JPS5929208Y2 - Liquid level control device for liquid consumption tank - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a liquid level control device for liquid consumption such as an overflow tank in a plating apparatus.

In conventional plating equipment, there is an overflow tank for liquid consumption between the plating solution recovery tank, which serves as a supply tank where the liquid level is always kept constant, and the plating vehicle that performs plating on the workpiece. Examples include those that have a

In such a plating apparatus, in order to maintain the liquid level in the overflow tank almost constant, plating is transferred from the plating solution recovery tank to the overflow tank according to the consumption of the liquid in the overflow tank. A pump is used to supply the liquid, and the liquid level in the overflow tank is controlled by an electric circuit that uses a liquid level switch to control the morph that drives the pump. The flow rate of the pump was controlled by

For this reason, the conventional liquid level control device using one overflow tank is not only expensive, but also has the risk of malfunction, and is not preferable from the viewpoint of saving materials and saving energy.

Therefore, the present invention does not use a pump to supply liquid from the liquid supply tank to the liquid consumption volume, and the rated liquid level of the liquid consumption volume is lower than the liquid level of the liquid supply tank. A siphon pipe is provided so as to span the amount, and the potential energy of the liquid supply tank is used to supply the liquid in the liquid supply tank to the liquid consumption amount.

However, if a siphon pipe is simply installed, the liquid supply will continue until the liquid level of the liquid consumption becomes equal to the liquid level of the liquid supply tank, and the scale will not be able to obtain a constant head difference between the two, and the liquid consumption will increase. Since the rated liquid level cannot be obtained, the outlet of the siphon pipe on the liquid consumption side is placed in a cylinder with a float, and liquid supply and liquid supply are stopped according to fluctuations in the liquid consumption level. This is what I did.

Therefore, if the liquid consumption is large, the cylinder will descend greatly, increasing the head, and a large amount of liquid will be supplied automatically.On the other hand, if the liquid consumption is low, the cylinder will descend slightly. As a result, the head becomes smaller and the amount of liquid supplied decreases.

In other words, since the amount of liquid consumed can be automatically supplied, the liquid level of the amount of liquid consumed can be kept almost constant.
The rated liquid level is maintained.

Furthermore, the liquid consumption does not flow back into the liquid supply tank, and the liquid consumption does not overflow due to excessive liquid supply.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In FIG. 1, 1 is a plating solution recovery tank, which is a supply tank; 2 is a plating solution recovery tank;
is the fluid consumption for a vehicle with one overflow tank and three fittings.

4 is a ball tap, which operates to keep the liquid level 5 of the plating solution recovery tank 1 constant at all times.

Reference numeral 6 denotes a siphon pipe, which is installed across the plating solution recovery tank 1 and the overflow tank 2, and has an outlet extending toward the overflow tank 2, as shown in an enlarged view in Figure 2. 7 is housed in a cylindrical body 8 that is open at the top, and a float 10 that moves up and down in response to fluctuations in the liquid level 9 in the overflow tank 2 is attached to the bottom of this cylindrical body 8. The bottom of the cylinder 8 is closed by a float 10.

11 is a work to be plated; 12 is a pump for pumping the plating tank from the overflow tank 2 to the plating vehicle type 3; 1;
3 is a filter.

In the plating device configured as described above, the liquid level 5 of the plating solution recovery tank 1 is always kept constant by the operation of the ball tap 4.

The liquid level 9 of the overflow tank 2 is designed to always be lower than the liquid level 5, but the liquid level 9
remains in this lower state and may temporarily fluctuate depending on the relationship between the pump 12 and the pump 12 pumping the liquid to the plating vehicle type.

The liquid level 9 in FIGS. 1 and 2 shows a state where it is temporarily lower than the rated liquid level, and there is a head difference of only H from the liquid level 5 of the plating solution recovery tank 1. The siphon 6 is shown filled with plating solution.

In this state, the plating solution in the plating solution recovery tank 1 reaches the outlet 7 of the siphon pipe 6, rises inside the cylinder 8, and overflows from the upper end 14 of the cylinder 8, resulting in an overflow. Since the liquid flows into one tank 2, the liquid level 9 of the tank 2 rises, and as the liquid level 9 rises, the float 10 also rises, so the cylindrical body 8 that is integral with the float 10 also rises.

Here, the head seen from the siphon pipe 6 is the plating solution recovery tank 1.
Since atmospheric pressure is acting on the liquid level 5 and the upper end 14 of the cylinder 8, the difference in height between the liquid level 5 and the upper end 14 is
Until this height difference becomes zero, that is, the upper end 1
Plating solution recovery tank 1 until Plating solution recovery tank 4 becomes the same level as the
The supply of liquid to the overflow tank 2 continues, and when the upper end 14 reaches the same level as the liquid level 5, the supply of liquid is stopped.

It is designed so that the position of the liquid level 9 when this liquid supply is stopped becomes the rated liquid level.

In addition, apart from this, the upper surface of the float 10 just comes into contact with the lower end surface of the outlet part 7 of the siphon pipe 6, and the outlet part 7
If the plating solution is designed so that it does not flow into the cylinder 8, the liquid level 9 at the time of contact will more reliably be maintained at the rated liquid level.

When the plating liquid in the overflow tank 2 is consumed after reaching the rated liquid level in this way, the liquid level 9 falls, so the float 10 descends and at the same time the cylinder 8 also descends by that amount. Therefore, a head difference is created between the liquid level 5 and the upper end 14, and as described above, the liquid is supplied from the plating liquid recovery tank 1 to the overflow tank 2 through the siphon pipe 6, and the supplied liquid is This is continued until the above amount becomes zero or until the lower end surface of the outlet portion 7 is closed by the cylinder 8.

In this way, when the plating liquid in the overflow tank 2 is consumed, the consumed amount is automatically supplied, and the liquid level 9 is maintained at the rated liquid level.

Figure 3 shows the structure of the cylindrical body 8 and the float 10 when the head difference H between the liquid level 5 of the plating solution recovery tank 1 and the liquid level 9 of the overflow tank 2 is small. Since it is the same as that explained in FIG. 1 and FIG. 2 in terms of effect and effect, detailed explanation will be omitted.

Therefore, the liquid level control device for the liquid consumption tank of the present invention does not use a pump to supply liquid from the liquid supply tank to the liquid consumption tank.
The rated liquid level of the liquid consumption tank is lower than the liquid level of the liquid supply tank, and a siphon pipe is installed to span the liquid supply tank and the liquid consumption tank, and the potential energy of the liquid supply tank is used to reduce the liquid in the liquid supply tank. Since the liquid is supplied to the liquid consumption tank, the equipment cost and operating cost for the liquid supply means are significantly reduced, and the outlet of the siphon pipe on the liquid consumption side is connected to a cylinder with a float. put in,
Since the system automatically supplies and stops the liquid supply according to fluctuations in the liquid level in the liquid consumption tank, it has a simpler structure than conventional electric circuit-based liquid level control.
The effects of the present invention, such as the fact that there is no fear of malfunction, are extremely impressive.

[Brief explanation of drawings]

Fig. 1 is a longitudinal sectional front view of the first embodiment of the present invention, Fig. 2 is an enlarged longitudinal sectional front view showing the siphon tube and its vicinity in Fig. 1, and Fig. 3 corresponds to Fig. 2. FIG. 2 is a longitudinal sectional front view of the second embodiment of the present invention; 1... Plating solution recovery tank (liquid supply tank), 2...
...1 overflow tank (liquid consumption tank), 3...Plating car model, 4...Ball tap, 5...
・Liquid level, 6... Siphon tube, 7... Outlet section, 8... Cylinder body, 9... Liquid level, 10
······float.

Claims (1)

[Scope of utility model registration request] In a device for supplying liquid from a liquid supply tank whose liquid level is kept constant to a liquid consumption volume having a liquid level below the liquid level, straddling the liquid supply tank and the liquid consumption volume. The upper part has a siphon pipe provided therein, and has a float provided at the outlet part of the siphon pipe extending toward the liquid consumption side so as to move up and down according to fluctuations in the liquid level of the liquid consumption. A liquid level control device for liquid consumption, characterized by comprising an open cylinder.