... Hole, 8 ... Terminal fitting, 9 ... Protrusion, 10 ... Hole, 11 ... Printed circuit board, 12 ... Hole.

Claims (1)

[Claims] A mounting piece is provided in the vertical direction at the bottom end of the heat sink, which cannot be soldered, a mounting hole is provided in this mounting piece, a terminal fitting that can be soldered is provided, and either the heat sink or the terminal fitting is attached to The protrusion is provided with a hole on the other side into which the protrusion fits, and the terminal fitting is configured to be pressed against the heat sink when inserted into the hole J of the mounting piece, and the terminal fitting is pressed against the heat sink when inserted into the hole J of the mounting piece.
Insert the tip of the terminal fitting protruding from the back of the piece into the printed circuit board. A heat dissipation plate mounting device characterized in that a single solder is applied.